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XC7A15T-2CSG325C

Xilinx

XC7A15T-2CSG325C by Xilinx

Xilinx XC7A15T-2CSG325C is a FPGA with 16640 logic cells, 1300 CLBs, and max clock freq of 1286 MHz. Ideal for applications requiring high-speed processing like telecommunications, automotive systems, and industrial automation due to its low profile grid array package style.

Median Price

$66.370

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Farnell

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DigiKey

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Newark

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Element14

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 565 parts In-Stock

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Ampacity Inc.

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Semicontronic

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Corphita

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Vigor

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Continental Prestige Electronics

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Corohmni

South Africa . 35 parts In-Stock

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Modulus Dynamics

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Advanced Electronics

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Texas Native Microelectronics

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Kenton Components

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Lucentia Tech

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Overview

Experience the cutting-edge technology of the Xilinx XC7A15T-2CSG325C Field Programmable Gate Array (FPGA) and unlock a world of possibilities. Crafted by industry leader Xilinx, this FPGA boasts 16640 logic cells and 1300 CLBs, delivering unparalleled performance for a wide range of applications. With a maximum clock frequency of 1286 MHz and a low profile grid array package style, this FPGA offers unmatched versatility and efficiency. Embrace innovation with the XC7A15T-2CSG325C and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 16640

Offers a high level of programmability and flexibility for complex designs.

Surface Mount: YES

Facilitates easy and efficient integration into circuit boards.

Maximum Supply Voltage: 1.05 V

Provides compatibility with standard voltage levels in electronic systems.

No. of CLBs: 1300

Allows for a large number of configurable logic blocks for designing diverse functions.

No. of Inputs: 250

Offers ample input options for connecting to external devices or signals.

Package Shape: SQUARE

Enables efficient use of space on a circuit board.

Form Of Terminal: BALL

Facilitates reliable connections in a grid array package style.

No. of Terminals: 325

Provides multiple connection points for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for customization and reconfiguration of logic functions for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables high-density mounting and efficient signal routing.

Minimum Supply Voltage: 0.95 V

Supports low-power operation and energy efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliable performance under elevated temperature conditions.

Pitch Of Terminal: 0.8 mm

Allows for precise placement and alignment of the terminals on the grid array package.

Maximum Combinatorial Delay of a CLB: 1.05 ns

Ensures fast signal processing and minimal latency in logic operations.

Organization: 1300 CLBS

Provides a structured layout of logic blocks for efficient design implementation.

Minimum Operating Temperature: 0 °C

Supports reliable operation even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Ensures high conductivity and corrosion resistance for the terminal connections.

Position Of Terminal: BOTTOM

Simplifies the assembly process and routing of signals on the circuit board.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection required during storage and handling to prevent moisture damage.

Maximum Seated Height: 1.5 mm

Provides a low-profile form factor for space-constrained applications.

Width: 15 mm

Offers a compact size for easy integration and placement on a circuit board.

Maximum Clock Frequency: 1286 MHz

Supports high-speed operation for demanding real-time applications.

No. of Outputs: 250

Provides multiple output channels for driving external devices or circuits.

Maximum Time At Peak Reflow Temperature (s): 30

Specifies the duration for solder reflow process during assembly.

Peak Reflow Temperature °C: 260

Indicates the temperature required for proper soldering of the FPGA during manufacturing.

Length: 15 mm

Contributes to the overall compact footprint of the FPGA for space efficiency in designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A15T-2CSG325C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

16640

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

1300

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Organization:

1300 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Trade Compliance

XC7A15T-2CSG325C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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