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5CGXFC7C6F23I7N

Intel

5CGXFC7C6F23I7N by Intel

Intel's 5CGXFC7C6F23I7N FPGA boasts 149500 logic cells, 240 inputs/outputs, and a max supply voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementation in fields like telecommunications and automotive industries.

Median Price

$859.681

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Verical

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Digiode

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Nova Conductors

Japan . 72 parts In-Stock

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Chip Stock

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Velocity Electronics

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Touchstone Systems

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Modulus Dynamics

Lithuania . 226 parts In-Stock

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MARBEL Systems

Belgium . 1,730 parts In-Stock

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Texas Native Microelectronics

USA . 6,333 parts In-Stock

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Kenton Components

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One Stop Electronics

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Ampacity Inc.

Singapore . 1,658 parts In-Stock

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Semicontronic

India . 1,546 parts In-Stock

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Corphita

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Corohmni

South Africa . 290 parts In-Stock

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Argo Parts USA

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Netroflash

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Continental Prestige Electronics

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Microchip USA

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Qasali Group International

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A-Z Elektronik GmbH

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Supply Digital

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Futuretech Components

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Overview

Unlock endless possibilities with the Intel 5CGXFC7C6F23I7N Field Programmable Gate Array. Manufactured by Intel, a trusted name in technology, this FPGA offers a staggering 149500 logic cells and 240 inputs/outputs, providing unparalleled flexibility for a wide range of applications. With a package body made of quality PLASTIC/EPOXY material and cutting-edge CMOS technology, this FPGA delivers top-notch performance and reliability. Experience seamless integration with its surface mount design and GRID ARRAY package style, making it ideal for various projects. Embrace innovation and efficiency with the Intel 5CGXFC7C6F23I7N FPGA, delivering value and benefits that exceed expectations.

Feature Benefit Bullets

Package Body Material

This material provides a lightweight and durable housing for the FPGA, making it ideal for various applications.

No. of Logic Cells

With a high number of logic cells, this FPGA offers ample capacity for complex programming and processing tasks.

Surface Mount

The surface mount feature allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage

The low maximum supply voltage helps reduce power consumption and heat generation, improving energy efficiency.

Technology Used

The CMOS technology enables high-speed operation and low power consumption, enhancing overall performance.

No. of Inputs

The large number of inputs allows for versatile connectivity and input options for the FPGA.

Package Shape

The square package shape offers a compact design that is easy to mount and fits well in various electronic devices.

Form Of Terminal

The ball form of terminals provides reliable connections and facilitates soldering during installation.

Nominal Supply Voltage (V)

The stable nominal supply voltage ensures consistent and reliable operation of the FPGA.

Power Supplies (V)

The multiple power supply options cater to different voltage requirements, adding flexibility to the FPGA's usage.

No. of Terminals

The high number of terminals allows for extensive connectivity options and easy integration into various circuits.

Programmable IC Type

Being a FPGA, this product offers flexibility for custom logic implementation and reprogramming as needed.

Package Style (Meter)

The grid array package style provides a secure mounting configuration for the FPGA, enhancing durability and reliability.

Minimum Supply Voltage

The low minimum supply voltage ensures stable operation even under fluctuating power conditions.

Pitch Of Terminal

The small pitch of terminals enables high-density mounting and efficient use of space on the PCB.

Finishing Of Terminal Used

The use of multiple finishing materials for terminals ensures strong and reliable connections for long-lasting performance.

Position Of Terminal

The bottom position of terminals allows for easy access and soldering, simplifying installation and maintenance processes.

Moisture Sensitivity Level (MSL)

The MSL 3 rating indicates a moderate level of moisture sensitivity, suitable for most standard operating environments.

Maximum Seated Height

The compact maximum seated height makes this FPGA ideal for applications with space constraints.

Width

The narrow width of the FPGA allows for easy fitting into tight spaces and crowded PCB layouts.

No. of Outputs

The abundant outputs provide flexibility and diverse signal routing options for the FPGA's operations.

Maximum Time At Peak Reflow Temperature (s)

With a short maximum time at peak reflow temperature, this FPGA can withstand soldering processes without damage.

Peak Reflow Temperature °C

The high peak reflow temperature tolerance ensures the FPGA's reliability during assembly and rework processes.

Length

The compact length of this FPGA makes it suitable for applications requiring a small footprint and efficient use of space.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CGXFC7C6F23I7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

149500

No. of Inputs:

240

No. of Outputs:

240

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

5CGXFC7C6F23I7N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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