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M2S090-FCSG325I

Microchip Technology

M2S090-FCSG325I by Microchip Technology

Microchip Technology's M2S090-FCSG325I FPGA features 86184 logic cells, 180 inputs/outputs, and operates at a max supply voltage of 1.26V. Ideal for applications requiring high-speed processing and programmable logic in compact form factors.

Median Price

$183.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 696 parts In-Stock

1+ parts

$183.540

100+ parts

$180.870

1k+ parts

$96.010

10k+ parts

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696

$183.540

$180.870

$96.010

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 557 parts In-Stock

1+ parts

$178.290

100+ parts

$164.210

1k+ parts

$152.200

10k+ parts

-

557

$178.290

$164.210

$152.200

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$183.221

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15

$183.221

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Vyrian

USA . 7,341 parts In-Stock

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7,341

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Digiode

USA . 495 parts In-Stock

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495

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,041 parts In-Stock

1+ parts

$8.000

100+ parts

-

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1,041

$8.000

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AZTECH Wire

Italy . 235 parts In-Stock

1+ parts

$13.839

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235

$13.839

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Corohmni

South Africa . 53 parts In-Stock

1+ parts

$57.611

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53

$57.611

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Advanced Electronics

New Zealand . 534 parts In-Stock

1+ parts

$155.998

100+ parts

$148.198

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$148.198

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534

$155.998

$148.198

$148.198

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Semicontronic

India . 14 parts In-Stock

1+ parts

$156.010

100+ parts

$152.110

1k+ parts

$151.330

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14

$156.010

$152.110

$151.330

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Aztec Data Supply Inc.

USA . 3,684 parts In-Stock

1+ parts

$158.600

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3,684

$158.600

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Continental Prestige Electronics

USA . 5,773 parts In-Stock

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$183.221

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$179.557

5,773

$183.221

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$179.557

Fulton Briggs Corp.

USA . 6,199 parts In-Stock

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6,199

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Argo Parts USA

USA . 4,132 parts In-Stock

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4,132

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Perfect Parts

USA . 170 parts In-Stock

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170

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Corphita

USA . 92 parts In-Stock

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92

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Overview

Elevate your projects to new heights with the M2S090-FCSG325I by Microchip Technology. As a leading manufacturer in the field programmable gate array (FPGA) category, Microchip Technology delivers unparalleled quality and reliability. This versatile FPGA boasts 86184 logic cells, 180 inputs and outputs, and a wide operating temperature range. With a grid array, thin profile, and fine pitch package style, this FPGA is perfect for a variety of applications. Experience the value and benefits of this cutting-edge technology and unlock endless possibilities for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 86184

High number of logic cells allows for complex programmable logic designs to be implemented.

Surface Mount: YES

Allows for easy and secure mounting onto PCBs.

Maximum Supply Voltage: 1.26 V

Offers a safe operating range for the FPGA.

No. of Inputs: 180

Provides ample inputs for connecting external devices and signals.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit designs.

Nominal Supply Voltage (V): 1.2

Optimal operating voltage for the FPGA.

No. of Terminals: 325

Sufficient terminals for connecting to other components within the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Offers flexibility and reconfigurability for various applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Compact design for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation even at lower voltages.

Maximum Operating Temperature: 100 °C

Can withstand high operating temperatures for reliable performance in harsh environments.

Pitch Of Terminal: 0.5 mm

Provides fine pitch for high-density mounting on PCBs.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Ensures good electrical conductivity and resistance to corrosion.

Position Of Terminal: BOTTOM

Facilitates easy connection and integration into the circuit board.

Moisture Sensitivity Level (MSL): 3

Indicates appropriate moisture resistance for typical storage and handling conditions.

Maximum Seated Height: 1.16 mm

Low profile for compact system designs.

Width: 11 mm

Compact width for efficient PCB layout.

No. of Outputs: 180

Sufficient outputs for driving external devices and circuits.

Maximum Time At Peak Reflow Temperature (s): 40

Indicates the maximum duration for safe reflow soldering process.

Peak Reflow Temperature °C: 250

High peak reflow temperature for reliable soldering.

Length: 13.5 mm

Compact length for space-efficient designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2S090-FCSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

86184

No. of Inputs:

180

No. of Outputs:

180

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

40 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

13.5 mm

Width:

11 mm

Maximum Seated Height:

1.16 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

R-PBGA-B325

Trade Compliance

M2S090-FCSG325I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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