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5CGXFC4F7M11C8N

Intel

5CGXFC4F7M11C8N by Intel

Intel's 5CGXFC4F7M11C8N FPGA boasts 50000 logic cells, 129 inputs/outputs, and operates at a max temp of 85°C. Ideal for applications requiring high-speed data processing and complex algorithm implementation in industries like telecommunications and automotive.

Median Price

$160.809

Lifecycle Status

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5

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Nova Conductors

Japan . 900 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 631 parts In-Stock

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Ampacity Inc.

Singapore . 317 parts In-Stock

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Semicontronic

India . 1,154 parts In-Stock

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One Stop Electronics

USA . 257 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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MARBEL Systems

Belgium . 535 parts In-Stock

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Texas Native Microelectronics

USA . 792 parts In-Stock

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Kenton Components

USA . 87 parts In-Stock

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Corohmni

South Africa . 65 parts In-Stock

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Modulus Dynamics

Lithuania . 1,667 parts In-Stock

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Microchip USA

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Vigor

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Component Stockers USA

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Argo Parts USA

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GreenTree Electronics

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QUARKTWIN TECHNOLOGY LTD

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Qasali Group International

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Supply Digital

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Corphita

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Netroflash

USA . 1,000 parts In-Stock

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Overview

Unleash the power of innovation with the 5CGXFC4F7M11C8N by Intel, a cutting-edge Field Programmable Gate Array that offers unmatched quality and reliability. Manufactured by Intel, a leader in the industry, this FPGA is designed for a wide range of applications, providing flexibility and customization for your projects. With its advanced technology and impressive number of logic cells, this product delivers exceptional performance and efficiency. Experience the value and benefits of this versatile FPGA, perfect for a variety of electronic design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

No. of Logic Cells: 50000

With a high number of logic cells, this FPGA can handle complex logic operations efficiently.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the FPGA on circuit boards.

Maximum Supply Voltage: 1.13 V

The maximum supply voltage of 1.13V ensures safe operation of the FPGA within specified limits.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA energy-efficient and reliable.

No. of Inputs: 129

Having a high number of inputs allows for more data to be processed simultaneously, increasing the functionality of the FPGA.

Package Shape: SQUARE

The square package shape provides a compact footprint, making the FPGA suitable for space-constrained applications.

Form Of Terminal: BALL

Ball terminals provide good electrical contact and efficient heat dissipation, enhancing the reliability and performance of the FPGA.

Nominal Supply Voltage (V): 1.1

The nominal supply voltage of 1.1V ensures stable and consistent operation of the FPGA.

Power Supplies (V): 1.1,1.2/3.3,2.5

Support for multiple power supply voltages allows the FPGA to be compatible with a range of systems and applications.

No. of Terminals: 301

Having a high number of terminals enables more connections and flexibility in integrating the FPGA into a circuit design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, the FPGA offers flexibility in design changes and customization, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The combination of a grid array, thin profile, and fine pitch package style enhances the electrical performance and reliability of the FPGA.

Minimum Supply Voltage: 1.07 V

The minimum supply voltage ensures that the FPGA can still operate reliably under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the FPGA can withstand elevated temperature environments without compromising performance.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals allows for high-density mounting and efficient use of PCB space.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the FPGA can function reliably even in cold environments.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom simplifies the PCB layout and improves signal integrity in the system design.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a compact and slim design when integrating the FPGA into a circuit.

Width: 11 mm

The width of 11mm provides a balance between compact size and ease of handling during installation.

No. of Outputs: 129

Having a high number of outputs allows the FPGA to drive multiple external devices and provide versatile output options.

Length: 11 mm

The length of 11mm complements the square package shape, making the FPGA suitable for various form factors and applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CGXFC4F7M11C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

50000

No. of Inputs:

129

No. of Outputs:

129

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.1 mm

Package Equivalence Code:

BGA301,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

301

Standards

JESD-30 Code:

S-PBGA-B301

Qualified:

No

Trade Compliance

5CGXFC4F7M11C8N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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