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MPF100TS-1FCVG484I

Microchip Technology

MPF100TS-1FCVG484I by Microchip Technology

MPF100TS-1FCVG484I by Microchip Tech is a CMOS FPGA with 284 inputs/outputs, operating temp range -40 to 100°C. It has a grid array package style, 0.8mm terminal pitch, and is suitable for applications requiring high-density programmable logic solutions.

Median Price

$249.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Microchip Technology

USA . 1 parts In-Stock

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Vyrian

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Chip Stock

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 339 parts In-Stock

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$18.971

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Corohmni

South Africa . 49 parts In-Stock

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Semicontronic

India . 868 parts In-Stock

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$23.280

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Ampacity Inc.

Singapore . 1,405 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Aztec Data Supply Inc.

USA . 583 parts In-Stock

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Vigor

Singapore . 225 parts In-Stock

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LMD Electronica

Estonia . 8,395 parts In-Stock

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NIA Electronics

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Argo Parts USA

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LOOK Integrated Logistics

Peru . 2,059 parts In-Stock

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Bastille Electronics

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Montano Global Distributors

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Corphita

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Overview

Unlock endless possibilities with the MPF100TS-1FCVG484I from Microchip Technology. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Microchip Technology delivers unbeatable quality and reliability. This versatile FPGA offers a wide range of applications and features, providing customers with unparalleled value and performance. Experience seamless integration, enhanced functionality, and superior results with the MPF100TS-1FCVG484I. Elevate your projects to new heights with Microchip Technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body makes the FPGA lightweight and durable, which is ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, making it suitable for mass production.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in reducing power consumption, making the FPGA energy-efficient.

Technology Used: CMOS

CMOS technology offers low power consumption, high noise immunity, and a wide supply voltage range, making the FPGA reliable and efficient.

No. of Inputs: 284

Having a high number of inputs provides flexibility and allows for complex digital designs to be implemented on the FPGA.

Package Shape: SQUARE

The square package shape helps in optimizing PCB layout and space utilization, making it easy to integrate the FPGA into designs.

Form Of Terminal: BALL

The ball terminal design offers reliable electrical connections and ease of soldering during the assembly process.

No. of Terminals: 484

The high number of terminals enables the FPGA to support a wide range of functionalities and connections, enhancing its versatility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for customization and reconfiguration of logic functions, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch style provides high interconnect density and signal integrity, enabling high-speed and reliable data processing.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures operational stability even under low power conditions, enhancing the FPGA's reliability.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance makes the FPGA suitable for harsh environmental conditions and industrial applications.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals allows for compact designs and facilitates high-density integration of the FPGA into electronic systems.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation even in extreme cold conditions, making the FPGA suitable for various environments.

Position Of Terminal: BOTTOM

The terminal position at the bottom of the package simplifies PCB routing and layout, enhancing the ease of integration and assembly.

Maximum Seated Height: 3.32 mm

The low maximum seated height profile allows for compact and slim designs, making the FPGA suitable for space-constrained applications.

Width: 19 mm

The compact width dimension enables the FPGA to be easily accommodated in tight spaces on the PCB, ensuring efficient space utilization.

No. of Outputs: 284

Having an equal number of outputs as inputs allows for bi-directional communication and signal processing capabilities in the FPGA.

Length: 19 mm

The short length dimension of the FPGA package enables it to fit within constrained board layouts, enhancing design flexibility and integration possibilities.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100TS-1FCVG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

284

No. of Outputs:

284

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF100TS-1FCVG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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