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5CGXFC5C6F23C6N

Intel

5CGXFC5C6F23C6N by Intel

Intel's 5CGXFC5C6F23C6N FPGA boasts 76500 logic cells, 240 inputs/outputs, and operates at a max voltage of 1.13V. Ideal for applications requiring high-speed data processing in industries like telecommunications and automotive electronics.

Median Price

$267.895

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

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Digiode

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One Stop Electronics

USA . 299 parts In-Stock

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AZTECH Wire

Italy . 407 parts In-Stock

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Semicontronic

India . 855 parts In-Stock

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Ampacity Inc.

Singapore . 577 parts In-Stock

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MARBEL Systems

Belgium . 100 parts In-Stock

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Kenton Components

USA . 2,088 parts In-Stock

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Corohmni

South Africa . 399 parts In-Stock

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Texas Native Microelectronics

USA . 351 parts In-Stock

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Modulus Dynamics

Lithuania . 186 parts In-Stock

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Advanced Electronics

New Zealand . 3,532 parts In-Stock

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Continental Prestige Electronics

USA . 2,338 parts In-Stock

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Microchip USA

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Argo Parts USA

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Supply Digital

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Corphita

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Kepictronics

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Qasali Group International

UK . 100 parts In-Stock

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Overview

Unlock the power of innovation with the Intel 5CGXFC5C6F23C6N Field Programmable Gate Array (FPGA). Manufactured by Intel, this cutting-edge technology offers endless possibilities for customization and optimization in a wide range of applications. With 76500 logic cells and 240 inputs and outputs, this FPGA provides unparalleled flexibility and performance. Whether you're designing advanced robotics, high-speed networking solutions, or next-generation IoT devices, the Intel 5CGXFC5C6F23C6N delivers the reliability and efficiency you need to bring your ideas to life. Embrace the future of technology with Intel's top-of-the-line FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FPGA easy to handle and resistant to damage during handling and installation.

No. of Logic Cells: 76500

With a large number of logic cells, this FPGA is capable of handling complex designs and processing tasks efficiently.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.13 V

This low maximum supply voltage helps in reducing power consumption and heat dissipation, leading to improved energy efficiency.

Technology Used: CMOS

CMOS technology provides high speed and low power consumption, making the FPGA suitable for a wide range of applications.

No. of Inputs: 240

Having a large number of inputs allows for flexibility in connecting external devices and sensors to the FPGA for data processing.

Package Shape: SQUARE

The square package shape ensures uniformity in dimensions, making it easier to design and layout circuit boards housing the FPGA.

Nominal Supply Voltage (V): 1.1

The nominal supply voltage of 1.1V provides stable and reliable performance for the FPGA.

Power Supplies (V): 1.1,1.2/3.3,2.5

Support for multiple power supply voltages offers compatibility with different systems and environments, enhancing the versatility of the FPGA.

No. of Terminals: 484

Having a high number of terminals allows for easy connectivity and ensures compatibility with various circuit board designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this device offers reconfigurability and flexibility, allowing for quick prototyping and customization of digital circuits.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates high-density mounting and soldering, enabling efficient integration of the FPGA onto circuit boards.

Minimum Supply Voltage: 1.07 V

The low minimum supply voltage ensures reliable operation even under low-power conditions, making the FPGA suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can operate in demanding environments without overheating or performance degradation.

Pitch Of Terminal: 1 mm

The small pitch of terminals allows for high-density mounting, enabling compact and space-efficient circuit board designs.

Minimum Operating Temperature: 0 °C

The FPGA can operate in cold temperatures down to 0°C, making it suitable for a wide range of environmental conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of these materials for terminal finishing ensures good conductivity and corrosion resistance, enhancing the durability of the FPGA.

Position Of Terminal: BOTTOM

Having terminals on the bottom side facilitates easy and secure mounting onto circuit boards, ensuring a reliable connection.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the FPGA is suitable for environments with moderate exposure to moisture, ensuring reliable operation under normal conditions.

Maximum Seated Height: 2 mm

The low seated height allows for compact and slim designs, making the FPGA suitable for space-constrained applications.

Width: 23 mm

The moderate width of the FPGA makes it compatible with standard PCB layouts and allows for easy integration into existing systems.

No. of Outputs: 240

Having a large number of outputs allows for versatile signal processing and communication capabilities, making the FPGA suitable for a variety of applications.

Length: 23 mm

The moderate length of the FPGA ensures compatibility with standard PCB dimensions, simplifying integration into electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CGXFC5C6F23C6N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

76500

No. of Inputs:

240

No. of Outputs:

240

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

5CGXFC5C6F23C6N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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