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XC6SLX4-2CSG225I

Xilinx

XC6SLX4-2CSG225I by Xilinx

Xilinx XC6SLX4-2CSG225I is a FPGA with 3840 logic cells, 300 CLBs, and 120 inputs/outputs. Operating at max frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range from -40 to 100°C.

Median Price

$31.605

Lifecycle Status

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Mouser Electronics

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DigiKey

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Digiode

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France . 623 parts In-Stock

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Nova Conductors

Japan . 19 parts In-Stock

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Bristol Electronics

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PC Components Company LLC

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AZTECH Wire

Italy . 733 parts In-Stock

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Vigor

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Semicontronic

India . 177 parts In-Stock

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Ampacity Inc.

Singapore . 23 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Microchip USA

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Netroflash

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MARBEL Systems

Belgium . 95 parts In-Stock

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Texas Native Microelectronics

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Corohmni

South Africa . 250 parts In-Stock

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Kenton Components

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Modulus Dynamics

Lithuania . 794 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

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Lixinc

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Qasali Group International

UK . 17 parts In-Stock

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$209.551

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Overview

Unlock endless possibilities with the XC6SLX4-2CSG225I by Xilinx, a top-tier manufacturer in the Field Programmable Gate Arrays (FPGA) category. With 3840 logic cells and 300 CLBs, this FPGA offers unparalleled performance and flexibility for your projects. Its advanced CMOS technology ensures reliability and efficiency, while the low profile grid array package design makes it easy to integrate. Whether you're working on IoT devices, robotics, or telecommunications systems, this FPGA will elevate your designs to new heights. Experience the value and innovation that only Xilinx can deliver with the XC6SLX4-2CSG225I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective housing for the FPGA.

No. of Logic Cells: 3840

Offers a high level of programmable logic for complex applications.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort.

Maximum Supply Voltage: 1.26 V

Provides a stable power supply for the FPGA to operate efficiently.

Technology Used: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

No. of Inputs: 120

Offers a sufficient number of inputs for versatile connectivity.

Package Shape: SQUARE

Facilitates easy PCB layout and provides a compact form factor.

Nominal Supply Voltage (V): 1.2

Maintains a consistent voltage level for stable performance.

Power Supplies (V): 1.2,2.5/3.3

Supports multiple power supply options for flexibility in design.

No. of Terminals: 225

Provides ample connection points for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Enables reprogrammability for adapting to different functions or requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances reliability, thermal performance, and signal integrity of the FPGA.

Maximum Operating Temperature: 100 °C

Suitable for industrial environments with high temperature conditions.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in cold temperature environments.

Maximum Clock Frequency: 667 MHz

Supports high-speed processing for demanding applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX4-2CSG225I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

3840

No. of Inputs:

120

No. of Outputs:

120

No. of CLBs:

300

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

300 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

13 mm

Width:

13 mm

Maximum Seated Height:

1.4 mm

Package Equivalence Code:

BGA225,15X15,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

225

Standards

JESD-30 Code:

S-PBGA-B225

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX4-2CSG225I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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