Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Xilinx XCKU040-3FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.97V to 1.03V, making it versatile for various industrial environments.
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PLASTIC/EPOXY material provides durability and allows for easy handling during assembly and installation.
Large number of logic cells provide flexibility and capability to handle complex programmable tasks efficiently.
Surface mount capability makes it easier to integrate the FPGA into various electronic devices and circuit designs.
Efficient power consumption and compatibility with low voltage systems.
Abundance of Configurable Logic Blocks (CLBs) allow for customizable logic implementation and design flexibility.
Large number of inputs provide versatility and enable complex input-output configurations.
Square package shape allows for optimal use of space in electronic design layouts and PCBs.
Ball terminal form facilitates easy soldering and connection to circuit boards.
Sufficient number of terminals for versatile connectivity options and signal routing.
Field Programmable Gate Array technology enables reconfigurable and customizable logic implementation for various applications.
Grid array package style provides a compact and organized layout for efficient PCB integration.
Low minimum supply voltage requirement for energy-efficient operation and compatibility with various power sources.
High maximum operating temperature tolerance ensures reliable performance in diverse environmental conditions.
Optimal terminal pitch for easy soldering and connection to PCBs with standard layout specifications.
Organized structure with 1920 Configurable Logic Blocks (CLBs) offers efficient and flexible logic implementation.
Low minimum operating temperature tolerance ensures reliable performance even in cold environments.
Tin, silver, and copper finishing on terminals provides good electrical conductivity and corrosion resistance for long-term reliability.
Bottom position of terminals enables easy soldering and connection to PCB bottom layers for compact design layouts.
Moisture sensitivity level 4 indicates low sensitivity to moisture, making the FPGA suitable for various environmental conditions.
Low maximum seated height allows for compact and slim design profiles in electronic devices and systems.
Optimal width dimension for easy integration and placement within electronic circuit layouts and designs.
Abundance of output options for diverse signal routing and connectivity requirements in electronic applications.
Compact length dimension for space-efficient integration and placement in electronic devices and systems.
Field Programmable Gate Arrays (FPGA) XCKU040-3FFVA1156E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XCKU040-3FFVA1156E Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Ultrascale & Virtex Dev Spec Chg 20/Dec/2016
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
1N4148
Digitron Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
LM317T
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
Rectron
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
MBR0520LT1G
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
1N4148WS
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
General Transistor
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
BAV99
Siemens
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
XC7A200T-2FB676I
Xilinx
XC7A200T-2FB676I by Xilinx is a FPGA with 16825 CLBs, 1.05V max supply voltage, and 1.05ns combinatorial delay. Ideal for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 27mm square package with 676 terminals.
XC7K325T-3FFG900E
Xilinx XC7K325T-3FFG900E is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1412 MHz. It uses CMOS technology and has 500 inputs/outputs. Ideal for high-performance computing applications requiring fast processing speeds.
A3P250-FGG256I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC6SLX45T-3FGG484I
Xilinx XC6SLX45T-3FGG484I FPGA features 43661 logic cells, 3411 CLBs, and 296 inputs/outputs. Operating at a max frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range from -40 to 100°C and multiple power supply options, this FPGA offers versatile performance capabilities.
EP4CE15F17C7N
Intel
EP4CE15F17C7N by Intel is a FPGA with 15408 logic cells, 963 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and digital signal processing devices.
LCMXO1200C-3FTN256C
Lattice Semiconductor
LCMXO1200C-3FTN256C by Lattice Semiconductor is a FPGA with 1200 logic cells, 150 CLBs, and 211 inputs/outputs. It operates at 1.8V nominal voltage and can withstand temperatures from 0 to 85°C. Ideal for applications requiring high-performance programmable ICs in compact form factors.
EP3C25E144C8NES
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: RECTANGULAR;
EP1C12Q240C8N
EP1C12Q240C8N by Intel is a FPGA with 12060 logic cells, 173 inputs/outputs, and max clock frequency of 275 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities. With a package style of flatpack and fine pitch, it offers versatility in design and integration.
XC7S50-2CSGA324I
The Xilinx XC7S50-2CSGA324I is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications for high-speed data processing due to its low profile package style and fine pitch grid array design.
XC7S6-1CSGA225C
The Xilinx XC7S6-1CSGA225C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style of grid array and low profile, it offers flexibility in design while maintaining a compact form factor.
10CX150YF672E6G
Intel's 10CX150YF672E6G FPGA boasts 150,000 logic cells and 54,770 CLBs. Operating b/w 0-100°C with a supply voltage range of 0.87-0.93V, it offers 236 inputs/outputs for various applications requiring high-performance programmable ICs in a square grid array package.
M1A3P1000-FGG256I
Microchip Technology
M1A3P1000-FGG256I by Microchip Technology is a FPGA with 24576 CLBs and 1000000 gates. It operates at max clock frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package style of grid array and CMOS technology, it offers reliable performance in a compact form factor.
A3PE1500-PQG208I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EP2C5T144C7N
EP2C5T144C7N by Intel is a FPGA with 4608 logic cells, 288 CLBs, and max clock frequency of 450 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style of flatpack and low profile, it offers versatility in design while maintaining efficient power supplies at 1.2V to 3.3V.
XC3S250E-4VQG100I
Xilinx XC3S250E-4VQG100I FPGA offers 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for industrial applications requiring high-speed processing in compact designs. The package style includes flatpack, thin profile, and fine pitch options for versatile integration.
10M04SCE144I7G
Intel's 10M04SCE144I7G FPGA has 4000 logic cells, 250 CLBs, and operates at a max voltage of 3.15V. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package with gull wing terminals.
10CL025YU256C6G
Intel 10CL025YU256C6G is a FPGA with 1539 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of 0°C to 85°C. It's used in applications requiring high flexibility and customization like telecommunications, automotive electronics, and industrial control systems.
LCMXO2-1200ZE-1TG100I
LCMXO2-1200ZE-1TG100I by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. Operating temp range -40 to 100 °C, package style flatpack. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.
EP3C40U484I7
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;
LCMXO2-1200HC-4TG100CR1
LCMXO2-1200HC-4TG100CR1 by Lattice Semiconductor is a CMOS FPGA with 1280 logic cells, 80 inputs/outputs, and 3.465V max supply voltage. Ideal for applications requiring high clock frequency up to 133MHz in a square package with GULL WING terminals.
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XCKU040-2FFVA1156E
Xilinx XCKU040-2FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: Grid Array, with a max operating temperature of 100°C.
XCKU3P-1FFVD900E
Xilinx XCKU3P-1FFVD900E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.
XCKU3P-2FFVB676E
Xilinx XCKU3P-2FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. Package style is grid array with a square shape and ball terminals, suitable for various industrial uses.
XCKU060-1FFVA1517I
Xilinx XCKU060-1FFVA1517I FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range (-40 to 100°C) and low supply voltage (0.922-0.979V).
XCKU3P-1FFVA676E
Xilinx XCKU3P-1FFVA676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.876 V. Suitable for various industries due to its versatile programmable IC type and grid array package style.
XCKU035-2FBVA900I
Xilinx XCKU035-2FBVA900I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. The package style is a grid array with a square shape and ball terminals for surface mount assembly.
XCKU040-2FFVA1156I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU060-1FFVA1517C
Xilinx XCKU060-1FFVA1517C FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XCKU3P-1FFVB676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU115-2FLVA1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCKU060-2FFVA1156E
Xilinx XCKU060-2FFVA1156E FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatility and robust design capabilities.
XCKU3P-1FFVB676E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU040-1FFVA1156C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU025-1FFVA1156I
Xilinx XCKU025-1FFVA1156I FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a wide operating temperature range (-40 to 100°C) in a compact square grid array package.
XCKU035-1FFVA1156C
XCKU5P-2FFVB676E
Xilinx XCKU5P-2FFVB676E FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C.
XCKU3P-1SFVB784E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
XCKU035-2FBVA900E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
XCKU060-2FFVA1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
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