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MPF100TL-FCSG325I

Microchip Technology

MPF100TL-FCSG325I by Microchip Technology

MPF100TL-FCSG325I by Microchip is a CMOS FPGA with 170 inputs/outputs, 325 terminals, and 0.5mm terminal pitch. It operates b/w -40 to 100°C, has a low profile grid array package style, and is suitable for applications requiring programmable gate arrays in compact designs.

Median Price

$185.470

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 3 parts In-Stock

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$185.470

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$154.560

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Microchip Technology

USA . 2 parts In-Stock

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$185.470

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DigiKey

USA . 1 parts In-Stock

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$150.700

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Digiode

USA . 331 parts In-Stock

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$308.199

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Netsource Technology, Inc.

USA . 7,959 parts In-Stock

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Vyrian

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Chip Stock

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Nova Conductors

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AZTECH Wire

Italy . 366 parts In-Stock

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$17.971

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Aztec Data Supply Inc.

USA . 96 parts In-Stock

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$47.320

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Corohmni

South Africa . 52 parts In-Stock

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Vigor

Singapore . 154 parts In-Stock

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Ampacity Inc.

Singapore . 6 parts In-Stock

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Corphita

USA . 69 parts In-Stock

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Semicontronic

India . 6 parts In-Stock

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$585.176

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$582.175

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Argo Parts USA

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Montano Global Distributors

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LMD Electronica

Estonia . 3,968 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,784 parts In-Stock

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NIA Electronics

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Unlock endless possibilities with the MPF100TL-FCSG325I from Microchip Technology. Crafted with precision and innovation, this Field Programmable Gate Array (FPGA) offers unparalleled performance and reliability for your designs. Whether you're in the automotive, industrial, or consumer electronics industry, this versatile product is sure to exceed your expectations. Say goodbye to limitations and embrace the flexibility and agility that this FPGA brings to the table. Elevate your projects with Microchip Technology's cutting-edge technology and redefine what's possible.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes installation of the product easy and convenient.

Maximum Supply Voltage: 1.03 V

With a maximum supply voltage of 1.03V, this product is suitable for low power applications.

Technology Used: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product efficient and reliable.

No. of Inputs: 170

The large number of inputs allows for versatile and complex programmable functions.

Package Shape: SQUARE

Square package shape helps in efficient use of space and easy integration into circuit designs.

Form Of Terminal: BALL

Ball terminals provide reliable connections and ensure good electrical conductivity.

No. of Terminals: 325

The high number of terminals allow for versatile connectivity options and complex circuit designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers flexibility and customization in logic functions.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style ensures efficient placement and connection within the circuit.

Minimum Supply Voltage: 0.97 V

The minimum supply voltage of 0.97V allows for operation in low power environments.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability and performance in various environmental conditions.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals allows for compact and efficient circuit designs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in a wide range of environments.

Position Of Terminal: BOTTOM

Bottom terminal position enables easy integration and connectivity within the circuit.

Maximum Seated Height: 1.45 mm

The low maximum seated height saves space and allows for compact designs.

Width: 11 mm

The width of 11mm allows for easy integration and placement within circuit boards.

No. of Outputs: 170

The equal number of outputs to inputs allows for balanced and versatile logic operations.

Length: 11 mm

The length of 11mm allows for compact and space-efficient circuit designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100TL-FCSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

170

No. of Outputs:

170

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

Trade Compliance

MPF100TL-FCSG325I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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