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XC7A100T-1CSG324C

Xilinx

XC7A100T-1CSG324C by Xilinx

Xilinx XC7A100T-1CSG324C FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1098 MHz. Ideal for high-performance applications requiring fast processing speeds in compact designs with low power consumption.

Median Price

$158.920

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Farnell

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Mouser Electronics

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DigiKey

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Element14

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Digiode

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Nova Conductors

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Sensible Micro Corp

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Bristol Electronics

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AZTECH Wire

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Advanced Electronics

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Aztec Data Supply Inc.

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Corohmni

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Ampacity Inc.

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Semicontronic

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Corphita

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Continental Prestige Electronics

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Netroflash

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Lixinc

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Overview

Unlock the potential of your designs with the XC7A100T-1CSG324C by Xilinx, a cutting-edge FPGA that offers unparalleled quality and performance. As a leading manufacturer in the field, Xilinx ensures reliability and innovation in each product. With endless applications in various industries, this FPGA provides flexibility and customization like never before. Experience the value of speed, efficiency, and versatility that this advanced technology brings to your projects. Elevate your designs to new heights with the XC7A100T-1CSG324C by Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making this FPGA suitable for various applications.

No. of Logic Cells: 101440

High number of logic cells allows for complex designs and implementation of advanced algorithms, making this FPGA versatile and powerful.

Surface Mount: YES

Surface mount capability makes installation and integration of this FPGA easier and more convenient.

Maximum Supply Voltage: 1.05 V

Low maximum supply voltage reduces power consumption and heat generation, increasing efficiency of the device.

No. of CLBs: 7925

Large number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom circuits and optimizing performance.

No. of Inputs: 300

Abundance of input pins allows for interfacing with multiple external devices and sensors, enhancing connectivity and functionality.

Package Shape: SQUARE

Square package shape allows for efficient use of space and easy placement on circuit boards, enhancing overall design flexibility.

Form Of Terminal: BALL

Ball terminals provide reliable connections and facilitate soldering during assembly, ensuring robust and stable performance of the FPGA.

No. of Terminals: 324

Sufficient number of terminals enable versatile connectivity options and ease of integration with external components in a circuit.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this device offers reconfigurability, allowing users to adapt and modify the hardware for different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array with low profile and fine pitch design enhances signal integrity and reliability, crucial for high-speed and high-performance applications.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage enables operation in energy-efficient modes, prolonging battery life and reducing overall power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability and stability in various environmental conditions, making this FPGA suitable for industrial applications.

Pitch Of Terminal: 0.8 mm

Compact terminal pitch facilitates high-density packaging, enabling more functionality in a smaller footprint without compromising performance.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinatorial delay of CLBs ensures fast signal processing and minimal latency, critical for real-time applications and high-speed data processing.

Organization: 7925 CLBS

Organized structure with 7925 Configurable Logic Blocks enables systematic design implementation and efficient utilization of resources in the FPGA.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows for reliable operation in both extreme cold and hot conditions, suitable for a variety of deployment environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Tin/silver/copper terminal finish enhances solderability and conductivity, ensuring stable and secure connections for efficient operation of the FPGA.

Position Of Terminal: BOTTOM

Bottom positioning of terminals simplifies board layout and routing of connections, optimizing space utilization and facilitating easier assembly processes.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the device can withstand moderate exposure to moisture during handling and storage without compromising performance.

Maximum Seated Height: 1.5 mm

Low seated height allows for compact and slim designs, ideal for space-constrained applications where height clearance is limited.

Width: 15 mm

Compact width dimension enables efficient placement on circuit boards and facilitates tight spacing in densely populated electronic systems.

Maximum Clock Frequency: 1098 MHz

High maximum clock frequency supports rapid data processing and enhances overall performance capabilities, crucial for demanding computational tasks.

No. of Outputs: 300

Abundance of output pins allows for driving multiple external devices and signaling, enhancing versatility and functionality of the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper solder reflow and reliable connections during assembly processes for robust device performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance supports lead-free soldering processes and ensures durability of the FPGA under elevated thermal conditions.

Length: 15 mm

Compact length dimension facilitates space-efficient board design and layout, enabling integration of the FPGA in smaller form factors.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A100T-1CSG324C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

101440

No. of Inputs:

300

No. of Outputs:

300

No. of CLBs:

7925

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

7925 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A100T-1CSG324C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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