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XC7S15-2CSGA225C

Xilinx

XC7S15-2CSGA225C by Xilinx

The Xilinx XC7S15-2CSGA225C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

Median Price

$26.730

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 301 parts In-Stock

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$25.394

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VNN

France . 880 parts In-Stock

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$26.730

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 413 parts In-Stock

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$18.500

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Vigor

Singapore . 643 parts In-Stock

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One Stop Electronics

USA . 130 parts In-Stock

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Semicontronic

India . 130 parts In-Stock

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$22.720

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$22.152

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$22.038

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Ampacity Inc.

Singapore . 43 parts In-Stock

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Corphita

USA . 361 parts In-Stock

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Continental Prestige Electronics

USA . 2,602 parts In-Stock

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$26.735

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Microchip USA

USA . 1,521 parts In-Stock

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$27.240

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$26.240

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$25.740

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$27.270

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MARBEL Systems

Belgium . 1,565 parts In-Stock

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$71.247

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$68.397

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Texas Native Microelectronics

USA . 868 parts In-Stock

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$81.893

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$78.617

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$76.160

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Kenton Components

USA . 901 parts In-Stock

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$86.479

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Corohmni

South Africa . 252 parts In-Stock

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$166.387

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Aztec Data Supply Inc.

USA . 248 parts In-Stock

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Argo Parts USA

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Netroflash

USA . 2,000 parts In-Stock

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$26.460

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$25.650

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$25.110

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Supply Digital

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Perfect Parts

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Qasali Group International

UK . 87 parts In-Stock

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$212.267

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$194.578

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$194.578

Overview

Unlock infinite possibilities with the Xilinx XC7S15-2CSGA225C Field Programmable Gate Array. As a top-tier manufacturer, Xilinx delivers unparalleled quality and reliability in every product. Perfect for a wide range of applications, this FPGA offers customers the advantage of flexibility, customization, and high performance. With 12800 logic cells and a maximum clock frequency of 1286 MHz, the XC7S15-2CSGA225C empowers you to bring your ideas to life with ease. Upgrade your projects today and experience the difference with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes this FPGA lightweight and cost-effective.

No. of Logic Cells: 12800

With a high number of logic cells, this FPGA has the capability to handle complex logic functions and algorithms efficiently.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration into electronic circuit boards.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures energy efficiency and compatibility with low power applications.

No. of CLBs: 1000

The 1000 CLBs provide flexibility and scalability for designing various digital circuits and systems.

No. of Inputs: 100

The 100 inputs allow for a wide range of external signals to be processed by the FPGA.

Package Shape: SQUARE

The square shape of the package provides a compact footprint, saving space on the PCB.

Form Of Terminal: BALL

The ball form of terminal ensures reliable connections and easy soldering during assembly.

No. of Terminals: 225

With 225 terminals, this FPGA offers ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array means this IC can be reconfigured and customized for different applications, providing versatility.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables high-density mounting and improved signal integrity.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95 V allows for operation in low power consumption settings.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in various environmental conditions.

Pitch Of Terminal: 0.8 mm

The small pitch of 0.8 mm facilitates high-density mounting and compact PCB designs.

Maximum Combinatorial Delay of a CLB: 1.05 ns

The low maximum combinatorial delay of 1.05 ns ensures fast processing and efficient operation of logic functions.

Organization: 1000 CLBS

The organization of 1000 CLBs provides a structured and systematic approach to designing complex digital circuits.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable operation even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing ensures good conductivity and durability.

Position Of Terminal: BOTTOM

The terminal positioned at the bottom of the package allows for easy routing of signals on the PCB.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm minimizes the overall profile of the assembled PCB.

Width: 13 mm

With a width of 13 mm, this FPGA is compact and space-saving for various electronic designs.

Maximum Clock Frequency: 1286 MHz

The high maximum clock frequency of 1286 MHz enables fast data processing and high-speed operation.

No. of Outputs: 100

The 100 outputs provide ample channels for delivering processed signals to other components.

Length: 13 mm

With a length of 13 mm, this FPGA is compact and suitable for applications with space constraints.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S15-2CSGA225C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

12800

No. of Inputs:

100

No. of Outputs:

100

No. of CLBs:

1000

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Organization:

1000 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

13 mm

Width:

13 mm

Maximum Seated Height:

1.4 mm

Package Equivalence Code:

BGA225,15X15,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

225

Standards

JESD-30 Code:

S-PBGA-B225

JESD-609 Code:

e1

Trade Compliance

XC7S15-2CSGA225C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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