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10AX016E4F29E3SG

Intel

10AX016E4F29E3SG by Intel

Intel's 10AX016E4F29E3SG FPGA features 160,000 logic cells and TSMC technology. With 6151 CLBs and 288 inputs/outputs, it is ideal for high-performance computing applications. This square-shaped, plastic package has a max supply voltage of 0.93V and operates b/w 0-100°C.

Median Price

$575.190

Lifecycle Status

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6

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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Digiode

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Chip Stock

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Zilex Electronics Inc.

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Modulus Dynamics

Lithuania . 1,502 parts In-Stock

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AZTECH Wire

Italy . 379 parts In-Stock

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Ampacity Inc.

Singapore . 132 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 342 parts In-Stock

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Texas Native Microelectronics

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Advanced Electronics

New Zealand . 1,239 parts In-Stock

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Qasali Group International

UK . 90 parts In-Stock

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Vigor

Singapore . 322 parts In-Stock

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Argo Parts USA

USA . 3,107 parts In-Stock

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Continental Prestige Electronics

USA . 1,835 parts In-Stock

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Kenton Components

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MARBEL Systems

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Supply Digital

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Overview

Upgrade your technology with the 10AX016E4F29E3SG by Intel, a cutting-edge Field Programmable Gate Array (FPGA) that offers unparalleled quality and reliability. Manufactured by industry leader Intel, this FPGA boasts 160,000 logic cells, 6,151 CLBs, and 288 inputs and outputs for ultimate customization. Whether you're in need of high-speed computing, signal processing, or networking solutions, this versatile FPGA is the perfect choice. Experience the value and benefits of Intel's advanced technology with the 10AX016E4F29E3SG for all your programming needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the FPGA, ensuring a long lifespan.

No. of Logic Cells: 160000

Large number of logic cells allows for complex programmability and customization of functions.

Surface Mount: YES

Surface mount design makes it easy to integrate the FPGA onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 0.93 V

Low maximum supply voltage reduces power consumption and heat generation, improving energy efficiency.

No. of CLBs: 6151

High number of Configurable Logic Blocks allows for flexible design and implementation of various functions.

Technology Used: TSMC

TSMC technology ensures high performance, reliability, and quality in the FPGA.

No. of Inputs: 288

Abundance of inputs provides versatility in connecting external devices and signals to the FPGA.

Package Shape: SQUARE

Square package shape is space-efficient and allows for uniform mounting on PCBs.

Form Of Terminal: BALL

Ball terminals simplify the soldering process and enhance electrical connections for reliable operation.

Nominal Supply Voltage (V): 0.9

Stable nominal supply voltage ensures consistent performance and compatibility with other components.

Power Supplies (V): 0.9

Specific power supply requirements help optimize the efficiency and reliability of the FPGA.

No. of Terminals: 780

Large number of terminals enable versatile connectivity options for interfacing with external devices and circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for reprogramming and customization of logic functions based on specific needs.

Package Style (Meter): GRID ARRAY

Grid array package style enhances the structural integrity and reliability of the FPGA.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage ensures compatibility with a wide range of power sources and reduces power consumption.

Maximum Operating Temperature: 100 °C

Wide operating temperature range allows for use in various environments and applications without compromising performance.

Pitch Of Terminal: 1 mm

Narrow terminal pitch facilitates compact PCB layout and efficient signal routing for improved design flexibility.

Organization: 6151 CLBS

Well-organized Configurable Logic Blocks enable efficient design implementation and logical operations within the FPGA.

Minimum Operating Temperature: 0 °C

Wide temperature range from 0°C ensures reliable performance in different operating conditions.

Position Of Terminal: BOTTOM

Bottom terminal position simplifies assembly and maintenance processes for the FPGA.

Maximum Seated Height: 3.35 mm

Low maximum seated height allows for slim and compact integration of the FPGA into electronic devices.

Width: 29 mm

Compact width dimension facilitates space-saving integration of the FPGA into circuit board designs.

No. of Outputs: 288

Abundance of outputs provides flexibility in routing signals and data from the FPGA to external devices.

Length: 29 mm

Optimal length dimension ensures easy integration and layout planning of the FPGA in electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10AX016E4F29E3SG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

160000

No. of Inputs:

288

No. of Outputs:

288

No. of CLBs:

6151

Technology:

TSMC

Sub-Category:

Field Programmable Gate Arrays

Organization:

6151 CLBS

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Power Supplies:

0.9 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Qualified:

No

Trade Compliance

10AX016E4F29E3SG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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