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EP3C25F324C8NES

Intel

EP3C25F324C8NES by Intel

EP3C25F324C8NES by Intel is a FPGA with 24624 CLBs, operating at max frequency of 472.5 MHz. It has a package style of GRID ARRAY and can handle temperatures from 0 to 85 °C. Ideal for applications requiring high-speed processing and programmable logic in compact form factor.

Median Price

$134.750

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Forefront Electronics and Design

USA . 1 parts In-Stock

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$134.750

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Vyrian

USA . 1,349 parts In-Stock

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Chip Stock

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Digiode

USA . 729 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,477 parts In-Stock

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$7.000

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Semicontronic

India . 400 parts In-Stock

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$9.000

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$8.775

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$8.730

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$9.000

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$8.730

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AZTECH Wire

Italy . 313 parts In-Stock

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$15.062

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One Stop Electronics

USA . 1,605 parts In-Stock

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$21.000

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Corohmni

South Africa . 210 parts In-Stock

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$100.035

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$111.686

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$106.102

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$106.102

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Kenton Components

USA . 375 parts In-Stock

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$124.205

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$109.300

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Modulus Dynamics

Lithuania . 160 parts In-Stock

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$133.714

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$133.714

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$133.714

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Texas Native Microelectronics

USA . 5,108 parts In-Stock

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$185.407

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$163.158

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Microchip USA

USA . 2,636 parts In-Stock

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$204.583

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Authorized Procurement Solutions

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MARBEL Systems

Belgium . 1,782 parts In-Stock

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Argo Parts USA

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Corphita

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Lucentia Tech

USA . 900 parts In-Stock

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$0.232

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Continental Prestige Electronics

USA . 396 parts In-Stock

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Supply Digital

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Qasali Group International

UK . 100 parts In-Stock

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$268.282

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$245.926

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$245.926

Bastille Electronics

Australia . 17 parts In-Stock

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Perfect Parts

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Overview

Experience the next level of innovation with the Intel EP3C25F324C8NES Field Programmable Gate Array. Manufactured by industry leader Intel, this FPGA boasts unmatched quality and reliability. With a multitude of applications in various industries, this product offers unparalleled value and benefits to customers seeking advanced programmable IC solutions. Unlock endless possibilities and streamline your projects with the EP3C25F324C8NES from Intel.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Surface Mount: YES

Ease of installation and space-saving design.

Maximum Supply Voltage: 1.25 V

Efficient power consumption and protection against overvoltage.

No. of CLBs: 24624

High number of Configurable Logic Blocks for complex programmable functions.

Nominal Supply Voltage (V): 1.2

Stable operating voltage for reliable performance.

No. of Terminals: 324

Sufficient number of terminals for connectivity and flexibility.

Minimum Operating Temperature: 0 °C

Wide temperature range for versatile applications.

Maximum Clock Frequency: 472.5 MHz

High-speed processing capabilities for demanding tasks.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3C25F324C8NES attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

24624

Maximum Clock Frequency:

472.5 MHz

Organization:

24624 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

2.2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

324

Standards

JESD-30 Code:

R-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP3C25F324C8NES Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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