Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Microchip Technology's M2S090-FCS325I FPGA boasts 86184 logic cells, 180 inputs/outputs, and operates at a supply voltage range of 1.14V to 1.26V. Ideal for applications requiring high-density programmable logic solutions in compact form factors with fine pitch grid arrays.
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The plastic/epoxy material makes the package lightweight and durable, which is ideal for portable or rugged applications.
With a high number of logic cells, this FPGA can handle complex logic functions and tasks efficiently.
Surface mount compatibility allows for easy and convenient installation on PCBs, saving time and effort during assembly.
The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product more energy-efficient.
A high number of inputs enables the FPGA to process a large amount of data simultaneously, enhancing its performance capabilities.
The rectangular shape of the package allows for efficient use of space on the PCB, optimizing the layout and design of the overall system.
The ball terminals provide a reliable and secure connection, ensuring proper signal transmission and reducing the risk of connectivity issues.
The nominal supply voltage of 1.2V is within the standard range for FPGA devices, making it compatible with a wide range of power sources.
The high number of terminals allows for versatile connectivity options and facilitates interfacing with other components in the system.
Being a field programmable gate array, this product offers flexibility in customization and reconfiguration of logic functions to meet specific application requirements.
The grid array style with a thin profile and fine pitch offers high density packaging, allowing for more logic cells in a smaller footprint.
The low minimum supply voltage ensures stable operation even under low power conditions, improving the overall reliability of the product.
The high maximum operating temperature range ensures the FPGA can withstand harsh environmental conditions without compromising performance.
The small pitch of the terminals enables high-density routing on the PCB, optimizing signal integrity and reducing signal interference.
The low minimum operating temperature range allows the FPGA to function reliably in cold environments, making it suitable for a variety of applications.
The tin lead finishing on the terminals provides good solderability and corrosion resistance, ensuring a durable and reliable connection.
Having terminals at the bottom of the package simplifies the PCB layout and routing, making it easier to integrate the FPGA into the system design.
The low maximum seated height allows for a compact and space-efficient assembly, ideal for applications with limited vertical space.
The narrow width of the FPGA package enables efficient use of PCB real estate, allowing for a more compact and streamlined system design.
The high number of outputs supports a wide range of output signals, promoting versatility and flexibility in system integration and control.
With a short time at peak reflow temperature, the FPGA can undergo quick and efficient solder reflow processes during assembly, reducing production time.
The high peak reflow temperature capability ensures reliable soldering of the FPGA to the PCB, even under high-temperature reflow conditions.
The compact length of the FPGA package contributes to a space-efficient design, facilitating easier integration into electronic systems with limited space constraints.
Field Programmable Gate Arrays (FPGA) M2S090-FCS325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
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M2S090-FCS325I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Datasheet 11/Jan/2023 Datasheet Rev 16/Jun/2022
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
2N2222A
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
Transistor & Electronic
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Fairchild Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
Meritek Electronics
BAV99
Zetex Plc
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803ADW
Texas Instruments
ULN2803ADW by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85 °C and has a max supply voltage of 3 V. Ideal for applications requiring buffer or inverter-based peripheral drivers with sink current flow direction.
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
B340A-13-F
Diodes Incorporated
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
LM358MX
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Frontier Electronics
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
XC7A35T-1FGG484C
Xilinx
Xilinx XC7A35T-1FGG484C is a CMOS FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications, networking, and industrial automation. Package style: Grid Array, terminals: Ball grid array (BGA), operating temp range: 0-85°C.
XC7A100T-1CS324I
The Xilinx XC7A100T-1CS324I is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package. Operating temperatures range from -40 to 100°C, making it suitable for various environments.
EP4CE40F23C6N
Intel
EP4CE40F23C6N by Intel is a FPGA with 39600 logic cells, 2475 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing such as telecommunications, networking equipment, and industrial automation due to its advanced programmable features and versatile package style.
EP3C5E144C8N
Altera
EP3C5E144C8N by Altera is a CMOS FPGA with 5136 logic cells and 94 inputs/outputs. It operates at a maximum clock frequency of 472.5 MHz and has a low profile package shape. Ideal for various applications.
A3P1000-FGG256I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC7A50T-2CPG236C
Xilinx XC7A50T-2CPG236C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It operates b/w -40 to 85 °C and is ideal for high-speed digital applications requiring low power consumption.
M1A3P250-PQG208I
Microchip Technology
M1A3P250-PQG208I by Microchip Technology is a CMOS FPGA with 6144 CLBs and 250000 gates. It operates b/w -40 to 100 °C, with supply voltage range of 1.425V to 1.575V. Suitable for industrial applications requiring high gate count and programmable logic functions.
XCAU25P-1SFVB784E
FIELD PROGRAMMABLE GATE ARRAY;
XC3S50AN-4TQG144CES
XC3S50AN-4TQG144CES by Xilinx is a 176 CLB, 50000 gates FPGA with max clock freq of 280 MHz. Operating at 3.3V nominal voltage, it's ideal for applications requiring high-speed processing and programmable logic in compact form factors. Package style: Flatpack, low profile, fine pitch.
XC4VFX12-10FFG668C
XC4VFX12-10FFG668C by Xilinx is a FPGA with 12312 logic cells, 1368 CLBs, and 320 inputs/outputs. It operates at max frequency of 1028 MHz and supports CMOS technology. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
10M08DCF256I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
A3P1000-FGG484I
Microchip Technology's A3P1000-FGG484I is a CMOS FPGA with 24576 CLBs and 1000000 gates. It operates at a max frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package size of 23x23 mm and MSL level of 3, it offers reliable performance in harsh environments.
EP3C25E144C8NES
EP3C25E144C8NES by Intel is a Field Programmable Gate Array with 24624 CLBs and a max clock frequency of 472.5 MHz. It operates at a nominal voltage of 1.2V, making it suitable for applications requiring high-speed processing in compact electronic devices. With its low profile package style and fine pitch terminals, this FPGA is ideal for space-constrained designs that demand efficient performance.
A3P250-VQG100
A3P250-VQG100 by Microchip Technology is a CMOS FPGA with 6144 CLBs and 250000 gates. Operating at max 1.575V, it offers a clock frequency of 350MHz. Ideal for applications requiring high gate count and fast processing speeds in commercial temperature range.
A3P1000-PQG208M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC7S50-2CSGA324I
The Xilinx XC7S50-2CSGA324I is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications for high-speed data processing due to its low profile package style and fine pitch grid array design.
EP4CGX22CF19I7N
EP4CGX22CF19I7N by Intel is a FPGA with 21280 logic cells, 1330 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable IC capabilities. With a package style of grid array and low profile, it offers versatility in various electronic designs.
XC7S50-2FGGA484C
The Xilinx XC7S50-2FGGA484C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC3S200A-4VQG100I
XC3S200A-4VQG100I by Xilinx is a FPGA with 4032 logic cells, 448 CLBs, and 200000 equivalent gates. It operates at max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for industrial applications requiring high-speed processing in compact designs.
LCMXO2-256ZE-1TG100C
Lattice Semiconductor
LCMXO2-256ZE-1TG100C by Lattice Semiconductor is a 256 logic cell FPGA with 55 inputs/outputs, operating at 1.2V. It comes in a square package with gull wing terminals, suitable for applications requiring low-profile, fine-pitch ICs like consumer electronics and industrial automation.
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M2S090-FCSG325
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
Microchip Technology's M2S090-FCSG325 FPGA offers 86184 logic cells, 180 inputs/outputs, and operates at a voltage range of 1.14V to 1.26V. Ideal for applications requiring high-speed processing and programmable logic in compact form factors with a grid array package style.
M2S090-FCSG325I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology Used: CMOS;
Microchip Technology's M2S090-FCSG325I FPGA features 86184 logic cells, 180 inputs/outputs, and operates at a max supply voltage of 1.26V. Ideal for applications requiring high-speed processing and programmable logic in compact form factors.
M2S090-FCS325
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Pitch Of Terminal: .5 mm;
Microchip Technology's M2S090-FCS325 FPGA boasts 86184 logic cells, 180 inputs/outputs, and a max supply voltage of 1.26V. Ideal for applications requiring high-performance computing in compact spaces with its thin profile grid array package style.
M2S090-FCS325I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 240;
M2S010-VFG400I
Microchip Technology's M2S010-VFG400I FPGA offers 12084 logic cells, 195 inputs/outputs, and operates at a supply voltage range of 1.14V to 1.26V. Ideal for applications requiring high-density programmable logic in a compact grid array package with low profile and fine pitch design.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.2;
M2S010-TQG144I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;
M2S010-TQG144I by Microchip Technology is a 12084 logic cell FPGA with 84 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 1.14V to 1.26V. Ideal for applications requiring high-density programmable logic in compact form factors.
M2S090TS-1FG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Length: 23 mm;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn/Pb);
M2S090TS-1FGG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
M2S090TS-1FGG484I by Microchip Technology is a PLASTIC/EPOXY FPGA with 86184 logic cells, 267 inputs/outputs. Operating at 1.14-1.26V, it's ideal for applications requiring high performance in a compact GRID ARRAY package with TIN SILVER COPPER terminals.
M2S010TS-1VFG256I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.14 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE; No. of Logic Cells: 12084;
M2S050T-1FGG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 267;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 267;
M2S090TS-1FCS325
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage (V): 1.2;
Supply Digital Components
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