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XCKU3P-1SFVB784E

Xilinx

XCKU3P-1SFVB784E by Xilinx

Xilinx XCKU3P-1SFVB784E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing and complex algorithms in industries like aerospace, telecommunications, and automotive. Operating temperature range from 0 to 100 °C with a max supply voltage of 0.876 V makes it versatile for various environments.

Median Price

$1,417.500

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 33 parts In-Stock

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Digiode

USA . 369 parts In-Stock

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VNN

France . 112 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 523 parts In-Stock

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$13.559

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One Stop Electronics

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Ampacity Inc.

Singapore . 1,540 parts In-Stock

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Semicontronic

India . 1,561 parts In-Stock

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$28.275

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$28.130

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Modulus Dynamics

Lithuania . 1,239 parts In-Stock

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Aztec Data Supply Inc.

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Texas Native Microelectronics

USA . 922 parts In-Stock

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Corohmni

South Africa . 512 parts In-Stock

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Corphita

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Argo Parts USA

USA . 4,376 parts In-Stock

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$1,366.924

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$1,352.975

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Microchip USA

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Advanced Electronics

New Zealand . 2,106 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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MARBEL Systems

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Kenton Components

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Supply Digital

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Qasali Group International

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Vigor

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Overview

Unlock endless possibilities with the XCKU3P-1SFVB784E by Xilinx, a cutting-edge Field Programmable Gate Array that offers unmatched quality and performance. With over 355,950 logic cells and 20,340 CLBs, this FPGA is designed for maximum efficiency and flexibility. Whether you're in the automotive, telecommunications, or aerospace industry, this versatile device will elevate your projects to new heights. Trust Xilinx, a leading manufacturer in the industry, to deliver superior technology that meets your needs. Experience the value and benefits of the XCKU3P-1SFVB784E and revolutionize your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good thermal performance and durability, making the product suitable for a variety of operating conditions.

No. of Logic Cells: 355950

Large number of logic cells offer high capacity for complex designs and computations, making the product versatile for different applications.

Maximum Supply Voltage: 0.876 V

High maximum supply voltage ensures stable operation and reliable performance of the product under various voltage conditions.

No. of CLBs: 20340

Large number of Configurable Logic Blocks (CLBs) provide flexibility in design implementation and optimization, enhancing the product's usability.

No. of Inputs: 304

Abundance of input pins allows for extensive connectivity and data processing capabilities in the product, facilitating complex functionalities.

Nominal Supply Voltage (V): 0.85

Stable nominal supply voltage ensures consistent and efficient operation of the product, contributing to its overall reliability.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch packaging style offers excellent signal integrity and thermal performance, enhancing the product's overall functionality.

Maximum Operating Temperature: 100 °C

High maximum operating temperature allows the product to perform reliably in demanding thermal environments, increasing its suitability for various applications.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function effectively in cold conditions, expanding its operational range.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates the product's resilience to moisture, safeguarding its performance in humid or damp environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU3P-1SFVB784E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

355950

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

20340

Organization:

20340 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA784,28X28,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Trade Compliance

XCKU3P-1SFVB784E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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