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LFD2NX-17-9MG121C

Lattice Semiconductor

LFD2NX-17-9MG121C by Lattice Semiconductor

Lattice Semiconductor's LFD2NX-17-9MG121C FPGA offers 17000 logic cells, 4250 CLBs, and 23 inputs/outputs. Utilizes FDSOI technology for applications requiring high performance in a compact form factor. Ideal for projects needing a low-power solution with a max supply voltage of 1.05V.

Median Price

$27.040

Lifecycle Status

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6

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Mouser Electronics

USA . 471 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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$17.525

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Vyrian

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Continental Prestige Electronics

USA . 6,739 parts In-Stock

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Microchip USA

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Ampacity Inc.

Singapore . 539 parts In-Stock

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Corohmni

South Africa . 199 parts In-Stock

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Aztec Data Supply Inc.

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Argo Parts USA

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Overview

Unlock the potential of your projects with the LFD2NX-17-9MG121C FPGA by Lattice Semiconductor. With 17000 logic cells and advanced FDSOI technology, this power-packed device offers unparalleled performance and versatility. Ideal for a wide range of applications, from communications to automotive, this FPGA is designed to elevate your designs to new heights. Trust in Lattice Semiconductor's reputation for quality and innovation, and experience the value and benefits that only the LFD2NX-17-9MG121C can provide. Elevate your projects today with this top-of-the-line FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FPGA, ensuring long-term reliability.

No. of Logic Cells: 17000

With a high number of logic cells, this FPGA can handle complex computations and algorithms efficiently.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, reducing assembly time and costs.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

No. of CLBs: 4250

The large number of Configurable Logic Blocks (CLBs) provide flexibility in design and implementation of custom logic functions.

Technology Used: FDSOI

FDSOI technology offers improved performance, speed, and power efficiency compared to traditional silicon-based technologies.

No. of Inputs: 23

Sufficient number of input channels allow for multiple data sources to be processed simultaneously, enhancing overall system performance.

Package Shape: SQUARE

Square shape packaging ensures efficient use of space on a PCB, enabling compact and sleek designs for electronic devices.

Form Of Terminal: BALL

Ball terminals provide reliable connections and easy soldering during the assembly process, ensuring secure mounting on PCBs.

No. of Terminals: 121

A high number of terminals allow for versatile connectivity options, enabling diverse integration possibilities in various applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility for customization and reconfiguration without the need for hardware changes.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch allows for high density mounting, optimizing PCB real estate utilization.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage requirement enables operation in low-power environments and extends battery life for portable applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in challenging environmental conditions without thermal issues.

Pitch Of Terminal: 0.5 mm

The small pitch distance between terminals enables high-density interconnection and compact PCB layout for space-constrained designs.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature support allows for reliable operation even in cold environments, expanding the device's usability.

Finishing Of Terminal Used: TIN SILVER COPPER

Terminal finishing with tin, silver, and copper provides excellent solderability, conductivity, and corrosion resistance for long-lasting connections.

Position Of Terminal: BOTTOM

Bottom terminal position facilitates easy access and secure mounting on PCBs, ensuring stable electrical connections and mechanical support.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling precautions during storage and assembly to maintain component reliability.

Maximum Seated Height: 1 mm

The low seated height profile allows for thin and compact device designs, enabling sleek and space-saving electronic products.

Width: 6 mm

The compact width dimension provides flexibility in placement on a PCB and enables efficient use of available space in electronic systems.

No. of Outputs: 23

Sufficient number of output channels for delivering processed data, enabling diverse connectivity options and applications for the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time duration for peak reflow temperature ensures proper soldering and thermal management during assembly processes for reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance supports lead-free soldering processes, ensuring compliance with environmental regulations and industry standards.

Length: 6 mm

The compact length dimension allows for efficient placement and routing on a PCB, contributing to optimized circuit layout and design aesthetics.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFD2NX-17-9MG121C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

17000

No. of Inputs:

23

No. of Outputs:

23

No. of CLBs:

4250

Technology:

FDSOI

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

6 mm

Width:

6 mm

Maximum Seated Height:

1 mm

Package Equivalence Code:

BGA121,11X11,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

121

Standards

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Trade Compliance

LFD2NX-17-9MG121C Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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