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XC6SLX9-2FTG256I

Xilinx

XC6SLX9-2FTG256I by Xilinx

Xilinx XC6SLX9-2FTG256I FPGA features 9152 logic cells, 715 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

Median Price

$44.240

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Overview

Unleash the power of innovation with Xilinx's XC6SLX9-2FTG256I Field Programmable Gate Array. With a robust package body material and cutting-edge technology, this FPGA offers unparalleled performance and reliability for a wide range of applications. From industrial automation to telecommunications, this versatile device boasts 9152 logic cells and 715 CLBs, providing customers with endless possibilities to optimize their designs. Experience the value of customization and efficiency with Xilinx's top-of-the-line FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product.

No. of Logic Cells: 9152

High number of logic cells allows for complex logic operations to be implemented.

Surface Mount: YES

Allows for easy and secure mounting on PCBs.

Maximum Supply Voltage: 1.26 V

Optimal supply voltage for stable operation of the FPGA.

Technology Used: CMOS

CMOS technology provides low power consumption and high noise immunity.

No. of Inputs: 186

Sufficient number of inputs for versatile input configurations.

Package Shape: SQUARE

Square shape allows for compact placement on the PCB.

Form Of Terminal: BALL

Ball terminal design for easy soldering and connection.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage for reliable operation.

Power Supplies (V): 1.2,2.5/3.3

Support for multiple power supply options for flexibility.

No. of Terminals: 256

Adequate number of terminals for connections and configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA allows for reconfiguration of logic functions as needed.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array style for efficient layout and low profile for compact design.

Minimum Supply Voltage: 1.14 V

Ensures operational stability even at lower supply voltages.

Maximum Operating Temperature: 100 °C

Can withstand high operating temperatures for various applications.

Pitch Of Terminal: 1 mm

Optimal pitch size for easy assembly and connectivity.

Maximum Combinatorial Delay of a CLB: 0.26 ns

Low combinatorial delay ensures fast logic operations.

Organization: 715 CLBS

Organized structure of CLBs for efficient logic implementation.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures for versatile use.

Finishing Of Terminal Used: TIN SILVER COPPER

Durable terminal finishing for reliable connections.

Position Of Terminal: BOTTOM

Bottom terminal position for easy PCB mounting.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard handling.

Maximum Seated Height: 1.55 mm

Low seated height for compact PCB designs.

Width: 17 mm

Narrow width for space-efficient integration.

Maximum Clock Frequency: 667 MHz

High clock frequency for rapid processing of data.

No. of Outputs: 186

Sufficient number of outputs for versatile logic operations.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for proper reflow during assembly with precise timing.

Peak Reflow Temperature °C: 260

High peak reflow temperature for secure soldering.

Length: 17 mm

Compact length for space-saving PCB layouts.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating for reliable performance in harsh environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX9-2FTG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

9152

No. of Inputs:

186

No. of Outputs:

186

No. of CLBs:

715

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

715 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX9-2FTG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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