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XC7A15T-2CPG236C

Xilinx

XC7A15T-2CPG236C by Xilinx

Xilinx XC7A15T-2CPG236C FPGA features 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data center infrastructure.

Median Price

$47.025

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5

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1k+

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Nova Conductors

Japan . 150 parts In-Stock

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Digiode

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Vyrian

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AZTECH Wire

Italy . 603 parts In-Stock

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Vigor

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One Stop Electronics

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Corphita

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Microchip USA

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Advanced Electronics

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Qasali Group International

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Corohmni

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Aztec Data Supply Inc.

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Overview

Unlock a world of endless possibilities with the XC7A15T-2CPG236C by Xilinx, a revolutionary Field Programmable Gate Array that boasts unparalleled quality and reliability. Manufactured by Xilinx, a renowned leader in FPGA technology, this device offers 16640 logic cells and a maximum clock frequency of 1286 MHz. Ideal for a wide range of applications, from telecommunications to automotive electronics, this FPGA delivers exceptional performance and flexibility. Experience the ultimate value and benefits of cutting-edge technology with the XC7A15T-2CPG236C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical strength and insulation, making the product durable and reliable.

No. of Logic Cells: 16640

High number of logic cells allow for complex designs and processing capabilities.

Surface Mount: YES

Enables easy mounting on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.05 V

Operates at low voltage, reducing power consumption and heat dissipation.

No. of CLBs: 1300

Provides a balance between logic cell count and flexibility for various applications.

No. of Inputs: 250

Offers a high number of input ports for interfacing with external devices and sensors.

Package Shape: SQUARE

Square shape allows for efficient use of PCB real estate and easier alignment during manufacturing.

Form Of Terminal: BALL

Ball terminals provide reliable connections and allow for easy rework if needed.

No. of Terminals: 236

Provides sufficient connectivity options for interfacing with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA allows for reprogramming of logic functions, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array packaging with low profile and fine pitch design enhances signal integrity and reduces signal delay.

Minimum Supply Voltage: 0.95 V

Allows for operation at even lower power levels to conserve energy.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ideal for rugged industrial environments.

Pitch Of Terminal: 0.5 mm

Fine pitch terminals allow for high-density interconnections, saving board space and enabling high-speed data transfer.

Maximum Combinatorial Delay of a CLB: 1.05 ns

Low delay ensures fast processing of logic functions for real-time applications.

Organization: 1300 CLBS

Organized structure of CLBs allows for efficient design implementation and routing of signals.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures without compromising performance or reliability.

Finishing Of Terminal Used: TIN SILVER COPPER

Provides good electrical conductivity and corrosion resistance for long-term reliability.

Position Of Terminal: BOTTOM

Bottom terminal placement simplifies PCB layout and routing for ease of assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling precautions in manufacturing.

Maximum Seated Height: 1.38 mm

Low seated height allows for compact designs and reduces overall profile of the product.

Width: 10 mm

Narrow width enables efficient use of board space and facilitates compact system designs.

Maximum Clock Frequency: 1286 MHz

High clock frequency allows for fast data processing and real-time operation in demanding applications.

No. of Outputs: 250

Offers a high number of output ports for driving external devices and interfacing with other components.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration during manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature tolerance ensures reliability during assembly processes without compromising performance.

Length: 10 mm

Compact length allows for space-efficient placement on PCBs and compact system designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A15T-2CPG236C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

16640

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

1300

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Organization:

1300 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

10 mm

Width:

10 mm

Maximum Seated Height:

1.38 mm

Package Equivalence Code:

BGA236,19X19,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

236

Standards

JESD-30 Code:

S-PBGA-B236

JESD-609 Code:

e1

Trade Compliance

XC7A15T-2CPG236C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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