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XC7A200T-3FFG1156E

Xilinx

XC7A200T-3FFG1156E by Xilinx

The Xilinx XC7A200T-3FFG1156E is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

Median Price

$529.595

Lifecycle Status

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Mouser Electronics

USA . 32 parts In-Stock

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DigiKey

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Avnet

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Digiode

USA . 336 parts In-Stock

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VNN

France . 267 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Vyrian

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Netsource Technology, Inc.

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AZTECH Wire

Italy . 577 parts In-Stock

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$13.878

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Modulus Dynamics

Lithuania . 221 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Texas Native Microelectronics

USA . 30 parts In-Stock

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$111.942

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Corohmni

South Africa . 408 parts In-Stock

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Aztec Data Supply Inc.

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Vigor

Singapore . 308 parts In-Stock

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One Stop Electronics

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$428.700

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Ampacity Inc.

Singapore . 1 parts In-Stock

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Semicontronic

India . 1 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

USA . 668 parts In-Stock

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$499.331

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Netroflash

USA . 50 parts In-Stock

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Lixinc

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Lucentia Tech

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MARBEL Systems

Belgium . 1,089 parts In-Stock

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Supply Digital

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Perfect Parts

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RC Electronics

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Kenton Components

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Qasali Group International

UK . 10 parts In-Stock

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$311.994

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$285.994

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$285.994

Overview

Experience the cutting-edge technology of the XC7A200T-3FFG1156E by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). With over 215,000 logic cells and 16,825 CLBs, this FPGA offers unparalleled versatility for a wide range of applications. From high-performance computing to telecommunications, the XC7A200T-3FFG1156E provides exceptional value with its advanced features and reliability. Elevate your projects with this innovative product, designed to meet the demands of today's dynamic digital landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material suitable for various applications.

No. of Logic Cells: 215360

High number of logic cells allows for complex designs and processing capabilities.

Surface Mount: YES

Easy to mount on circuit boards for efficient assembly.

Maximum Supply Voltage: 1.05 V

Efficient power consumption at a maximum supply voltage.

No. of CLBs: 16825

Abundance of Configurable Logic Blocks for versatile programming options.

No. of Inputs: 500

High number of inputs for a wide range of input signals and data processing.

Package Shape: SQUARE

Compact and space-saving design for efficient PCB layout.

Form Of Terminal: BALL

Allows for easy and secure connection to other components or PCB.

No. of Terminals: 1156

Sufficient number of terminals for various interfacing requirements.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Flexibility in programming and reconfiguring functionality as needed.

Package Style (Meter): GRID ARRAY

Organized grid array layout for systematic placement and routing of signals.

Minimum Supply Voltage: 0.95 V

Operational at low supply voltage for energy efficiency.

Maximum Operating Temperature: 100 °C

Capable of operating in high-temperature environments without performance degradation.

Pitch Of Terminal: 1 mm

Optimal distance between terminals for efficient signal transfer.

Maximum Combinatorial Delay of a CLB: 0.94 ns

Low delay in logic operations for fast processing speeds.

Organization: 16825 CLBS

Well-organized CLBs for structured design implementation.

Minimum Operating Temperature: 0 °C

Operational even at sub-zero temperatures for versatile usage scenarios.

Finishing Of Terminal Used: TIN SILVER COPPER

High-quality terminal finishing for reliable and durable connections.

Position Of Terminal: BOTTOM

Convenient terminal placement for easy integration into circuit boards.

Moisture Sensitivity Level (MSL): 4

Resistant to moisture damage for long-term reliability.

Maximum Seated Height: 3.1 mm

Low-profile design for compact system integration.

Width: 35 mm

Optimal width for fitting into standard PCB layouts.

Maximum Clock Frequency: 1412 MHz

High clock frequency for rapid data processing and real-time applications.

No. of Outputs: 500

Plenty of output channels for transmitting processed data efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of withstanding peak reflow temperatures for soldering processes.

Peak Reflow Temperature °C: 245

High peak reflow temperature tolerance for secure solder joints.

Length: 35 mm

Optimal length for fitting into compact electronic devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A200T-3FFG1156E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

215360

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

16825

Maximum Clock Frequency:

1412 MHz

CLB Maximum Delay:

0.94 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

16825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.1 mm

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A200T-3FFG1156E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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