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MPF100T-FCSG325E

Microchip Technology

MPF100T-FCSG325E by Microchip Technology

MPF100T-FCSG325E by Microchip Technology is a CMOS FPGA with 170 inputs/outputs. It operates b/w 0-100°C, with supply voltage range of 0.97-1.03 V. This low-profile, fine-pitch GRID ARRAY package is ideal for high-density applications requiring precise signal processing.

Median Price

$132.480

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

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$130.080

100+ parts

$126.220

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$130.080

$126.220

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Verical

USA . 2 parts In-Stock

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$130.080

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$126.220

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$130.080

$126.220

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DigiKey

USA . 6 parts In-Stock

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$132.480

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$107.638

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$107.638

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Microchip Technology

USA . 1 parts In-Stock

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$132.480

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Newark

USA . 3 parts In-Stock

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$136.450

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$113.700

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$136.450

$113.700

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Farnell

UK . 3 parts In-Stock

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$161.320

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$161.320

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Element14

Singapore . 3 parts In-Stock

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$316.820

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$316.820

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Digiode

USA . 341 parts In-Stock

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$123.576

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341

$123.576

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Nova Conductors

Japan . 43 parts In-Stock

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$264.157

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Vyrian

USA . 3,852 parts In-Stock

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Chip Stock

USA . 996 parts In-Stock

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AZTECH Wire

Italy . 718 parts In-Stock

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$12.552

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$12.552

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Corohmni

South Africa . 101 parts In-Stock

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$40.114

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Ampacity Inc.

Singapore . 4 parts In-Stock

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$110.570

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$110.570

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Semicontronic

India . 4 parts In-Stock

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$110.570

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$107.806

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$107.253

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$110.570

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$107.253

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Corphita

USA . 428 parts In-Stock

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$117.072

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Aztec Data Supply Inc.

USA . 724 parts In-Stock

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$147.600

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$147.600

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Vigor

Singapore . 615 parts In-Stock

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$190.600

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$190.600

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Continental Prestige Electronics

USA . 3,583 parts In-Stock

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$264.157

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$258.874

3,583

$264.157

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$258.874

Advanced Electronics

New Zealand . 882 parts In-Stock

1+ parts

$306.423

100+ parts

$281.909

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$264.157

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882

$306.423

$281.909

$264.157

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Marpe Global Electronics

Taiwan . 4,208 parts In-Stock

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Argo Parts USA

USA . 2,447 parts In-Stock

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XL Components Corporation

Australia . 1,734 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$258.874

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$250.950

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$245.666

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$258.874

$250.950

$245.666

QualityLine Systems

Poland . 92 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with Microchip Technology's MPF100T-FCSG325E Field Programmable Gate Array. Designed with precision and reliability in mind, this FPGA offers endless possibilities for customization and optimization. Whether you're looking to enhance your AI algorithms, improve system performance, or streamline data processing, this versatile product has got you covered. With 170 inputs and outputs, advanced CMOS technology, and a compact square package, the MPF100T-FCSG325E is a game-changer in the world of electronics. Elevate your projects to new heights with this high-quality FPGA from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to heat and chemicals.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making it easier to integrate this FPGA into various electronic devices.

Maximum Supply Voltage: 1.03 V

Having a maximum supply voltage of 1.03 V ensures that the FPGA operates within safe voltage limits, protecting it from damage.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this FPGA energy-efficient and reliable in different operating conditions.

No. of Inputs: 170

With a high number of inputs, this FPGA can handle a large amount of data processing and logic operations, making it suitable for complex applications.

Package Shape: SQUARE

The square package shape allows for easier placement and alignment on circuit boards, simplifying the assembly process.

Form Of Terminal: BALL

Ball terminals provide a secure and reliable connection, ensuring stable performance of the FPGA in various environmental conditions.

No. of Terminals: 325

Having a high number of terminals enables versatile connectivity options, allowing the FPGA to communicate with other components effectively.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility and reconfigurability, making it ideal for prototyping and custom applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances the overall performance and reliability of the FPGA in dense and space-constrained designs.

Minimum Supply Voltage: 0.97 V

A low minimum supply voltage of 0.97 V allows for efficient power consumption and operation, contributing to the energy efficiency of the FPGA.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C ensures the FPGA can withstand elevated temperatures without compromising its performance, making it suitable for various environments.

Pitch Of Terminal: 0.5 mm

The terminal pitch of 0.5 mm enables finer connections and denser packaging, optimizing space utilization and improving the overall performance of the FPGA.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can start up and function effectively in colder environments, providing reliable operation in various conditions.

Position Of Terminal: BOTTOM

Bottom terminal position allows for efficient heat dissipation and easier routing of traces on the PCB, enhancing the overall thermal performance and signal integrity of the FPGA.

Maximum Seated Height: 1.45 mm

The low maximum seated height of 1.45 mm enables a compact and slim profile for the FPGA, facilitating space-saving designs in constrained applications.

Width: 11 mm

With a width of 11 mm, this FPGA can be easily accommodated in various board layouts, offering flexibility in system integration and design.

No. of Outputs: 170

Having a high number of outputs allows this FPGA to drive multiple signals and interface with other components effectively, enhancing its versatility in different applications.

Length: 11 mm

The length of 11 mm provides a balanced form factor for the FPGA, ensuring compatibility with standard board sizes and easing the integration process in electronic devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100T-FCSG325E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

170

No. of Outputs:

170

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

Trade Compliance

MPF100T-FCSG325E Programmable ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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