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XC6SLX16-2FTG256I

Xilinx

XC6SLX16-2FTG256I by Xilinx

The Xilinx XC6SLX16-2FTG256I is a FPGA with 14579 logic cells, 1139 CLBs, and 186 inputs/outputs. It operates at max frequency of 667 MHz, suitable for industrial applications requiring high-speed processing. With a package style of grid array and low profile, it offers flexibility in design while maintaining a compact form factor.

Median Price

$59.600

Lifecycle Status

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Farnell

UK . 12 parts In-Stock

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Newark

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Mouser Electronics

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DigiKey

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Element14

Singapore . 22 parts In-Stock

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Digiode

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VNN

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Nova Conductors

Japan . 10 parts In-Stock

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Cyclops Electronics Ltd

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Touchstone Systems

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Bristol Electronics

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Semi Source

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LIBRA Elektronik GmbH

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NexGen Digital

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Technoshack Inc.

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AZTECH Wire

Italy . 822 parts In-Stock

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$18.587

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Vigor

Singapore . 804 parts In-Stock

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Semicontronic

India . 311 parts In-Stock

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$39.270

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Ampacity Inc.

Singapore . 47 parts In-Stock

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Corphita

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Microchip USA

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Modulus Dynamics

Lithuania . 915 parts In-Stock

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Corohmni

South Africa . 1,059 parts In-Stock

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Texas Native Microelectronics

USA . 75 parts In-Stock

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Advanced Electronics

New Zealand . 774 parts In-Stock

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Lixinc

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MARBEL Systems

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Perfect Parts

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A-Z Elektronik GmbH

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Argo Parts USA

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Formix International (Excess)

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Supply Digital

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Robosynatics

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Lucentia Tech

USA . 1,500 parts In-Stock

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Qasali Group International

UK . 833 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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RC Electronics

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Kepictronics

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Infinite Electronics LLP (Excess)

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Kenton Components

USA . 50 parts In-Stock

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Overview

Unlock limitless possibilities with the XC6SLX16-2FTG256I by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). With 14579 logic cells and 1139 CLBs, this FPGA offers unparalleled flexibility and performance. Ideal for industrial applications, this FPGA boasts a maximum clock frequency of 667 MHz and a wide operating temperature range. Whether you're designing cutting-edge electronics or optimizing automation systems, the XC6SLX16-2FTG256I delivers unmatched value and reliability. Elevate your projects to new heights with Xilinx's top-notch quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the FPGA lightweight and durable, suitable for various applications.

No. of Logic Cells: 14579

With a high number of logic cells, this FPGA offers greater flexibility and performance for complex logic designs.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage requirement helps in reducing power consumption and heat dissipation in the system.

Technology Used: CMOS

CMOS technology enables low power consumption, high speed, and compatibility with a wide range of applications.

Package Shape: SQUARE

The square package shape provides a compact design, making it easier to integrate the FPGA into various systems and PCB layouts.

Nominal Supply Voltage (V): 1.2

With a nominal supply voltage of 1.2V, this FPGA is optimized for efficient power usage and performance.

Power Supplies (V): 1.2,2.5/3.3

Support for multiple power supply voltages allows for compatibility with different system requirements and designs.

No. of Terminals: 256

Having a high number of terminals facilitates easy connectivity and integration within a circuit, offering flexibility in design.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals enables high-density mounting, saving space on the PCB and allowing for more functionality in a smaller area.

Maximum Clock Frequency: 667 MHz

With a high maximum clock frequency, this FPGA can handle complex operations and data processing at high speeds.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this FPGA is suitable for industrial environments with moderate exposure to moisture.

Maximum Seated Height: 1.55 mm

The low maximum seated height allows for a compact and slim design, suitable for space-constrained applications.

Grading Of Temperature: INDUSTRIAL

Being rated for industrial temperature ranges ensures reliable performance in harsh environmental conditions and extended operating temperatures.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX16-2FTG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

14579

No. of Inputs:

186

No. of Outputs:

186

No. of CLBs:

1139

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1139 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX16-2FTG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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