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XC6SLX9-2FTG256C

Xilinx

XC6SLX9-2FTG256C by Xilinx

XC6SLX9-2FTG256C by Xilinx is a CMOS-based FPGA with 9152 logic cells and 715 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring programmable ICs for high-speed data processing.

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Overview

Discover the power of the XC6SLX9-2FTG256C by Xilinx, the leading manufacturer in the field programmable gate array (FPGA) industry. With its cutting-edge technology and high-quality design, this FPGA offers unparalleled performance for a wide range of applications. Whether you're working on robotics, telecommunications, or aerospace projects, the XC6SLX9-2FTG256C delivers exceptional speed and versatility. Say goodbye to limitations and hello to endless possibilities with this innovative product. Experience the value, benefits, and advantages that Xilinx brings to the table and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and resistance, making this FPGA suitable for various applications.

No. of Logic Cells: 9152

With a high number of logic cells, this FPGA offers a large capacity for implementing complex digital circuits, making it ideal for demanding projects.

Surface Mount: YES

Being surface mount compatible allows for easy soldering and integration onto circuit boards, enhancing the convenience and versatility of this FPGA.

Maximum Supply Voltage: 1.26 V

The FPGA's ability to operate at a maximum supply voltage of 1.26V improves power efficiency while providing a stable performance across a range of applications.

No. of CLBs: 715

The presence of 715 configurable logic blocks allows for flexible and versatile circuit design, enabling the adaptation to a variety of project requirements.

Technology Used: CMOS

The utilization of CMOS technology ensures reliable and efficient digital circuit functionality, resulting in improved performance and reduced power consumption.

No. of Inputs: 186

With 186 input pins, this FPGA can accommodate a broad range of input signals, facilitating the processing of multiple data streams simultaneously.

Package Shape: SQUARE

The square package shape offers excellent space utilization, making this FPGA more compact without compromising its functionality.

Form of Terminal: BALL

The use of ball terminals ensures reliable electrical connections and simplifies the assembly process, enhancing the overall performance and ease of integration.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V provides compatibility with industry-standard power sources, making it easy to integrate into existing systems.

Power Supplies (V): 1.2,2.5/3.3

Accommodating multiple power supply voltages (1.2V, 2.5V, and 3.3V) allows for versatile usage scenarios, expanding the potential applications of this FPGA.

No. of Terminals: 256

The high number of terminals facilitates sufficient connectivity options for various input and output configurations, ensuring compatibility with a wide range of systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The field programmability of this integrated circuit type offers flexibility, allowing users to reconfigure and adapt the FPGA for different tasks and applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array package style with a low profile design optimizes the use of space and promotes efficient heat dissipation, enhancing the performance and reliability of the FPGA.

Minimum Supply Voltage: 1.14 V

With a low minimum supply voltage requirement of 1.14V, this FPGA can operate under reduced power conditions while maintaining stable and reliable performance.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85°C allows for deployment in demanding environments while ensuring the FPGA's performance and reliability.

Pitch Of Terminal: 1 mm

The 1mm pitch of the terminals creates a compact and efficient design, making it easier to integrate the FPGA into space-constrained projects.

Maximum Combinatorial Delay of a CLB: 0.26 ns

The low maximum combinatorial delay of 0.26ns in each configurable logic block ensures fast and efficient processing, enabling real-time applications.

Organization: 715 CLBS

The FPGA's organization of 715 configurable logic blocks offers a high degree of flexibility in designing complex digital circuits, making it suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

Able to operate at a minimum of 0°C, this FPGA provides reliability and performance even in challenging temperature conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin silver copper finishing on the terminals improves electrical conductivity and prevents oxidation, ensuring the longevity and stability of the FPGA.

Position Of Terminal: BOTTOM

The placement of terminals on the bottom side of the FPGA facilitates board-level connections and simplifies integration with other components, enhancing the ease of use.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA can withstand normal moisture exposure during typical handling and assembly processes, ensuring reliability.

Maximum Seated Height: 1.55 mm

The low maximum seated height of 1.55mm minimizes the overall size and space requirements, making this FPGA suitable for compact and space-constrained designs.

Width: 17 mm

The width of 17mm allows for easy integration into various circuit board layouts, providing flexibility in designing projects utilizing the FPGA.

Maximum Clock Frequency: 667 MHz

With a high maximum clock frequency of 667MHz, this FPGA enables rapid data processing and supports high-performance computing applications.

No. of Outputs: 186

With 186 output pins, this FPGA can handle multiple output signals, allowing for the generation of complex digital results and efficient signal routing.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a maximum time of 30 seconds at peak reflow temperature ensures reliable soldering and assembly processes, guaranteeing the FPGA's long-term performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C provides compatibility with industry-standard processes, making it easier to integrate this FPGA into existing manufacturing workflows.

Length: 17 mm

The length of 17mm ensures the FPGA's compatibility with various board layouts and designs, promoting ease of integration and facilitating the overall project development.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX9-2FTG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

9152

No. of Inputs:

186

No. of Outputs:

186

No. of CLBs:

715

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

715 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX9-2FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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