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EP3C10E144C8N

Intel

EP3C10E144C8N by Intel

EP3C10E144C8N by Intel is a CMOS FPGA with 10320 logic cells and CLBs. Operating at 1.2V, it has a clock frequency of 472.5MHz. Ideal for applications requiring high-speed processing in compact designs like IoT devices and telecommunications equipment.

Median Price

$54.430

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Mouser Electronics

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Arrow

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DigiKey

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Verical

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Digiode

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Nova Conductors

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Chip Stock

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Dynamic Solutions

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Cogito LLC

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Bristol Electronics

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AZTECH Wire

Italy . 830 parts In-Stock

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Modulus Dynamics

Lithuania . 574 parts In-Stock

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MARBEL Systems

Belgium . 2,966 parts In-Stock

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Vigor

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Corohmni

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Advanced Electronics

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Continental Prestige Electronics

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

India . 57 parts In-Stock

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Corphita

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Netroflash

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Kenton Components

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Microchip USA

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Texas Native Microelectronics

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Qasali Group International

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Authorized Procurement Solutions

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Lixinc

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Perfect Parts

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Glotronic Ltd.

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Alle Elektronik GmbH

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Argo Parts USA

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Supply Digital

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A-Z Elektronik GmbH

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Lucentia Tech

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Futuretech Components

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Overview

Unlock endless possibilities with the Intel EP3C10E144C8N, a cutting-edge Field Programmable Gate Array (FPGA) that offers unparalleled flexibility and performance. Crafted by the trusted manufacturer, Intel, this FPGA boasts 10320 logic cells and a maximum clock frequency of 472.5 MHz, making it ideal for a wide range of applications. Whether you're looking to accelerate your designs or optimize your systems, this FPGA delivers exceptional value and benefits that will take your projects to the next level. Embrace innovation and elevate your creations with the Intel EP3C10E144C8N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

No. of Logic Cells: 10320

With a high number of logic cells, this FPGA offers ample resources for complex digital designs.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

Technology Used: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, enhancing reliability and performance.

No. of Inputs: 94

The ample number of inputs allows for versatile connectivity options in the design.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor that can easily fit into various systems and designs.

Form Of Terminal: GULL WING

The gull wing terminal design facilitates easy soldering and reworking during the assembly process.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures stable and efficient operation of the FPGA.

No. of Terminals: 144

The abundance of terminals offers flexibility in connecting external components and peripherals to the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC allows for customizable logic functions, making it versatile for various applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The diverse package styles cater to different mounting and cooling requirements, enhancing compatibility and thermal performance.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures reliable operation even under fluctuating power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for the FPGA to be used in a variety of environments without compromising performance.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals enables high-density mounting on the PCB, saving space and improving signal integrity.

Organization: 10320 CLBS

The organizational structure of 10320 CLBs provides a well-defined architecture for implementing complex logic functions efficiently.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in harsh or cold environments.

Finishing Of Terminal Used: MATTE TIN

The matte tin finishing on the terminals offers excellent solderability and corrosion resistance for long-term reliability.

Position Of Terminal: QUAD

The quad position of terminals simplifies the routing of signals and enhances the overall signal integrity of the FPGA.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this FPGA can withstand moderate humidity levels during storage and assembly processes.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for compact and slim PCB designs, especially in space-constrained applications.

Width: 20 mm

The compact width makes this FPGA suitable for designs where space is a premium without compromising on functionality.

Maximum Clock Frequency: 472.5 MHz

The high maximum clock frequency enables the FPGA to operate at fast speeds, crucial for high-performance applications.

No. of Outputs: 94

The generous number of outputs offers versatility in driving external devices and signals, enhancing the connectivity options.

Length: 20 mm

The compact length of the FPGA makes it suitable for small form-factor designs while still maintaining high logic density.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3C10E144C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

10320

No. of Inputs:

94

No. of Outputs:

94

No. of CLBs:

10320

Maximum Clock Frequency:

472.5 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

10320 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

20 mm

Width:

20 mm

Maximum Seated Height:

1.6 mm

Package Equivalence Code:

QFP144,.87SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

144

Standards

JESD-30 Code:

R-PQFP-G144

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

EP3C10E144C8N Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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