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XCKU3P-1FFVB676I

Xilinx

XCKU3P-1FFVB676I by Xilinx

Xilinx XCKU3P-1FFVB676I FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Package style is grid array with a square shape and ball terminals.

Median Price

$1,987.930

Lifecycle Status

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9

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1k+

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Newark

USA . 7 parts In-Stock

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Mouser Electronics

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DigiKey

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Element14

Singapore . 7 parts In-Stock

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VNN

France . 908 parts In-Stock

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Digiode

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 540 parts In-Stock

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$12.671

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Advanced Electronics

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Modulus Dynamics

Lithuania . 792 parts In-Stock

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Corohmni

South Africa . 294 parts In-Stock

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Aztec Data Supply Inc.

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Texas Native Microelectronics

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Kenton Components

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$205.544

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$180.879

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$180.879

Qasali Group International

UK . 250 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 3 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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Corphita

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Argo Parts USA

USA . 4,702 parts In-Stock

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$1,740.460

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Continental Prestige Electronics

USA . 358 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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MARBEL Systems

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Overview

Unlock limitless possibilities with the XCKU3P-1FFVB676I by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). This powerful and versatile product boasts an impressive number of logic cells and inputs, making it perfect for a wide range of applications. From telecommunications to automotive, this FPGA offers unparalleled value and benefits for our customers. Stay ahead of the curve with Xilinx and revolutionize your projects with the XCKU3P-1FFVB676I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the FPGA, making it suitable for a range of environments.

No. of Logic Cells: 355950

With a high number of logic cells, this FPGA offers extensive processing capabilities for complex designs.

Surface Mount: YES

Surface mount technology allows for easy integration and space-saving on PCBs.

Maximum Supply Voltage: 0.876 V

With a low maximum supply voltage, this FPGA offers energy efficiency and reduced power consumption.

No. of CLBs: 20340

The large number of Configurable Logic Blocks (CLBs) provides flexibility and customization in design implementations.

No. of Inputs: 304

A high number of inputs allow for versatile connectivity and input/output configurations.

Package Shape: SQUARE

The square shape of the package ensures easy and efficient placement on the PCB.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers reconfigurability and adaptability for various applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA is suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliability and performance in extreme conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU3P-1FFVB676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

355950

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

20340

Organization:

20340 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.52 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XCKU3P-1FFVB676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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