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LFD2NX-40-7MG121C

Lattice Semiconductor

LFD2NX-40-7MG121C by Lattice Semiconductor

Lattice Semiconductor's LFD2NX-40-7MG121C FPGA features 39000 logic cells, FDSOI technology, and 9750 CLBs. Ideal for applications requiring high performance in a compact form factor with a max supply voltage of 1.05 V and operating temperature up to 85°C.

Median Price

$55.070

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 480 parts In-Stock

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$36.030

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$30.190

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Arrow

USA . 484 parts In-Stock

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$50.210

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$43.830

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Verical

USA . 484 parts In-Stock

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$50.210

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$43.830

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Mouser Electronics

USA . 475 parts In-Stock

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$55.070

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$46.000

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Newark

USA . 470 parts In-Stock

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$55.110

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$46.200

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DigiKey

USA . 686 parts In-Stock

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$58.850

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$47.465

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Element14

Singapore . 480 parts In-Stock

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$63.780

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Nova Conductors

Japan . 450 parts In-Stock

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$37.776

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Chip Stock

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Vyrian

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Ampacity Inc.

Singapore . 362 parts In-Stock

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$27.160

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Semicontronic

India . 203 parts In-Stock

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$27.160

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$26.481

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$26.345

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Continental Prestige Electronics

USA . 480 parts In-Stock

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$37.260

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Bastille Electronics

Australia . 500 parts In-Stock

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$37.780

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$35.891

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$33.624

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$37.780

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$33.624

Microchip USA

USA . 1,758 parts In-Stock

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$37.875

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Aztec Data Supply Inc.

USA . 197 parts In-Stock

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$68.720

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Corohmni

South Africa . 460 parts In-Stock

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$82.522

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Argo Parts USA

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Overview

Unlock endless possibilities with the LFD2NX-40-7MG121C by Lattice Semiconductor, a cutting-edge Field Programmable Gate Array that boasts 39,000 logic cells and 9,750 CLBs. From its advanced FDSOI technology to its versatile square package shape, this FPGA is designed for optimal performance in a wide range of applications. With a maximum operating temperature of 85°C and a minimum supply voltage of 0.95V, this high-quality product offers unmatched reliability and efficiency. Transform your projects with the LFD2NX-40-7MG121C and experience the innovation and value that only Lattice Semiconductor can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FPGA, ensuring reliable performance.

No. of Logic Cells: 39000

With a high number of logic cells, this FPGA can handle complex logic functions and calculations, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable, this FPGA is easier to install and requires less space on a circuit board, making it a convenient choice for compact electronic designs.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures efficient power consumption and helps prevent damage to the FPGA, contributing to its longevity.

Technology Used: FDSOI

Utilizing FDSOI technology, this FPGA offers improved performance, reduced power consumption, and enhanced reliability compared to traditional technologies.

No. of Inputs: 23

With 23 inputs, this FPGA can handle multiple input signals simultaneously, enabling complex data processing and communication in electronic systems.

Package Shape: SQUARE

The square package shape provides a uniform footprint for the FPGA, making it easier to integrate into circuit board layouts and reducing design complexity.

Form Of Terminal: BALL

The ball terminal design ensures secure connections and reliable signal transmission between the FPGA and other components, enhancing overall system performance.

No. of Terminals: 121

With 121 terminals, this FPGA offers ample connectivity options, allowing for versatile integration with external devices and components in electronic systems.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95 V enables energy-efficient operation and reduces power consumption, making this FPGA suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding thermal conditions, enhancing the overall durability of the FPGA.

Pitch Of Terminal: 0.5 mm

The 0.5 mm pitch of the terminals allows for compact and efficient circuit board layouts, reducing signal interference and improving overall system reliability.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance in cold environments, making this FPGA suitable for a wide range of applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing ensures high conductivity, corrosion resistance, and reliable connections, enhancing the overall performance and longevity of the FPGA.

Position Of Terminal: BOTTOM

Placing the terminals at the bottom of the FPGA allows for easy and secure connections, simplifying the integration process and ensuring stable signal transmission in electronic systems.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FPGA can withstand moderate levels of moisture exposure, making it suitable for use in various environmental conditions without compromising performance.

Maximum Seated Height: 1 mm

The maximum seated height of 1 mm ensures a compact and low-profile design for the FPGA, making it suitable for space-constrained applications and electronic devices.

Width: 6 mm

The 6 mm width of the FPGA allows for efficient integration into circuit board layouts, maximizing space utilization and enabling compact electronic designs.

No. of Outputs: 23

With 23 outputs, this FPGA can drive multiple output signals concurrently, facilitating efficient data processing and communication in electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and secure attachment of the FPGA to the circuit board, preventing connection issues and ensuring reliable performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering and secure mounting of the FPGA on the circuit board, ensuring stable connections and reliable operation.

Length: 6 mm

The 6 mm length of the FPGA provides a compact footprint for space-efficient designs, making it suitable for small electronic devices and applications where size constraints are a consideration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFD2NX-40-7MG121C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

39000

No. of Inputs:

23

No. of Outputs:

23

No. of CLBs:

9750

Technology:

FDSOI

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

6 mm

Width:

6 mm

Maximum Seated Height:

1 mm

Package Equivalence Code:

BGA121,11X11,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

121

Standards

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Trade Compliance

LFD2NX-40-7MG121C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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