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XC6SLX75-2CSG484I

Xilinx

XC6SLX75-2CSG484I by Xilinx

Xilinx XC6SLX75-2CSG484I FPGA features 74637 logic cells, 5831 CLBs, and max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs with a supply voltage range of 1.14V to 1.26V.

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$227.370

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Overview

Unlock the power of cutting-edge technology with the XC6SLX75-2CSG484I by Xilinx. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Xilinx delivers unparalleled quality and reliability. This versatile FPGA offers a myriad of applications, from telecommunications to industrial automation, providing customers with endless possibilities for innovation. Experience the value and benefits of this product, including high performance, efficient power consumption, and fast processing speeds. Trust Xilinx to deliver advanced solutions that drive your business forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good mechanical strength and durability, making the FPGA robust and reliable for various applications.

No. of Logic Cells: 74637

High number of logic cells provide ample resources for implementing complex logic functions and algorithms efficiently.

Surface Mount: YES

Surface mount configuration allows for easier integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation, enhancing energy efficiency.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the overall efficiency of the FPGA.

No. of Inputs: 310

Ample number of inputs allow for flexibility in designing complex input-output configurations for diverse applications.

Package Shape: SQUARE

Square package shape facilitates easier PCB layout and component placement, optimizing space utilization.

Form Of Terminal: BALL

Ball terminals enable reliable solder connections and signal transmission, ensuring stable performance of the FPGA in various environments.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent operation of the FPGA, preventing voltage fluctuations that could affect performance.

Power Supplies (V): 1.2,2.5/3.3

Multiple power supply options allow for compatibility with different voltage requirements of external components and systems.

No. of Terminals: 484

A higher number of terminals enable more connection options and enhance the versatility of the FPGA for varied applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA offers flexibility in design and quick prototyping, bringing efficiency in development processes.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch terminals allows for high-density mounting on PCBs, improving overall system integration and reducing signal interference.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures stable operation even under low-power conditions, enhancing reliability of the FPGA.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance makes the FPGA suitable for industrial environments with elevated temperature requirements.

Pitch Of Terminal: 0.8 mm

Small pitch terminal spacing enables compact design and efficient signal routing on the PCB, enhancing overall system performance.

Maximum Combinatorial Delay of a CLB: 0.26 ns

Low combinatorial delay ensures fast response times and efficient processing of logic functions, enhancing the performance of the FPGA.

Organization: 5831 CLBS

Organized into a high number of configurable logic blocks, this FPGA offers flexibility and scalability in implementing complex logic functions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature tolerance makes the FPGA suitable for use in extreme cold conditions without compromising performance.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Tin/silver/copper finishing on terminals provides reliable solder joints and ensures stable electrical connections, enhancing the durability of the FPGA.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies PCB layout and improves signal routing, contributing to better signal integrity and overall system performance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate resistance to moisture exposure, ensuring the reliability of the FPGA in varied environmental conditions.

Maximum Seated Height: 1.8 mm

Low maximum seated height allows for compact designs and facilitates vertical stacking of components, optimizing space utilization in the system.

Width: 19 mm

Compact width dimension enables space-efficient placement on PCBs, particularly in applications where space constraints are a concern.

Maximum Clock Frequency: 667 MHz

High maximum clock frequency allows for fast signal processing and efficient execution of complex algorithms, enhancing the overall performance of the FPGA.

No. of Outputs: 310

Ample number of outputs provide flexibility in driving multiple external components and circuits, making the FPGA suitable for diverse applications.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature allows for proper solder reflow and joint formation during manufacturing, ensuring the reliability of the FPGA.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables robust solder joints and ensures durability of the FPGA under elevated temperature conditions.

Length: 19 mm

Compact length dimension facilitates space-efficient placement on PCBs, contributing to overall system miniaturization and optimization.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature tolerance makes the FPGA suitable for operation in harsh industrial environments with demanding temperature requirements.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX75-2CSG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

74637

No. of Inputs:

310

No. of Outputs:

310

No. of CLBs:

5831

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5831 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

1.8 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX75-2CSG484I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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