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XC7A15T-1CSG324I

Xilinx

XC7A15T-1CSG324I by Xilinx

The Xilinx XC7A15T-1CSG324I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex digital designs. With a package style of grid array and low profile, it offers versatility in various electronic systems.

Median Price

$70.120

Lifecycle Status

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11

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Farnell

UK . 653 parts In-Stock

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$41.590

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Element14

Singapore . 428 parts In-Stock

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Mouser Electronics

USA . 5 parts In-Stock

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$73.570

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Digiode

USA . 257 parts In-Stock

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$39.510

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VNN

France . 73 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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Cyclops Electronics Ltd

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Bristol Electronics

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Avant Electronics Limited

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Aztec Data Supply Inc.

USA . 1,853 parts In-Stock

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$23.050

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MARBEL Systems

Belgium . 58 parts In-Stock

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$23.610

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Texas Native Microelectronics

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$23.881

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Kenton Components

USA . 50 parts In-Stock

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$32.566

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$28.658

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Ampacity Inc.

Singapore . 40 parts In-Stock

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$35.350

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Corphita

USA . 327 parts In-Stock

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Vigor

Singapore . 395 parts In-Stock

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$40.180

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Continental Prestige Electronics

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$47.009

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$44.659

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Modulus Dynamics

Lithuania . 621 parts In-Stock

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$66.226

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Corohmni

South Africa . 33 parts In-Stock

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Qasali Group International

UK . 17,457 parts In-Stock

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$73.273

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$64.480

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Semicontronic

India . 385 parts In-Stock

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$76.940

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Authorized Procurement Solutions

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Argo Parts USA

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Supply Digital

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Overview

Experience the power of Xilinx with the XC7A15T-1CSG324I Field Programmable Gate Array. As a leading manufacturer in FPGA technology, Xilinx delivers top-quality products that are versatile and reliable. This FPGA boasts 16640 logic cells, 1300 CLBs, and 250 inputs/outputs, making it ideal for a wide range of applications. With a maximum clock frequency of 1098 MHz and a low profile grid array package style, the XC7A15T-1CSG324I offers unmatched performance and flexibility for your projects. Unlock endless possibilities with this innovative solution from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability of the FPGA.

No. of Logic Cells: 16640

With a high number of logic cells, this FPGA provides ample resources for complex designs and processing.

Surface Mount: YES

The surface mount feature makes it easy to integrate this FPGA onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05V, this FPGA offers energy efficiency and low power consumption.

No. of CLBs: 1300

The 1300 Configurable Logic Blocks provide flexibility and customization for various applications.

No. of Inputs: 250

With 250 inputs, this FPGA can handle a wide range of input signals and data streams.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it suitable for compact designs.

Form Of Terminal: BALL

The use of ball terminals ensures easy soldering and secure connection during assembly.

No. of Terminals: 324

With 324 terminals, this FPGA offers ample connectivity options for peripherals and external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC offers flexibility for reprogramming and adapting to changing requirements.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A15T-1CSG324I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

16640

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

1300

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

1300 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Trade Compliance

XC7A15T-1CSG324I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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