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10AX022E4F29I3SG

Intel

10AX022E4F29I3SG by Intel

Intel's 10AX022E4F29I3SG FPGA boasts 220,000 logic cells and 8033 CLBs. With TSMC technology, it features 288 inputs/outputs and operates b/w -40 to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

Median Price

$882.960

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Mouser Electronics

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Digiode

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Nova Conductors

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Sunrise Surplus Inc.

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AZTECH Wire

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Modulus Dynamics

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MARBEL Systems

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Kenton Components

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Texas Native Microelectronics

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Corohmni

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One Stop Electronics

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Semicontronic

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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Overview

Unlock the power of cutting-edge technology with Intel's 10AX022E4F29I3SG Field Programmable Gate Array (FPGA). Designed with 220,000 logic cells and 8033 CLBs, this FPGA offers unparalleled flexibility and customization for a wide range of applications. Whether you're in aerospace, telecommunications, or automotive industries, this FPGA delivers high performance with its TSMC technology and low supply voltage of 0.9V. Trust Intel's reputation for quality and innovation to take your projects to the next level. Elevate your designs with the 10AX022E4F29I3SG FPGA and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, making it a reliable choice for various applications.

No. of Logic Cells: 220000

With a high number of logic cells, this FPGA offers ample capacity for complex designs and processing tasks.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration of the FPGA onto circuit boards, saving time and effort in assembly.

Maximum Supply Voltage: 0.93 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

No. of CLBs: 8033

The large number of Configurable Logic Blocks (CLBs) provides flexibility and versatility in designing custom logic functions.

Technology Used: TSMC

TSMC is a renowned technology provider known for high-quality semiconductor manufacturing, ensuring reliable performance of the FPGA.

No. of Inputs: 288

With a sufficient number of inputs, the FPGA can handle a wide range of data inputs, enabling versatile applications.

Package Shape: SQUARE

The square shape of the package allows for efficient space utilization on a circuit board, making it suitable for compact designs.

Form Of Terminal: BALL

Having ball terminals simplifies the soldering process and enhances the reliability of connections in the system.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9V balances performance and power efficiency, making it suitable for a variety of applications.

Power Supplies (V): 0.9

With consistent power supplies of 0.9V, the FPGA maintains stable performance without fluctuations.

No. of Terminals: 780

The abundant number of terminals allows for versatile connectivity options, making it adaptable for different system configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC offers reconfigurability and customization for specific application requirements.

Package Style (Meter): GRID ARRAY

The grid array package style ensures secure mounting and alignment on the PCB, enhancing the overall reliability of the FPGA.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage maintains the stability of the FPGA, even under low-power conditions.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions, ensuring robust performance.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals provides adequate spacing for soldering and connections, simplifying the integration process.

Organization: 8033 CLBS

The organization of 8033 CLBs offers a structured and efficient layout for custom logic functions, enhancing design flexibility.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this FPGA can function reliably in extreme cold environments.

Position Of Terminal: BOTTOM

Having terminals at the bottom facilitates easy and secure installation on the circuit board, ensuring a stable connection.

Maximum Seated Height: 3.35 mm

The maximum seated height of 3.35mm allows for a low-profile design, ideal for space-constrained applications.

Width: 29 mm

The 29mm width of the FPGA ensures compatibility with standard PCB layouts, making it easy to integrate into existing systems.

No. of Outputs: 288

The FPGA's high number of outputs enables it to drive multiple components and communicate effectively with external devices.

Length: 29 mm

The 29mm length of the FPGA provides a compact footprint, suitable for small-scale designs and space-saving applications.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures the FPGA's reliability and performance in harsh operating conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10AX022E4F29I3SG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

220000

No. of Inputs:

288

No. of Outputs:

288

No. of CLBs:

8033

Technology:

TSMC

Sub-Category:

Field Programmable Gate Arrays

Organization:

8033 CLBS

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Qualified:

No

Trade Compliance

10AX022E4F29I3SG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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