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LFD2NX-40-9BG256I

Lattice Semiconductor

LFD2NX-40-9BG256I by Lattice Semiconductor

LFD2NX-40-9BG256I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 111 inputs/outputs, and uses a grid array package. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.

Median Price

$88.900

Lifecycle Status

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Verical

USA . 107 parts In-Stock

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Mouser Electronics

USA . 31 parts In-Stock

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$88.900

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$77.450

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DigiKey

USA . 69 parts In-Stock

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$78.870

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Nova Conductors

Japan . 73 parts In-Stock

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Chip Stock

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Vyrian

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AZTECH Wire

Italy . 857 parts In-Stock

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Vigor

Singapore . 1,175 parts In-Stock

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Ampacity Inc.

Singapore . 148 parts In-Stock

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Bastille Electronics

Australia . 53 parts In-Stock

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$68.856

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$64.507

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Continental Prestige Electronics

USA . 2,400 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Semicontronic

India . 34 parts In-Stock

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Corohmni

South Africa . 47 parts In-Stock

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Aztec Data Supply Inc.

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GreenTree Electronics

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Overview

Unlock limitless possibilities with the LFD2NX-40-9BG256I from Lattice Semiconductor. This top-quality Field Programmable Gate Array offers unmatched flexibility and performance, making it ideal for a wide range of applications. With its advanced technology and reliable design, this FPGA delivers exceptional value and benefits to customers seeking cutting-edge solutions. Trust in Lattice Semiconductor's reputation for excellence and innovation, and elevate your projects with the LFD2NX-40-9BG256I today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 39000

Large number of logic cells allow for complex designs and high performance.

Surface Mount: YES

Allows for easy installation onto circuit boards.

Maximum Supply Voltage: 1.05 V

Offers efficient power consumption and compatibility with other components.

No. of CLBs: 9750

Plenty of Configurable Logic Blocks for versatile programming options.

Technology Used: FDSOI

Utilizes Fully Depleted Silicon On Insulator technology for improved performance.

No. of Inputs: 111

Sufficient number of inputs for connecting to external devices and sensors.

Package Shape: SQUARE

Optimal shape for efficient use of space on circuit boards.

No. of Terminals: 256

Provides ample connection points for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for customization and reprogramming of logic functions.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables compact and low-profile design for space-constrained applications.

Minimum Supply Voltage: 0.95 V

Supports lower power operation and extended battery life.

Maximum Operating Temperature: 100 °C

Can withstand high temperature environments for reliable operation.

Pitch Of Terminal: 0.8 mm

Close terminal spacing allows for more terminals in a given area.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions without issue.

Finishing Of Terminal Used: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for reliable connections.

Position Of Terminal: BOTTOM

Facilitates easy access and connection to other components on the circuit board.

Moisture Sensitivity Level (MSL): 3

Withstands exposure to moderate levels of moisture without damage.

Maximum Seated Height: 1.7 mm

Low profile design allows for compact assembled size.

Width: 14 mm

Sufficient width for accommodating necessary circuitry and connections.

No. of Outputs: 111

Balanced number of outputs to match the inputs for processing and control.

Maximum Time At Peak Reflow Temperature (s): 30

Provides adequate time for precise solder reflow during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature ensures secure and reliable solder connections.

Length: 14 mm

Compact length for flexibility in board layout and design.

Grading Of Temperature: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFD2NX-40-9BG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

39000

No. of Inputs:

111

No. of Outputs:

111

No. of CLBs:

9750

Technology:

FDSOI

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Package Equivalence Code:

BGA256,16X16,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

LFD2NX-40-9BG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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