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EP3C5F256C8N

Intel

EP3C5F256C8N by Intel

EP3C5F256C8N by Intel is a CMOS FPGA with 5136 logic cells, 182 inputs/outputs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities, such as telecommunications equipment and industrial automation systems.

Median Price

$56.765

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Arrow

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DigiKey

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Digiode

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Nova Conductors

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IBS Electronics

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Voyager Components

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Cyclops Electronics Ltd

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Vyrian

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Chip Stock

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ComSIT Distribution GmbH

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Inventory MP

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Flip Electronics

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AZTECH Wire

Italy . 214 parts In-Stock

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Continental Prestige Electronics

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Ampacity Inc.

Singapore . 154 parts In-Stock

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Corphita

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Netroflash

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Microchip USA

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Advanced Electronics

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Semicontronic

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MARBEL Systems

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Texas Native Microelectronics

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Modulus Dynamics

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Kenton Components

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Corohmni

South Africa . 1,108 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

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Supply Digital

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Futuretech Components

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GreenTree Electronics

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Pacific Micro-Tech

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Lucentia Tech

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Formix International (Excess)

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Speed Components Ltd (Excess)

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Overview

Enhance your project with the EP3C5F256C8N FPGA by Intel, designed to deliver top-notch performance and reliability. Intel is a trusted name in the industry, known for quality and innovation. This FPGA is ideal for a wide range of applications, offering flexibility and versatility. Unlock endless possibilities with 5136 logic cells and 182 inputs, enabling you to create customized solutions tailored to your specific needs. With a maximum clock frequency of 472.5 MHz, this FPGA guarantees speedy and efficient operations. Trust Intel's EP3C5F256C8N to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the FPGA lightweight and cost-effective.

No. of Logic Cells: 5136

With 5136 logic cells, this FPGA offers high level of programmability and flexibility for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the FPGA on PCBs.

Maximum Supply Voltage: 1.25 V

Operating with a maximum supply voltage of 1.25V, this FPGA is energy-efficient.

No. of CLBs: 5136

The FPGA with 5136 Configurable Logic Blocks (CLBs) provides ample resources for complex logic operations.

Technology Used: CMOS

CMOS technology ensures low power consumption and high speed performance in the FPGA.

No. of Inputs: 182

Having 182 inputs allows for the FPGA to handle a large number of input signals from external sources.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate the FPGA into different PCB layouts.

Form Of Terminal: BALL

The use of ball terminals simplifies the soldering process during FPGA installation.

Nominal Supply Voltage (V): 1.2

Operating at a nominal supply voltage of 1.2V ensures stable and efficient performance of the FPGA.

No. of Terminals: 256

With 256 terminals, this FPGA offers sufficient connectivity options for various external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA can be reconfigured for different tasks as needed.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The low profile grid array package style helps in saving space on the PCB and reduces overall system height.

Minimum Supply Voltage: 1.15 V

Operating with a minimum supply voltage of 1.15V ensures reliable functionality even at lower power levels.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand high temperature environments.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for easy connection and soldering of the FPGA on the PCB.

Organization: 5136 CLBS

The organizational structure of 5136 CLBs provides a high degree of flexibility and scalability in logic design.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can function effectively in cold environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper finishing on terminals ensures strong and reliable connections.

Position Of Terminal: BOTTOM

Terminal positioning at the bottom of the package allows for easy access and connection on the PCB.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this FPGA can withstand moderate exposure to moisture during storage and handling.

Maximum Seated Height: 1.55 mm

The low maximum seated height of 1.55mm helps in reducing the overall profile of the FPGA on the PCB.

Width: 17 mm

With a width of 17mm, this FPGA can be easily accommodated in standard PCB layouts.

Maximum Clock Frequency: 472.5 MHz

Capable of handling a maximum clock frequency of 472.5MHz, this FPGA delivers high-speed performance for time-critical applications.

No. of Outputs: 182

Having 182 output channels allows the FPGA to drive multiple external components efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this FPGA ensures proper soldering and reliability during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables secure solder joints and robust connections for the FPGA.

Length: 17 mm

With a length of 17mm, this FPGA has a compact form factor suitable for various space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3C5F256C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

5136

No. of Inputs:

182

No. of Outputs:

182

No. of CLBs:

5136

Maximum Clock Frequency:

472.5 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5136 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

R-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP3C5F256C8N Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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