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XC6SLX16-2CSG324I

Xilinx

XC6SLX16-2CSG324I by Xilinx

Xilinx XC6SLX16-2CSG324I FPGA features 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide supply voltage range and low combinatorial delay, this FPGA offers versatile programmability for various electronic systems.

Median Price

$72.150

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Digiode

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Modulus Dynamics

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Texas Native Microelectronics

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Lixinc

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Overview

Elevate your projects with the XC6SLX16-2CSG324I by Xilinx, a cutting-edge Field Programmable Gate Array that offers unparalleled quality and performance. Manufactured by industry leader Xilinx, this FPGA boasts 14579 logic cells and 1139 CLBs, providing endless possibilities for customization and innovation. Whether you're working on industrial automation, telecommunications, or aerospace applications, this versatile device delivers exceptional value and benefits. Take your designs to the next level with the XC6SLX16-2CSG324I and experience the advantage of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

No. of Logic Cells

14579 - Offers high capacity for complex designs.

Surface Mount

YES - Allows for easy installation and space-saving on PCB.

Maximum Supply Voltage

1.26 V - Ensures stable performance with low power consumption.

No. of CLBs

1139 - Provides ample resources for logic implementation.

Technology Used

CMOS - Enables efficient operation and low power consumption.

No. of Inputs

232 - Allows for versatile connectivity options.

Package Shape

SQUARE - Facilitates easy handling and integration.

Form Of Terminal

BALL - Simplifies the soldering process for assembly.

Nominal Supply Voltage (V)

1.2 - Offers optimal operating conditions for the FPGA.

Power Supplies (V)

1.2,2.5/3.3 - Provides flexibility in voltage requirements for various applications.

No. of Terminals

324 - Enhances connectivity possibilities in the system.

Programmable IC Type

FIELD PROGRAMMABLE GATE ARRAY - Allows for custom logic implementation and reconfiguration.

Package Style (Meter)

GRID ARRAY, LOW PROFILE, FINE PITCH - Enables compact design and efficient routing.

Minimum Supply Voltage

1.14 V - Supports operation under low voltage conditions.

Maximum Operating Temperature

100 °C - Ensures reliability in harsh environmental conditions.

Pitch Of Terminal

0.8 mm - Enables close spacing for efficient PCB layout.

Maximum Combinatorial Delay of a CLB

0.26 ns - Ensures fast processing of logic operations.

Organization

1139 CLBS - Provides structured and organized logic resources.

Minimum Operating Temperature

40 °C - Allows for operation in extreme cold environments.

Finishing Of Terminal Used

TIN SILVER COPPER - Ensures reliable and durable connections.

Position Of Terminal

BOTTOM - Facilitates easy routing and connection in the system.

Moisture Sensitivity Level (MSL)

3 - Indicates resistance to moisture-related damage during handling.

Maximum Seated Height

1.5 mm - Enables low-profile installations for space-constrained applications.

Width

15 mm - Establishes the physical dimensions of the FPGA.

Maximum Clock Frequency

667 MHz - Supports high-speed processing for time-critical applications.

No. of Outputs

232 - Provides ample output options for data transmission.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures proper soldering during assembly processes.

Peak Reflow Temperature °C

260 - Indicates the maximum temperature tolerance during soldering.

Length

15 mm - Determines the physical dimensions of the FPGA.

Grading Of Temperature

INDUSTRIAL - Suitable for industrial applications with extended temperature ranges.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX16-2CSG324I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

14579

No. of Inputs:

232

No. of Outputs:

232

No. of CLBs:

1139

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1139 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX16-2CSG324I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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