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MPF100T-1FCVG484I

Microchip Technology

MPF100T-1FCVG484I by Microchip Technology

MPF100T-1FCVG484I by Microchip Technology is a CMOS FPGA with 109K logic cells, 284 inputs/outputs. Operating at -40 to 100°C, it's ideal for industrial applications requiring high-density programmable logic solutions in a compact 19x19mm grid array package.

Median Price

$217.980

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Microchip Technology

USA . 115 parts In-Stock

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DigiKey

USA . 29 parts In-Stock

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Mouser Electronics

USA . 1 parts In-Stock

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NAC Semi

USA . 92 parts In-Stock

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$202.410

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$186.430

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$172.790

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Digiode

USA . 209 parts In-Stock

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Nova Conductors

Japan . 57 parts In-Stock

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Vyrian

USA . 3,610 parts In-Stock

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Chip Stock

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AZTECH Wire

Italy . 300 parts In-Stock

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$16.193

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Corohmni

South Africa . 71 parts In-Stock

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$80.011

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Advanced Electronics

New Zealand . 51 parts In-Stock

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$80.904

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$76.859

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Aztec Data Supply Inc.

USA . 2,883 parts In-Stock

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$163.020

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Vigor

Singapore . 396 parts In-Stock

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Ampacity Inc.

Singapore . 98 parts In-Stock

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Corphita

USA . 332 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Continental Prestige Electronics

USA . 6,498 parts In-Stock

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Semicontronic

India . 98 parts In-Stock

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$530.930

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$517.657

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Marpe Global Electronics

Taiwan . 3,855 parts In-Stock

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QualityLine Systems

Poland . 3,855 parts In-Stock

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XL Components Corporation

Australia . 3,855 parts In-Stock

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Argo Parts USA

USA . 2,231 parts In-Stock

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Overview

Unleash the power of innovation with the MPF100T-1FCVG484I by Microchip Technology. This cutting-edge Field Programmable Gate Array (FPGA) boasts 109,000 logic cells, providing unmatched versatility for a wide range of applications. With a package body made of high-quality PLASTIC/EPOXY material, this FPGA is built to last and deliver exceptional performance. Whether you're designing advanced electronics or pushing the boundaries of technology, the MPF100T-1FCVG484I offers unparalleled value, benefits, and advantages that will take your projects to new heights. Upgrade to Microchip Technology and experience the difference in quality and reliability today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FPGA, making it suitable for various environments.

No. of Logic Cells: 109000

With a large number of logic cells, this FPGA offers flexibility and capability for complex designs and high-performance applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the FPGA onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03 V ensures efficient power usage while supporting high-performance operations.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA energy-efficient and reliable.

No. of Inputs: 284

With a high number of inputs, this FPGA can accommodate a wide range of signals and data inputs for versatile applications.

Package Shape: SQUARE

The square package shape provides a compact design that is easy to integrate into various electronic systems and layouts.

Form Of Terminal: BALL

The ball form of terminals allows for reliable connections and soldering, ensuring secure and stable connections for optimal performance.

No. of Terminals: 484

The high number of terminals provides ample connectivity options for interfacing with external devices and components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this product offers flexibility and reconfigurability for customizing and adapting to different applications and requirements.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch package style allows for high-density packaging and efficient routing of signals, optimizing performance and space utilization.

Minimum Supply Voltage: 0.97 V

The minimum supply voltage of 0.97 V ensures compatibility with a wide range of power sources while maintaining stable operation and performance.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this FPGA can withstand demanding thermal conditions and maintain reliability in industrial environments.

Pitch Of Terminal: 0.8 mm

The 0.8 mm pitch of terminals allows for precise and efficient soldering, ensuring secure connections and reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables this FPGA to function reliably even in extreme cold conditions, expanding its versatility and usability.

Position Of Terminal: BOTTOM

The bottom position of terminals simplifies the routing of signals and connections, making it easier to integrate this FPGA into various circuit layouts and designs.

Maximum Seated Height: 3.32 mm

With a maximum seated height of 3.32 mm, this FPGA is compact and space-saving, allowing for efficient integration into tight spaces and designs.

Width: 19 mm

The 19 mm width provides a balance of compactness and functionality, offering a suitable form factor for various electronic applications and designs.

No. of Outputs: 284

The high number of outputs allows for flexible signal routing and processing, making this FPGA suitable for diverse and complex signal processing tasks.

Length: 19 mm

With a length of 19 mm, this FPGA offers a compact and space-efficient design that can easily fit into various electronic systems and configurations.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance and stability in harsh environmental conditions, making this FPGA suitable for industrial applications and rugged environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100T-1FCVG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

109000

No. of Inputs:

284

No. of Outputs:

284

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF100T-1FCVG484I Programmable ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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