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10M04DCU324I7G

Intel

10M04DCU324I7G by Intel

Intel's 10M04DCU324I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with 0.8mm terminal pitch.

Median Price

$25.720

Lifecycle Status

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7

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1k+

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Mouser Electronics

USA . 149 parts In-Stock

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$25.720

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$20.580

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Nova Conductors

Japan . 150 parts In-Stock

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Digiode

USA . 935 parts In-Stock

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VNN

France . 18,540 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

UK . 2,083 parts In-Stock

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Chip Stock

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AZTECH Wire

Italy . 355 parts In-Stock

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$6.930

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Vigor

Singapore . 247 parts In-Stock

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$13.748

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Corohmni

South Africa . 186 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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$18.380

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$17.645

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Continental Prestige Electronics

USA . 451 parts In-Stock

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$18.755

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Microchip USA

USA . 2,654 parts In-Stock

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$19.260

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$17.760

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Ampacity Inc.

Singapore . 217 parts In-Stock

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$19.860

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Semicontronic

India . 217 parts In-Stock

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One Stop Electronics

USA . 108 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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MARBEL Systems

Belgium . 12,483 parts In-Stock

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Texas Native Microelectronics

USA . 1,642 parts In-Stock

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Kenton Components

USA . 499 parts In-Stock

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Qasali Group International

UK . 500 parts In-Stock

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Modulus Dynamics

Lithuania . 1,185 parts In-Stock

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Lixinc

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Argo Parts USA

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Supply Digital

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A-Z Elektronik GmbH

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Futuretech Components

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Lucentia Tech

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Overview

Unleash the power of innovation with the 10M04DCU324I7G by Intel. This Field Programmable Gate Array (FPGA) boasts quality and reliability that only a manufacturer like Intel can deliver. With endless possibilities for customization and programming, this FPGA is perfect for a wide range of applications where flexibility and performance are key. Experience the value and benefits of this cutting-edge technology, tailored to meet your unique needs and propel your projects to new heights. Elevate your designs with the 10M04DCU324I7G and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA, ensuring longevity and reliability.

No. of Logic Cells: 4000

Offers high capacity for implementing complex logic functions, making it suitable for a wide range of applications.

Surface Mount: YES

Enables easy integration onto printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.25 V

Efficient power consumption and compatibility with low-voltage systems.

No. of CLBs: 250

Provides a balance between logic capacity and flexibility for various design requirements.

No. of Inputs: 246

Offers ample input channels for interfacing with external components and sensors.

Package Shape: SQUARE

Facilitates easier PCB layout and routing, optimizing space utilization.

Form Of Terminal: BALL

Enhances connectivity and reliability during soldering processes.

Nominal Supply Voltage (V): 1.2

Suitable for stable and efficient operation within the specified voltage range.

Power Supplies (V): 1.2

Consistent power delivery for reliable performance.

No. of Terminals: 324

Sufficient terminals for versatile I/O connectivity and signal routing.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Flexibility to customize the logic functions based on specific application requirements.

Package Style (Meter): GRID ARRAY

Ensures efficient heat dissipation and signal integrity in a compact form factor.

Minimum Supply Voltage: 1.15 V

Allows for operation at lower voltages for power efficiency.

Maximum Operating Temperature: 100 °C

Suitable for industrial environments with high temperature variations.

Pitch Of Terminal: 0.8 mm

Provides fine pitch for high-density mounting and routing on PCBs.

Organization: 250 CLBS

Structured layout for efficient logic implementation and signal flow.

Minimum Operating Temperature: -40 °C

Designed to withstand extreme cold environments without impacting performance.

Position Of Terminal: BOTTOM

Facilitates easy access and soldering during PCB assembly processes.

Moisture Sensitivity Level (MSL): 3

Suitable for standard handling and storage conditions without moisture-induced damage.

Maximum Seated Height: 1.55 mm

Low profile design for compact PCB assemblies.

Width: 15 mm

Compact form factor for space-constrained applications.

No. of Outputs: 246

Sufficient output channels for driving external devices and interfacing with peripherals.

Length: 15 mm

Balanced dimensions for PCB layout and mechanical compatibility.

Grading Of Temperature: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges for rugged applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M04DCU324I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

4000

No. of Inputs:

246

No. of Outputs:

246

No. of CLBs:

250

Sub-Category:

Field Programmable Gate Arrays

Organization:

250 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

Qualified:

No

Trade Compliance

10M04DCU324I7G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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