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LFD2NX-17-7MG121I

Lattice Semiconductor

LFD2NX-17-7MG121I by Lattice Semiconductor

LFD2NX-17-7MG121I by Lattice Semiconductor is a 17000 Logic Cells FPGA with FDSOI tech. It operates at 1.05V max, -40 to 100°C temp range, and 0.5mm terminal pitch. Suitable for industrial applications requiring high-density programmable ICs in a compact grid array package style.

Median Price

$21.385

Lifecycle Status

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9

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Arrow

USA . 490 parts In-Stock

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Verical

USA . 490 parts In-Stock

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$18.320

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$15.290

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Mouser Electronics

USA . 403 parts In-Stock

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DigiKey

USA . 388 parts In-Stock

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$26.900

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$21.670

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Flip Electronics (Authorized)

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Nova Conductors

Japan . 300 parts In-Stock

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Flip Electronics

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Vyrian

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Ampacity Inc.

Singapore . 16,099 parts In-Stock

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Continental Prestige Electronics

USA . 4,383 parts In-Stock

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Microchip USA

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Advanced Electronics

New Zealand . 99 parts In-Stock

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Semicontronic

India . 15,998 parts In-Stock

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$30.371

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Aztec Data Supply Inc.

USA . 89 parts In-Stock

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Corohmni

South Africa . 245 parts In-Stock

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Argo Parts USA

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Overview

Discover the cutting-edge LFD2NX-17-7MG121I by Lattice Semiconductor, a top-tier manufacturer in the field programmable gate array (FPGA) category. With 17000 logic cells and 4250 CLBs, this FPGA offers unparalleled performance and versatility. Its innovative FDSOI technology and ultra-thin profile make it ideal for a range of applications. From industrial automation to consumer electronics, this product delivers value, efficiency, and reliability. Embrace the future of technology with the LFD2NX-17-7MG121I and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the FPGA, ensuring reliable performance in various operating conditions.

No. of Logic Cells: 17000

With a large number of logic cells, this FPGA can handle complex logic functions and tasks efficiently.

Surface Mount: YES

Surface mount design allows for easy and secure installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05V helps in reducing power consumption while maintaining optimal performance.

Technology Used: FDSOI

FDSOI technology offers improved power efficiency and performance, making this FPGA a suitable choice for energy-efficient applications.

No. of Inputs: 23

Having 23 inputs allows for flexibility in connecting various external devices and sensors to the FPGA.

Package Shape: SQUARE

Square package shape enables efficient use of PCB space and facilitates uniform heat dissipation for better thermal management.

Form Of Terminal: BALL

Ball terminal design ensures reliable connectivity and ease of soldering during assembly processes.

No. of Terminals: 121

Having 121 terminals provides ample connectivity options for interfacing with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers versatility and adaptability for custom logic implementations without the need for specialized hardware.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95V allows for low-power operation and extended battery life in portable devices.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand elevated temperatures in industrial environments without compromising performance.

Pitch Of Terminal: 0.5 mm

A fine pitch of 0.5mm between terminals allows for high-density mounting on PCBs, enabling compact design layouts.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures reliable performance in harsh cold environments or during startup conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Terminal finishing with tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability for long-term reliability.

Position Of Terminal: BOTTOM

Bottom terminal placement simplifies PCB routing and assembly, making it easier to integrate the FPGA into the overall system design.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this FPGA can withstand moderate exposure to moisture during storage and assembly processes without affecting performance.

Maximum Seated Height: 1 mm

With a low seated height of 1mm, this FPGA contributes to reducing overall system profile and enables compact device designs.

Width: 6 mm

The compact width of 6mm makes this FPGA suitable for applications where space constraints are a concern.

No. of Outputs: 23

Having 23 outputs allows for efficient signaling and data transmission from the FPGA to external devices or components.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this FPGA can undergo robust solder reflow processes during assembly without damage.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable solder joints and secure connections during PCB assembly processes.

Length: 6 mm

Compact length of 6mm contributes to the overall small form factor of the FPGA, ideal for space-constrained applications.

Grading Of Temperature: INDUSTRIAL

Designed for industrial-grade operations, this FPGA can withstand extended temperature ranges and harsh environmental conditions in demanding applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFD2NX-17-7MG121I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

17000

No. of Inputs:

23

No. of Outputs:

23

No. of CLBs:

4250

Technology:

FDSOI

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

6 mm

Width:

6 mm

Maximum Seated Height:

1 mm

Package Equivalence Code:

BGA121,11X11,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

121

Standards

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Trade Compliance

LFD2NX-17-7MG121I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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