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XC6SLX45-2FGG676C

Xilinx

XC6SLX45-2FGG676C by Xilinx

The Xilinx XC6SLX45-2FGG676C is a FPGA with 43661 logic cells, 3411 CLBs, and 358 inputs/outputs. It operates at max frequency of 667MHz, suitable for applications requiring high-speed processing like telecommunications and signal processing. With a package style of grid array and CMOS technology, it offers flexibility in design while maintaining performance.

Median Price

$150.125

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Netroflash

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Overview

Unlock the potential of cutting-edge technology with the Xilinx XC6SLX45-2FGG676C Field Programmable Gate Array (FPGA). Manufactured by Xilinx, a trusted name in the industry renowned for quality and reliability, this FPGA offers endless possibilities for a wide range of applications. With its 43661 logic cells, 3411 CLBs, and maximum clock frequency of 667 MHz, this FPGA delivers unparalleled performance and flexibility. Whether you are looking to enhance your data processing capabilities, optimize your power efficiency, or streamline your system design, the XC6SLX45-2FGG676C is the ideal solution for all your needs. Experience the future of technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, perfect for portable and rugged applications.

No. of Logic Cells: 43661

With a high number of logic cells, this FPGA offers great flexibility and can handle complex logic functions efficiently.

Surface Mount: YES

Being surface mountable allows for easy integration into electronic circuits, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

No. of CLBs: 3411

The large number of Configurable Logic Blocks (CLBs) provides ample resources for implementing various logic functions and designs.

Technology Used: CMOS

The CMOS technology enables high-speed operation and low power consumption, enhancing the performance and efficiency of the FPGA.

No. of Inputs: 358

With a large number of input pins, this FPGA can interface with a wide range of external devices and sensors.

Package Shape: SQUARE

The square package shape offers a symmetrical footprint, making it easy to place and route on a circuit board.

Form Of Terminal: BALL

The ball terminals provide reliable connections and allow for easy rework or replacement if needed.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V is common and compatible with many other electronic components, simplifying system-level integration.

Power Supplies (V): 1.2,2.5/3.3

The availability of multiple power supply options provides flexibility in designing and powering the FPGA in different applications.

No. of Terminals: 676

With a high number of terminals, this FPGA offers extensive I/O capabilities for interfacing with various external devices and components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA, this IC type allows for reprogramming and customization of logic functions, making it versatile for different applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers increased interconnect density and better thermal performance, enhancing the reliability and performance of the FPGA.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation even under low-power conditions, increasing the versatility of the FPGA.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and high-temperature environments.

Pitch Of Terminal: 1 mm

The tight 1mm pitch of terminals allows for high-density packing and efficient use of space on a circuit board.

Maximum Combinatorial Delay of a CLB: 0.26 ns

The low maximum combinatorial delay of a Configurable Logic Block (CLB) ensures fast signal processing and reduced latency in logic operations.

Organization: 3411 CLBS

The organized structure with 3411 Configurable Logic Blocks (CLBs) provides a systematic layout for implementing complex logic functions and designs.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this FPGA can operate reliably even in cold environments, making it suitable for diverse applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals improves conductivity, corrosion resistance, and solderability, enhancing the reliability and longevity of the connections.

Position Of Terminal: BOTTOM

The bottom position of the terminals allows for easy access and routing of signals, simplifying the PCB layout and assembly process.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA can withstand moderate exposure to moisture during storage and handling, ensuring long-term reliability.

Maximum Seated Height: 2.44 mm

The low maximum seated height of 2.44mm allows for compact and slim designs, ideal for applications with space constraints.

Width: 27 mm

With a width of 27mm, this FPGA has a compact form factor, making it suitable for applications where board space is limited.

Maximum Clock Frequency: 667 MHz

The high maximum clock frequency of 667MHz enables fast data processing and real-time operations, making this FPGA suitable for high-performance applications.

No. of Outputs: 358

The high number of output pins allows for driving multiple external devices and components, enhancing the versatility and connectivity of the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this FPGA can withstand the soldering process without compromising its performance and reliability.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C ensures secure soldering and robust connections during assembly, improving the overall quality and durability of the FPGA.

Length: 27 mm

With a length of 27mm, this FPGA has a compact and standardized form factor, making it easy to integrate into various electronic systems and designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX45-2FGG676C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

43661

No. of Inputs:

358

No. of Outputs:

358

No. of CLBs:

3411

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3411 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX45-2FGG676C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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