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EP3C10E144I7N

Intel

EP3C10E144I7N by Intel

Intel's EP3C10E144I7N FPGA boasts 10320 logic cells, 94 inputs/outputs, and a clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temperature of 100°C.

Median Price

$81.525

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DigiKey

USA . 96 parts In-Stock

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Mouser Electronics

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Arrow

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$74.450

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Verical

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Nova Conductors

Japan . 92 parts In-Stock

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Digiode

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Vyrian

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Dynamic Solutions

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Rebound Electronics

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Touchstone Systems

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 829 parts In-Stock

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Vigor

Singapore . 178 parts In-Stock

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Corohmni

South Africa . 445 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 102 parts In-Stock

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Aranea Global

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Continental Prestige Electronics

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Corphita

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Microchip USA

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Modulus Dynamics

Lithuania . 1,881 parts In-Stock

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Advanced Electronics

New Zealand . 30 parts In-Stock

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Semicontronic

India . 190 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 662 parts In-Stock

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Qasali Group International

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Lixinc

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MARBEL Systems

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Alle Elektronik GmbH

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Supply Digital

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Perfect Parts

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Argo Parts USA

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Kepictronics

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Futuretech Components

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Overview

Unleash the power of innovation with the EP3C10E144I7N by Intel. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Intel delivers top-quality products tailored to meet your unique needs. With a multitude of applications and unmatched versatility, this FPGA offers customers unparalleled value and benefits. From increased efficiency to enhanced performance, the EP3C10E144I7N is the perfect solution for all your programming needs. Elevate your projects to new heights with Intel's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and cost-effective for various applications.

No. of Logic Cells: 10320

With a high number of logic cells, this FPGA offers great flexibility and scalability for complex designs.

Surface Mount: YES

Being surface mountable makes this FPGA easy to integrate onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage ensures efficient power consumption, making it suitable for energy-efficient designs.

No. of CLBs: 10320

The large number of Configurable Logic Blocks allows for intricate customization and optimization of functionalities.

Technology Used: CMOS

The CMOS technology offers high performance, low power consumption, and compatibility with a wide range of systems.

No. of Inputs: 94

The high number of inputs allows for versatile connectivity and input/output configurations in the FPGA.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor that makes it easy to fit into various system designs.

Form Of Terminal: GULL WING

The gull wing terminal design simplifies soldering and mounting processes, enhancing the ease of use for engineers.

Nominal Supply Voltage (V): 1.2

The stable nominal supply voltage ensures reliable operation and compatibility with various power sources.

No. of Terminals: 144

The high number of terminals provides ample connectivity options for interfacing with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The FPGA's programmable nature allows for flexibility in design iteration and customization without the need for redesigning hardware.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The various package styles cater to different mounting and cooling requirements for diverse applications.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures stable operation even under low-power conditions, enhancing reliability.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

Pitch Of Terminal: 0.5 mm

The small pitch terminal spacing allows for densely populated PCB layouts, saving space and improving overall system efficiency.

Organization: 10320 CLBS

The organizational structure consisting of 10320 CLBs enables complex logic functions and optimizations in the FPGA design.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable performance even in extreme cold environments.

Finishing Of Terminal Used: MATTE TIN

The use of matte tin finishing on the terminals offers excellent solderability and corrosion resistance, ensuring long-term reliability.

Position Of Terminal: QUAD

The quad terminal positioning provides stability and robustness during mounting and handling processes.

Moisture Sensitivity Level (MSL): 3

The MSL 3 level indicates the level of protection against moisture damage, ensuring reliability in humid environments.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for compact PCB designs and easier integration into tight spaces.

Width: 20 mm

The moderate width of the FPGA facilitates handling, installation, and compatibility with standard PCB layouts.

Maximum Clock Frequency: 472.5 MHz

The high maximum clock frequency enables rapid processing speeds, making it suitable for high-performance applications.

No. of Outputs: 94

The high number of outputs offers versatile signal routing and processing capabilities for complex system designs.

Length: 20 mm

The compact length of the FPGA ensures efficient use of space on the PCB and easy integration into various system designs.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in demanding industrial environments, making it a robust choice for rugged applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3C10E144I7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

10320

No. of Inputs:

94

No. of Outputs:

94

No. of CLBs:

10320

Maximum Clock Frequency:

472.5 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

10320 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

20 mm

Width:

20 mm

Maximum Seated Height:

1.6 mm

Package Equivalence Code:

QFP144,.87SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

144

Standards

JESD-30 Code:

R-PQFP-G144

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

EP3C10E144I7N Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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