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EP4CE6F17C8N

Intel

EP4CE6F17C8N by Intel

EP4CE6F17C8N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock freq of 472.5 MHz. Ideal for applications requiring high-speed processing like signal processing, image recognition, and data encryption due to its low profile grid array package style and versatile programmable IC type.

Median Price

$21.900

Lifecycle Status

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17

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Mouser Electronics

USA . 3 parts In-Stock

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Arrow

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Verical

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RS (Exports)

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Digiode

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Nova Conductors

Japan . 45 parts In-Stock

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Schukat

Germany . 82 parts In-Stock

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IBS Electronics

USA . 1,890 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

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Vyrian

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Sensible Micro Corp

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Dynamic Solutions

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ComSIT Distribution GmbH

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Bristol Electronics

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USBid, Inc.

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Touchstone Systems

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Modulus Dynamics

Lithuania . 1,023 parts In-Stock

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$13.386

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Corphita

USA . 468 parts In-Stock

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Semicontronic

India . 3,712 parts In-Stock

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$17.472

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$17.382

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Ampacity Inc.

Singapore . 3,277 parts In-Stock

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Corohmni

South Africa . 324 parts In-Stock

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Continental Prestige Electronics

USA . 4,665 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,430 parts In-Stock

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Microchip USA

USA . 2,527 parts In-Stock

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XScomponents

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Vigor

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Texas Native Microelectronics

USA . 19,323 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Alle Elektronik GmbH

Germany . 4,928 parts In-Stock

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Argo Parts USA

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A-Z Elektronik GmbH

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Glotronic Ltd.

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Metaverse IC Inc.

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Kepictronics

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S.R.D Solutions

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Supply Digital

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Qasali Group International

UK . 500 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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Resion (Excess)

USA . 180 parts In-Stock

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MARBEL Systems

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Futuretech Components

Singapore . 30 parts In-Stock

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Kenton Components

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ChipstoGo Electronic ltd

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Overview

Unlock limitless possibilities with the EP4CE6F17C8N by Intel, a cutting-edge Field Programmable Gate Array that offers unmatched quality and performance. Manufactured by industry leader Intel, this FPGA boasts 6272 logic cells and 392 CLBs, making it perfect for a wide range of applications from telecommunications to industrial automation. With a maximum clock frequency of 472.5 MHz and a compact square package design, this FPGA delivers superior speed and efficiency. Experience the power of flexibility and customization with the EP4CE6F17C8N, creating innovative solutions tailored to your specific needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

No. of Logic Cells: 6272

With a high number of logic cells, this FPGA provides ample flexibility and scalability for complex designs.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage contributes to energy efficiency and reduced power consumption.

No. of CLBs: 392

The large number of Configurable Logic Blocks offers versatility in designing custom logic functions.

No. of Inputs: 179

Abundant input options make it suitable for applications requiring multiple input signals.

Package Shape: SQUARE

The square shape allows for efficient use of board space and compact designs.

Form Of Terminal: BALL

The ball terminal design simplifies the soldering process during assembly.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage ensures stable performance and compatibility with standard power sources.

Power Supplies (V): 1.2,1.2/3.3,2.5

The diverse power supply options offer flexibility in meeting various voltage requirements.

No. of Terminals: 256

The high number of terminals provides ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being an FPGA, this product offers reconfigurability and adaptability for changing project needs.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile design enable high-density mounting and save valuable board space.

Minimum Supply Voltage: 1.15 V

With a low minimum supply voltage, this FPGA ensures reliable operation even under fluctuating power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes it suitable for demanding industrial environments.

Pitch Of Terminal: 1 mm

The tight pitch of terminals allows for efficient routing of signals on the PCB.

Organization: 392 CLBS

The organized structure of 392 Configurable Logic Blocks facilitates efficient logic design and implementation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance in a wide range of conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper finishing ensures good electrical conductivity and solderability.

Position Of Terminal: BOTTOM

The bottom positioning of terminals simplifies board layout and reduces interference with other components.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, this FPGA can withstand moderate exposure to moisture during production and storage.

Maximum Seated Height: 1.55 mm

The low seated height makes it suitable for applications with limited vertical space constraints.

Width: 17 mm

The compact width allows for efficient placement on the PCB and enables compact system designs.

Maximum Clock Frequency: 472.5 MHz

The high clock frequency capability supports fast data processing and real-time operations.

No. of Outputs: 179

A high number of outputs provides the flexibility to drive multiple external devices or logic gates.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering without damaging the components.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering during assembly.

Length: 17 mm

The compact length facilitates space-saving designs and efficient use of board area.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP4CE6F17C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

6272

No. of Inputs:

179

No. of Outputs:

179

No. of CLBs:

392

Maximum Clock Frequency:

472.5 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

392 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP4CE6F17C8N Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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