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EP4CE40F23C6N

Intel

EP4CE40F23C6N by Intel

EP4CE40F23C6N by Intel is a FPGA with 39600 logic cells, 2475 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing such as telecommunications, networking equipment, and industrial automation due to its advanced programmable features and versatile package style.

Median Price

$147.620

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Mouser Electronics

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DigiKey

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Nova Conductors

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Digiode

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Bristol Electronics

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Vyrian

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Dan-Mar Components

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AZTECH Wire

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Modulus Dynamics

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MARBEL Systems

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Kenton Components

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Corohmni

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Ampacity Inc.

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Aranea Global

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Corphita

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Advanced Electronics

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Texas Native Microelectronics

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Vigor

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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A-Z Elektronik GmbH

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Glotronic Ltd.

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Qasali Group International

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Perfect Parts

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Metaverse IC Inc.

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Overview

Unlock endless possibilities with the Intel EP4CE40F23C6N Field Programmable Gate Array. Manufactured by industry leader Intel, this FPGA boasts 39,600 logic cells and 2,475 CLBs for optimal performance. Whether you're designing cutting-edge electronics or implementing complex algorithms, this versatile device offers unparalleled flexibility and customization. With a maximum clock frequency of 472.5 MHz and a wide range of power supplies, the EP4CE40F23C6N is your ticket to innovation. Elevate your projects to new heights with this top-of-the-line FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material suitable for various applications.

No. of Logic Cells: 39600

High number of logic cells for complex design implementations.

Surface Mount: YES

Ease of installation in surface mount technology.

Maximum Supply Voltage: 1.25 V

Low maximum supply voltage for energy efficiency.

No. of CLBs: 2475

Abundance of Configurable Logic Blocks for flexibility in design.

No. of Inputs: 331

Large number of input pins for versatile connectivity options.

Package Shape: SQUARE

Compact square shape for efficient use of board space.

Form Of Terminal: BALL

Ball terminal form factor for secure connections.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage for consistent performance.

Power Supplies (V): 1.2,1.2/3.3,2.5

Multiple power supply options for different voltage requirements.

No. of Terminals: 484

Sufficient number of terminals for connectivity needs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology allows for reconfigurable logic for versatile applications.

Package Style (Meter): GRID ARRAY

Grid array packaging for easy integration and soldering.

Minimum Supply Voltage: 1.15 V

Low minimum supply voltage for energy efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for varied environmental conditions.

Pitch Of Terminal: 1 mm

Close pitch terminal spacing for compact design layouts.

Organization: 2475 CLBS

Well-organized CLBs for efficient logic implementation.

Minimum Operating Temperature: 0 °C

Low operating temperature for reliable performance in cold environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finishing for long-lasting connections.

Position Of Terminal: BOTTOM

Bottom terminal position for easy board layout and routing.

Moisture Sensitivity Level (MSL): 3

MSL 3 level for moderate moisture sensitivity handling requirements.

Maximum Seated Height: 2.4 mm

Low seated height for space-constrained designs.

Width: 23 mm

Narrow width for efficient board space utilization.

Maximum Clock Frequency: 472.5 MHz

High maximum clock frequency for fast data processing.

No. of Outputs: 331

Abundance of output pins for versatile signal routing options.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time for efficient soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder joints.

Length: 23 mm

Compact length for efficient board space utilization.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP4CE40F23C6N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

39600

No. of Inputs:

331

No. of Outputs:

331

No. of CLBs:

2475

Maximum Clock Frequency:

472.5 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

2475 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.4 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP4CE40F23C6N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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