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10AX027H4F34I3SG

Intel

10AX027H4F34I3SG by Intel

Intel's 10AX027H4F34I3SG FPGA boasts 270,000 logic cells and 10162 CLBs. Operating at a max temperature of 100°C, it features 384 inputs/outputs and uses TSMC technology. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package with a grid array style.

Median Price

$1,558.030

Lifecycle Status

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Mouser Electronics

USA . 20 parts In-Stock

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DigiKey

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Digiode

USA . 889 parts In-Stock

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Nova Conductors

Japan . 25 parts In-Stock

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Vyrian

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Velocity Electronics

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AZTECH Wire

Italy . 718 parts In-Stock

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Corohmni

South Africa . 196 parts In-Stock

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Texas Native Microelectronics

USA . 9,551 parts In-Stock

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Modulus Dynamics

Lithuania . 975 parts In-Stock

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Kenton Components

USA . 86 parts In-Stock

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Aztec Data Supply Inc.

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Component Stockers USA

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Vigor

Singapore . 154 parts In-Stock

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Ampacity Inc.

Singapore . 19 parts In-Stock

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Corphita

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Aranea Global

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Continental Prestige Electronics

USA . 5,853 parts In-Stock

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Argo Parts USA

USA . 4,310 parts In-Stock

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$1,402.330

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Microchip USA

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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MARBEL Systems

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Supply Digital

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GreenTree Electronics

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Futuretech Components

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S.R.D Solutions

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Qasali Group International

UK . 30 parts In-Stock

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Overview

Unleash the power of innovation with the 10AX027H4F34I3SG FPGA by Intel. Manufactured to the highest standards, this cutting-edge technology offers unmatched quality and reliability. Ideal for a wide range of applications, from industrial automation to telecommunications, this FPGA provides customers with unparalleled flexibility and performance. Stay ahead of the competition and unlock endless possibilities with Intel's top-of-the-line FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

No. of Logic Cells: 270000

With a high number of logic cells, this FPGA can handle complex digital logic and processing tasks efficiently.

Maximum Supply Voltage: 0.93 V

The low maximum supply voltage of 0.93V helps in reducing power consumption and heat generation, making the product energy efficient.

Technology Used: TSMC

Being based on TSMC technology ensures high performance and reliability in a wide range of industrial applications.

No. of Inputs: 384

With a high number of inputs, this FPGA can handle multiple input signals simultaneously, making it suitable for applications requiring simultaneous data processing.

No. of Outputs: 384

The high number of outputs ensures that the FPGA can drive multiple output signals effectively, making it versatile for various applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10AX027H4F34I3SG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

270000

No. of Inputs:

384

No. of Outputs:

384

No. of CLBs:

10162

Technology:

TSMC

Sub-Category:

Field Programmable Gate Arrays

Organization:

10162 CLBS

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Qualified:

No

Trade Compliance

10AX027H4F34I3SG Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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