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XCKU3P-2FFVB676E

Xilinx

XCKU3P-2FFVB676E by Xilinx

Xilinx XCKU3P-2FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. Package style is grid array with a square shape and ball terminals, suitable for various industrial uses.

Median Price

$2,293.626

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Newark

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$2,146.910

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Mouser Electronics

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Element14

Singapore . 1 parts In-Stock

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Farnell

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Digiode

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$1,985.424

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VNN

France . 659 parts In-Stock

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Nova Conductors

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Vyrian

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Microchip USA

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$1.000

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AZTECH Wire

Italy . 329 parts In-Stock

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MARBEL Systems

Belgium . 2,395 parts In-Stock

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Texas Native Microelectronics

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$43.474

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Kenton Components

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$52.169

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$45.909

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Modulus Dynamics

Lithuania . 1,521 parts In-Stock

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Qasali Group International

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Corohmni

South Africa . 191 parts In-Stock

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Aztec Data Supply Inc.

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Vigor

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Ampacity Inc.

Singapore . 2 parts In-Stock

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Corphita

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Argo Parts USA

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$2,089.650

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$2,047.857

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$2,026.960

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Continental Prestige Electronics

USA . 3,752 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Semicontronic

India . 2 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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Overview

Unlock endless possibilities with the XCKU3P-2FFVB676E by Xilinx, a cutting-edge Field Programmable Gate Array that revolutionizes the way you think about technology. With its superior quality and unmatched reliability, Xilinx sets the standard in FPGA manufacturing. This versatile device opens up a world of applications in various industries, offering unparalleled value and benefits to customers looking to optimize their systems. Embrace innovation and take your projects to the next level with the XCKU3P-2FFVB676E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 355950

With a high number of logic cells, this FPGA offers ample capacity for complex designs and high-performance applications.

Surface Mount: YES

The surface mount capability allows for easy integration on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 0.876 V

The low maximum supply voltage helps in reducing power consumption and improving energy efficiency.

No. of CLBs: 20340

The large number of configurable logic blocks provides flexibility in design and implementation of various functions within the FPGA.

Package Shape: SQUARE

The square shape of the package offers uniformity in size and facilitates efficient placement on a PCB.

Form Of Terminal: BALL

The ball terminal design ensures good electrical contact and reliable connectivity.

Nominal Supply Voltage (V): 0.85

The nominal supply voltage of 0.85V ensures compatibility with a wide range of power sources and makes the FPGA versatile for different applications.

No. of Terminals: 676

The ample number of terminals allows for easy interfacing with external components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers flexibility in design and rapid prototyping, making it suitable for development and testing of new designs.

Package Style (Meter): GRID ARRAY

The grid array package style enhances thermal dissipation and provides good mechanical support for the FPGA.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage ensures reliable operation in low-power applications without compromising performance.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and high-temperature environments.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for easy soldering and assembly, enhancing the reliability and manufacturability of the product.

Organization: 20340 CLBS

The organizational structure of 20340 Configurable Logic Blocks provides a balance between logic capacity and flexibility in designing complex systems.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing provides good conductivity, corrosion resistance, and solderability.

Position Of Terminal: BOTTOM

The bottom positioning of terminals simplifies PCB layout and routing, optimizing signal integrity and reducing interference.

Moisture Sensitivity Level (MSL): 4

With MSL 4, this FPGA can withstand moderate exposure to moisture during storage and handling.

Maximum Seated Height: 3.52 mm

The low maximum seated height allows for compact and slim designs, suitable for space-constrained applications.

Width: 27 mm

The 27mm width of the FPGA makes it compatible with standard PCB sizes and facilitates efficient board-level integration.

No. of Outputs: 304

The generous number of outputs provides ample connectivity options for interfacing with external devices and peripherals.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and assembly during production.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this FPGA can withstand high-temperature soldering processes without damage.

Length: 27 mm

The 27mm length of the FPGA ensures compatibility with standard PCB dimensions and facilitates optimal placement within electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU3P-2FFVB676E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

355950

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

20340

Organization:

20340 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.52 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XCKU3P-2FFVB676E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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