Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Lattice Semiconductor's LFD2NX-17-9MG121C FPGA offers 17000 logic cells, 4250 CLBs, and 23 inputs/outputs. Utilizes FDSOI technology for applications requiring high performance in a compact form factor. Ideal for projects needing a low-power solution with a max supply voltage of 1.05V.
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This material provides durability and protection for the internal components of the FPGA, ensuring long-term reliability.
With a high number of logic cells, this FPGA can handle complex computations and algorithms efficiently.
Surface mount capability allows for easy integration onto printed circuit boards, reducing assembly time and costs.
The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.
The large number of Configurable Logic Blocks (CLBs) provide flexibility in design and implementation of custom logic functions.
FDSOI technology offers improved performance, speed, and power efficiency compared to traditional silicon-based technologies.
Sufficient number of input channels allow for multiple data sources to be processed simultaneously, enhancing overall system performance.
Square shape packaging ensures efficient use of space on a PCB, enabling compact and sleek designs for electronic devices.
Ball terminals provide reliable connections and easy soldering during the assembly process, ensuring secure mounting on PCBs.
A high number of terminals allow for versatile connectivity options, enabling diverse integration possibilities in various applications.
Being a field-programmable device, this FPGA offers flexibility for customization and reconfiguration without the need for hardware changes.
The grid array style with a thin profile and fine pitch allows for high density mounting, optimizing PCB real estate utilization.
Low minimum supply voltage requirement enables operation in low-power environments and extends battery life for portable applications.
The high maximum operating temperature range ensures reliable performance in challenging environmental conditions without thermal issues.
The small pitch distance between terminals enables high-density interconnection and compact PCB layout for space-constrained designs.
The low minimum operating temperature support allows for reliable operation even in cold environments, expanding the device's usability.
Terminal finishing with tin, silver, and copper provides excellent solderability, conductivity, and corrosion resistance for long-lasting connections.
Bottom terminal position facilitates easy access and secure mounting on PCBs, ensuring stable electrical connections and mechanical support.
MSL 3 indicates moderate sensitivity to moisture, requiring standard handling precautions during storage and assembly to maintain component reliability.
The low seated height profile allows for thin and compact device designs, enabling sleek and space-saving electronic products.
The compact width dimension provides flexibility in placement on a PCB and enables efficient use of available space in electronic systems.
Sufficient number of output channels for delivering processed data, enabling diverse connectivity options and applications for the FPGA.
The specified time duration for peak reflow temperature ensures proper soldering and thermal management during assembly processes for reliable connections.
The high peak reflow temperature tolerance supports lead-free soldering processes, ensuring compliance with environmental regulations and industry standards.
The compact length dimension allows for efficient placement and routing on a PCB, contributing to optimized circuit layout and design aesthetics.
Field Programmable Gate Arrays (FPGA) LFD2NX-17-9MG121C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor
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LFD2NX-17-9MG121C Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Top Mark Format Change 20/Dec/2023
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
1N4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
LL4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
Continental Device India
2N2222A
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Zetex Plc
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
Fairchild Semiconductor
Hitano Enterprise
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
1N4148WS
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
Dc Components
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
5CGXFC4F7M11C8N
Intel
Intel's 5CGXFC4F7M11C8N FPGA boasts 50000 logic cells, 129 inputs/outputs, and operates at a max temp of 85°C. Ideal for applications requiring high-speed data processing and complex algorithm implementation in industries like telecommunications and automotive.
10CL025YU256C8G
Intel's 10CL025YU256C8G FPGA features 1539 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high-performance computing in a compact form factor with a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.
10M25SAE144I7G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
EP2C5T144C8N
EP2C5T144C8N by Intel is a FPGA with 4608 logic cells, 288 CLBs, and 89 inputs. It operates at a max supply voltage of 1.25V and uses CMOS technology. Ideal for applications requiring high-speed data processing in compact designs.
EP4CE10E22C8N
EP4CE10E22C8N by Intel is a Field Programmable Gate Array (FPGA) with 10320 logic cells and 645 configurable logic blocks (CLBs). It operates at a max clock frequency of 472.5 MHz and is commonly used in applications requiring high-speed data processing and programmable logic functions.
M2GL010T-VFG256I
Microchip Technology
M2GL010T-VFG256I by Microchip Technology is a Field Programmable Gate Array (FPGA) with 256 terminals, operating voltage range of 1.14V to 1.26V, and peak reflow temperature of 260°C. It is suitable for industrial applications requiring low profile, fine pitch grid array packages with bottom terminal positioning.
XCAU10P-2UBVA368I
Xilinx
Xilinx XCAU10P-2UBVA368I FPGA features 96250 logic cells, 5500 CLBs, and 128 inputs/outputs. Ideal for applications requiring high-density programmable ICs in a compact GRID ARRAY package with low supply voltage and wide operating temperature range.
LFXP2-5E-5TN144C
Lattice Semiconductor
LFXP2-5E-5TN144C by Lattice Semiconductor is a 5000 logic cell FPGA with 625 CLBs, operating at max 435MHz. It has a supply voltage of 1.2V, suitable for applications requiring high-speed processing in compact designs like IoT devices and industrial automation systems.
5CGXFC7D6F31I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2 mm;
XCAU10P-L1UBVA368I
FIELD PROGRAMMABLE GATE ARRAY;
10M08DCF256I7G
The Intel 10M08DCF256I7G is an FPGA with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 1.15V to 1.25V and can withstand temperatures from -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
10M08SCU169A7G
The Intel 10M08SCU169A7G is a Field Programmable Gate Array with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 125°C. Ideal for automotive applications due to its high reliability and performance in harsh environments.
XC6SLX16-2CSG324I
Xilinx XC6SLX16-2CSG324I FPGA features 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide supply voltage range and low combinatorial delay, this FPGA offers versatile programmability for various electronic systems.
XC6SLX45-2CSG324C
The Xilinx XC6SLX45-2CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. Operating at up to 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a low profile grid array package style, it offers flexibility in design while maintaining reliability.
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
EP3C16F484C8N
EP3C16F484C8N by Intel is a CMOS FPGA with 15408 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, making it suitable for high-speed applications like telecommunications equipment and industrial automation systems. With a package style of grid array and moisture sensitivity level of 3, this FPGA offers versatile programmability in a compact form factor for various electronic designs.
EP1C4F324C8N
EP1C4F324C8N by Intel is a 4000 logic cell FPGA with 400 CLBs and 249 inputs/outputs. Operating at a max frequency of 275 MHz, it's ideal for applications requiring high-speed processing such as signal processing, networking, and industrial automation. With a compact square package style and low power consumption at 1.5V, it offers versatile programmability for various electronic designs.
M2S090TS-1FGG484I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
XC7K410T-2FFG900I
Xilinx XC7K410T-2FFG900I FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a grid array package style.
MPF100TS-1FCVG484I
MPF100TS-1FCVG484I by Microchip Tech is a CMOS FPGA with 284 inputs/outputs, operating temp range -40 to 100°C. It has a grid array package style, 0.8mm terminal pitch, and is suitable for applications requiring high-density programmable logic solutions.
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LFD2NX-40-7BG256C
Lattice Semiconductor's LFD2NX-40-7BG256C FPGA features 39000 logic cells, FDSOI technology, and 9750 CLBs. Ideal for applications requiring high performance with 111 inputs/outputs, low profile grid array package style, and operating temperatures from 0 to 85°C.
LFD2NX-40-8BG256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
LFD2NX-40-7BG196I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Shape: SQUARE; No. of CLBs: 9750;
LFD2NX-40-9BG256C
LFD2NX-40-8BG256I
LFD2NX-40-8BG256I by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 39,000 logic cells and 9,750 CLBs. It uses FDSOI technology and has a max supply voltage of 1.05V. This FPGA is suitable for industrial applications requiring high-performance programmable ICs.
LFD2NX-40-9BG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
LFD2NX-40-7BG196C
LFD2NX-40-7BG196C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w 0-85 °C, has 92 inputs/outputs, and uses 0.95-1.05 V supply voltage. Ideal for applications requiring high-performance programmable ICs in a compact square package with surface mount capability.
LFD2NX-40-7BG256I
LFD2NX-40-7MG121C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 121; Package Code: VFBGA; Package Shape: SQUARE;
LFD2NX-17-7MG121C
LFD2NX-17-8MG121C
LFD2NX-17-7MG121I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 121; Package Code: VFBGA; Package Shape: SQUARE;
LFD2NX-17-7MG121A
LFD2NX-17-8MG121I
LFD2NX-17-8MG121I by Lattice Semiconductor is a 17000 logic cell FPGA with FDSOI technology. It has 4250 CLBs, operates b/w -40 to 100 °C, and uses 0.5 mm pitch terminals. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
LFD2NX-40-7MG121I
LFD2NX-17-9MG121I
LFD2NX-40-9MG121I
LFD2NX-40-8MG121C
LFD2NX-40-9BG196I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Shape: SQUARE; Surface Mount: YES;
Supply Digital Components
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