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XC7A35T-1FTG256I

Xilinx

XC7A35T-1FTG256I by Xilinx

Xilinx XC7A35T-1FTG256I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact form factor. Operates b/w -40 to 100 °C with low profile grid array package style.

Median Price

$64.420

Lifecycle Status

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Farnell

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Mouser Electronics

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Element14

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Digiode

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AZTECH Wire

Italy . 223 parts In-Stock

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Ampacity Inc.

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Semicontronic

India . 73 parts In-Stock

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Corphita

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Vigor

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Continental Prestige Electronics

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MARBEL Systems

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Texas Native Microelectronics

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Microchip USA

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Kenton Components

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Advanced Electronics

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 1,030 parts In-Stock

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Qasali Group International

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Corohmni

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Netroflash

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Giza Technologies, Inc.

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Overview

Unlock the power of cutting-edge technology with the Xilinx XC7A35T-1FTG256I Field Programmable Gate Array (FPGA). Manufactured by the industry leader, Xilinx, this FPGA offers unmatched quality and reliability. With 2600 CLBs and 33280 logic cells, this FPGA is perfect for a wide range of applications. From aerospace to telecommunications, the possibilities are endless. Experience faster processing speeds, lower power consumption, and increased flexibility with the XC7A35T-1FTG256I. Stay ahead of the competition and revolutionize your projects with this versatile FPGA from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 33280

Offers a high level of logic capacity for complex design implementations.

Surface Mount: YES

Allows for easy and secure mounting onto circuit boards.

Maximum Supply Voltage: 1.05 V

Operates at a low maximum supply voltage, making it energy efficient.

No. of CLBs: 2600

Contains a large number of Configurable Logic Blocks for versatile programming options.

No. of Inputs: 250

Provides multiple input options for data processing and manipulation.

Package Shape: SQUARE

A compact and easy-to-handle shape for integration into electronic systems.

Form Of Terminal: BALL

Enhances connectivity and stability during installation and operation.

No. of Terminals: 256

Offers sufficient terminal connections for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for customization and reprogramming of the FPGA as needed for different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables close packing of components for efficient use of board space.

Minimum Supply Voltage: 0.95 V

Can operate at a low minimum supply voltage, reducing power consumption.

Maximum Operating Temperature: 100 °C

Can withstand high operating temperatures without performance degradation.

Pitch Of Terminal: 1 mm

Provides a standard spacing for easy connection with other components.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Offers fast processing speed for logic operations within the Configurable Logic Blocks.

Organization: 2600 CLBS

Structured with a high number of Configurable Logic Blocks for flexibility in design implementation.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperature environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Provides corrosion resistance and reliable electrical connections.

Position Of Terminal: BOTTOM

Facilitates easy access and connection to external components on the circuit board.

Moisture Sensitivity Level (MSL): 3

Indicates moderate sensitivity to moisture, requiring standard handling procedures.

Maximum Seated Height: 1.55 mm

Has a low profile design for space-constrained applications.

Width: 17 mm

Compact width dimension for efficient layout on circuit boards.

Maximum Clock Frequency: 1098 MHz

Supports high-speed operation for time-critical applications.

No. of Outputs: 250

Provides multiple output options for data transmission and processing.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration during assembly processes.

Peak Reflow Temperature °C: 260

Can endure high reflow temperatures during soldering without damage.

Length: 17 mm

Compact length dimension for space-saving integration in electronic designs.

Grading Of Temperature: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges for robust performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A35T-1FTG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

33280

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

2600

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

2600 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A35T-1FTG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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