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10M02SCU169C8G

Intel

10M02SCU169C8G by Intel

The Intel 10M02SCU169C8G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance programmable ICs in a compact square package with ball terminals.

Median Price

$10.030

Lifecycle Status

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Arrow

USA . 352 parts In-Stock

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DigiKey

USA . 93 parts In-Stock

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Verical

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Nova Conductors

Japan . 66 parts In-Stock

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Digiode

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Schukat

Germany . 153 parts In-Stock

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Component Sense

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J2 Sourcing AB

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Cyclops Electronics Ltd

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Chip Stock

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Vyrian

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Rebound Electronics

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Velocity Electronics

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Flip Electronics

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Sensible Micro Corp

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Bristol Electronics

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Atlantic Semiconductor

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Touchstone Systems

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Corohmni

South Africa . 229 parts In-Stock

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Vigor

Singapore . 412 parts In-Stock

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$7.110

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Advanced Electronics

New Zealand . 95 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,926 parts In-Stock

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Ampacity Inc.

Singapore . 665 parts In-Stock

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Semicontronic

India . 601 parts In-Stock

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Corphita

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Microchip USA

USA . 406 parts In-Stock

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MARBEL Systems

Belgium . 500 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 978 parts In-Stock

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Qasali Group International

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S.R.D Solutions

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Lixinc

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Infinite Electronics LLP (Excess)

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RC Electronics

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Argo Parts USA

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Authorized Procurement Solutions

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Perfect Parts

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GreenTree Electronics

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Lucentia Tech

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Kepictronics

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Supply Digital

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A-Z Elektronik GmbH

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Futuretech Components

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Formix International (Excess)

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Overview

Experience the power of Intel with the 10M02SCU169C8G Field Programmable Gate Array! With a focus on quality and innovation, Intel is a trusted manufacturer in the tech industry. This FPGA offers endless possibilities for your applications, allowing for customization and flexibility like never before. Unlock the potential of your projects with 2000 logic cells and 125 CLBs, all in a convenient square package shape. Embrace the value and benefits of this product today and take your creations to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for portable or rugged applications.

No. of Logic Cells: 2000

Having 2000 logic cells allows for complex logic functions to be implemented, making the FPGA suitable for advanced applications.

Surface Mount: YES

Being surface mountable simplifies the assembly process and allows for a compact design, saving space on the circuit board.

Maximum Supply Voltage: 3.15 V

A higher maximum supply voltage tolerance provides flexibility in power supply options and ensures stability during operation.

No. of CLBs: 125

With 125 configurable logic blocks, the FPGA offers a good balance between flexibility and resource utilization for various designs.

No. of Inputs: 246

Having a large number of inputs allows for extensive connectivity and input options, enabling complex functions and data processing.

Package Shape: SQUARE

The square package shape facilitates a more uniform and efficient layout on the circuit board, optimizing space utilization.

Form Of Terminal: BALL

Ball terminals provide a reliable and secure connection, ensuring good electrical contact and ease of integration into the system.

Nominal Supply Voltage (V): 3

The nominal supply voltage of 3V matches common power supply standards, making it compatible with existing systems and components.

No. of Terminals: 169

Having 169 terminals allows for sufficient connections and interfaces, supporting versatile usage scenarios and system integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array enables customization and reconfiguration of logic functions, making it adaptable to changing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers good thermal dissipation and mechanical stability, ensuring reliable performance in various environments.

Minimum Supply Voltage: 2.85 V

A lower minimum supply voltage requirement allows for energy-efficient operation and compatibility with low-power systems or battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature tolerance, the FPGA can withstand demanding temperature conditions and extended use.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals enables high-density packaging and compact design, offering flexibility in board layout and space-saving benefits.

Organization: 125 CLBS

The organization of 125 configurable logic blocks ensures efficient resource allocation and logical structuring for complex designs.

Minimum Operating Temperature: 0 °C

The FPGA can operate smoothly in low-temperature environments, making it suitable for a wide range of applications and use cases.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easier installation and maintenance, simplifying the integration process in the system.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the FPGA is more resistant to moisture-related issues, ensuring reliable performance in humid conditions.

Maximum Seated Height: 1.55 mm

The low maximum seated height allows for a slim and compact profile, contributing to space-efficient designs and overall system miniaturization.

Width: 11 mm

Having a width of 11 mm provides a balance between compactness and accessibility, allowing for easy integration into various system configurations.

No. of Outputs: 246

The high number of outputs enables versatile signal routing and output options, supporting diverse functionalities and signal processing capabilities.

Length: 11 mm

The compact length of 11 mm contributes to a space-saving design and allows for flexible placement on the circuit board, optimizing layout options.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M02SCU169C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

2000

No. of Inputs:

246

No. of Outputs:

246

No. of CLBs:

125

Organization:

125 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA169,13X13,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

169

Standards

JESD-30 Code:

S-PBGA-B169

Trade Compliance

10M02SCU169C8G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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