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XCKU035-2FBVA900I

Xilinx

XCKU035-2FBVA900I by Xilinx

Xilinx XCKU035-2FBVA900I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. The package style is a grid array with a square shape and ball terminals for surface mount assembly.

Median Price

$2,532.950

Lifecycle Status

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9

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Newark

USA . 3 parts In-Stock

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$2,442.600

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Mouser Electronics

USA . 3 parts In-Stock

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DigiKey

USA . 1 parts In-Stock

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Element14

Singapore . 5 parts In-Stock

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$2,659.010

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Digiode

USA . 153 parts In-Stock

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$2,258.644

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VNN

France . 514 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$2,401.230

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Vyrian

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Chip Stock

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AZTECH Wire

Italy . 860 parts In-Stock

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$13.611

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$77.759

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$73.871

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Corohmni

South Africa . 527 parts In-Stock

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$85.125

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Aztec Data Supply Inc.

USA . 1,822 parts In-Stock

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$87.870

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Texas Native Microelectronics

USA . 25 parts In-Stock

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$116.187

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$111.540

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$108.054

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$102.245

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$102.245

Modulus Dynamics

Lithuania . 198 parts In-Stock

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$121.950

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$121.950

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Continental Prestige Electronics

USA . 12 parts In-Stock

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$1,819.000

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Semicontronic

India . 3 parts In-Stock

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$2,020.720

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$1,970.202

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$1,960.098

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One Stop Electronics

USA . 3 parts In-Stock

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$2,020.890

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$2,020.890

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Corphita

USA . 73 parts In-Stock

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Argo Parts USA

USA . 4,343 parts In-Stock

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$2,377.455

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$2,353.681

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$2,329.906

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$2,306.131

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Microchip USA

USA . 2,102 parts In-Stock

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MARBEL Systems

Belgium . 2,378 parts In-Stock

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Supply Digital

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Netroflash

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Vigor

Singapore . 619 parts In-Stock

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Kenton Components

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Qasali Group International

UK . 58 parts In-Stock

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$276.060

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$276.060

Overview

Unlock the power of innovation with the XCKU035-2FBVA900I Field Programmable Gate Array (FPGA) by Xilinx. With a staggering 444,343 logic cells and 1,700 CLBs, this FPGA offers unparalleled flexibility for a wide range of applications. From telecommunications to automotive electronics, this FPGA delivers cutting-edge performance and reliability. With Xilinx's reputation for quality and excellence, customers can trust in the value and benefits that this product brings to their projects. Elevate your designs with the XCKU035-2FBVA900I FPGA and take your creations to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components, making the FPGA suitable for various environmental conditions.

No. of Logic Cells: 444343

With a large number of logic cells, this FPGA offers high flexibility and capability to handle complex logic functions.

Surface Mount: YES

The surface mount feature allows for easy and efficient integration onto PCBs, saving assembly time and cost.

Maximum Supply Voltage: 0.979 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA energy-efficient.

No. of CLBs: 1700

Having 1700 Configurable Logic Blocks (CLBs) provides ample resources for implementing custom logic functions.

No. of Inputs: 520

The high number of input ports allows for easy interfacing with external devices and input signals.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB and facilitates easy routing of signals.

Nominal Supply Voltage (V): 0.95

The consistent nominal supply voltage ensures stable performance and reliable operation of the FPGA.

Power Supplies (V): 0.95

The power supplies operating at 0.95V contribute to low power consumption and improved energy efficiency.

No. of Terminals: 900

With 900 terminals, there are sufficient connectivity options for interfacing with other components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this device offers flexibility for custom logic implementation and rapid prototyping.

Package Style (Meter): GRID ARRAY

The grid array package style allows for easy placement and soldering onto PCBs, improving manufacturing efficiency.

Minimum Supply Voltage: 0.922 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and extends operational flexibility.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, the FPGA can withstand elevated temperatures in industrial environments.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for precise and compact layout on the PCB, optimizing space utilization.

Organization: 1700 CLBS

The organizational structure of 1700 CLBs provides a well-defined framework for implementing complex logic designs.

Minimum Operating Temperature: -40 °C

The FPGA can operate reliably in harsh environments with a minimum operating temperature of -40°C.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals ensures good conductivity and reliability in electrical connections.

Position Of Terminal: BOTTOM

The positioning of terminals at the bottom facilitates easy soldering and assembly on the PCB.

Moisture Sensitivity Level (MSL): 4

With MSL 4 rating, the FPGA is less sensitive to moisture, ensuring long-term reliability in humid conditions.

Maximum Seated Height: 2.8 mm

The low maximum seated height of 2.8mm minimizes the overall profile of the FPGA on the PCB, conserving space.

Width: 31 mm

The 31mm width of the FPGA allows for compact integration in tight spaces and facilitates efficient PCB layout.

No. of Outputs: 520

With 520 output ports, the FPGA can drive multiple external devices and communicate with various components simultaneously.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures reliable soldering during assembly processes.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, the FPGA can endure high-temperature soldering without degradation.

Length: 31 mm

The 31mm length of the FPGA complements its width, providing a balanced form factor for streamlined PCB integration.

Grading Of Temperature: INDUSTRIAL

Designed for industrial applications, the FPGA can operate reliably in challenging temperature conditions, ensuring robust performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU035-2FBVA900I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

444343

No. of Inputs:

520

No. of Outputs:

520

No. of CLBs:

1700

Sub-Category:

Field Programmable Gate Arrays

Organization:

1700 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.8 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU035-2FBVA900I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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