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10AX016C3U19E2LG

Intel

10AX016C3U19E2LG by Intel

Intel's 10AX016C3U19E2LG FPGA boasts 160,000 logic cells and 6151 CLBs. Operating at 0.93V max supply voltage, it offers 240 inputs/outputs for versatile applications in TSMC technology. With a compact square package style and fine pitch grid array, it suits various projects requiring high-performance programmable ICs.

Median Price

$696.770

Lifecycle Status

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7

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Arrow

USA . 115 parts In-Stock

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Verical

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Digiode

USA . 1,018 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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Vyrian

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Chip Stock

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Modulus Dynamics

Lithuania . 198 parts In-Stock

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AZTECH Wire

Italy . 345 parts In-Stock

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MARBEL Systems

Belgium . 1,830 parts In-Stock

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Texas Native Microelectronics

USA . 500 parts In-Stock

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Kenton Components

USA . 4,728 parts In-Stock

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Ampacity Inc.

Singapore . 113 parts In-Stock

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Semicontronic

India . 113 parts In-Stock

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One Stop Electronics

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Vigor

Singapore . 492 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 3,061 parts In-Stock

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Corohmni

South Africa . 901 parts In-Stock

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Continental Prestige Electronics

USA . 5,238 parts In-Stock

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Argo Parts USA

USA . 3,455 parts In-Stock

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Microchip USA

USA . 1,968 parts In-Stock

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Supply Digital

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Netroflash

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Glotronic Ltd.

UK . 92 parts In-Stock

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Qasali Group International

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Overview

Get ready to revolutionize your projects with the 10AX016C3U19E2LG by Intel. With its cutting-edge technology and high-quality construction, this Field Programmable Gate Array (FPGA) offers unparalleled performance and reliability. Whether you're in aerospace, automotive, or telecommunications, this FPGA is versatile enough to meet all your needs. Say goodbye to limitations and hello to endless possibilities with the Intel 10AX016C3U19E2LG. Upgrade your work today and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic packaging and provides good protection for the FPGA.

No. of Logic Cells: 160000

Large number of logic cells allows for complex programmable logic designs to be implemented.

Surface Mount: YES

Surface mount technology makes it easier to integrate the FPGA into circuit boards.

Maximum Supply Voltage: 0.93 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation.

No. of CLBs: 6151

The high number of Configurable Logic Blocks (CLBs) allows for flexibility in designing digital circuits.

Technology Used: TSMC

TSMC is a well-known semiconductor foundry known for high-quality manufacturing processes.

No. of Inputs: 240

Ample number of inputs allows for a wide range of external signals to be processed by the FPGA.

Package Shape: SQUARE

Square shape makes it easier to place and route the FPGA on a circuit board.

Form Of Terminal: BALL

Ball terminals provide a reliable connection and are suitable for fine pitch applications.

Nominal Supply Voltage (V): 0.9

Stable nominal supply voltage ensures consistent performance of the FPGA.

Power Supplies (V): 0.9

Matching power supplies simplify the power management for the FPGA.

No. of Terminals: 484

Sufficient number of terminals for connecting to external components and power sources.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA, it offers reconfigurability for adapting to changing requirements or reprogramming logic functions.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array style ensures precise placement on a circuit board for optimized signal routing.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage ensures reliable operation even with low power sources.

Maximum Operating Temperature: 100 °C

Wide operating temperature range makes the FPGA suitable for various environmental conditions.

Pitch Of Terminal: 0.8 mm

Fine pitch terminals allow for dense packing of components on a circuit board.

Organization: 6151 CLBS

Organized into Configurable Logic Blocks, providing flexibility in implementing logic functions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable operation in cold environments.

Position Of Terminal: BOTTOM

Bottom terminals facilitate easier routing of connections on a circuit board.

Maximum Seated Height: 3.25 mm

Low profile design allows for compact integration of the FPGA in electronic devices.

Width: 19 mm

Compact width enables efficient placement of the FPGA on a circuit board.

No. of Outputs: 240

Sufficient number of outputs for driving external components and interfacing with other digital devices.

Length: 19 mm

Compact length allows for space-saving integration of the FPGA in electronic designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10AX016C3U19E2LG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

160000

No. of Inputs:

240

No. of Outputs:

240

No. of CLBs:

6151

Technology:

TSMC

Sub-Category:

Field Programmable Gate Arrays

Organization:

6151 CLBS

Additional Features:

Also Operates at 0.95 V nominal supply

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

3.25 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Qualified:

No

Trade Compliance

10AX016C3U19E2LG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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