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XC7A50T-L2CSG325E

Xilinx

XC7A50T-L2CSG325E by Xilinx

Xilinx XC7A50T-L2CSG325E FPGA features 52160 logic cells, 4075 CLBs, and operates at a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

Median Price

$128.270

Lifecycle Status

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6

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Mouser Electronics

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 538 parts In-Stock

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Aztec Data Supply Inc.

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Modulus Dynamics

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MARBEL Systems

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Advanced Electronics

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Vigor

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Texas Native Microelectronics

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

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Corphita

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Kenton Components

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Corohmni

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Continental Prestige Electronics

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Netroflash

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Qasali Group International

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Lucentia Tech

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Overview

Unlock endless possibilities with the XC7A50T-L2CSG325E by Xilinx, a top-tier Field Programmable Gate Array that boasts 52160 logic cells and 4075 CLBs. This cutting-edge FPGA, housed in a sleek GRID ARRAY package, offers unparalleled flexibility and customization for a wide range of applications. From high-speed data processing to advanced signal processing, this powerhouse device delivers reliable performance at an unbeatable value. Elevate your projects with Xilinx's innovative technology and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to heat and chemicals.

No. of Logic Cells: 52160

This high number of logic cells allows for complex programming and customization, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology makes the installation and replacement of this FPGA easier, saving time and effort in production processes.

Maximum Supply Voltage: 0.93 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making this FPGA energy-efficient.

No. of CLBs: 4075

The high number of Configurable Logic Blocks (CLBs) allows for versatile programmability and customization of the FPGA for specific tasks.

No. of Inputs: 250

Having a large number of inputs allows for the FPGA to interface with multiple external devices and receive a variety of input signals.

Package Shape: SQUARE

The square package shape provides a good balance between compact design and efficient use of space on a circuit board.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9 V is ideal for low-power applications while maintaining reliable performance.

Power Supplies (V): 0.9

Having consistent power supplies at 0.9 V ensures stable operation of the FPGA under varying load conditions.

No. of Terminals: 325

With a sufficient number of terminals, it allows for easy connectivity and integration of the FPGA into a larger system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility in design and quick turnaround for prototyping and testing.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style provides a compact form factor with a high pin density, facilitating a higher level of integration in designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A50T-L2CSG325E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

52160

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

4075

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.51 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

4075 CLBS

Additional Features:

Also Operates at 1 V nominal supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A50T-L2CSG325E Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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