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5CGXFC5C6F23I7N

Intel

5CGXFC5C6F23I7N by Intel

Intel's 5CGXFC5C6F23I7N FPGA features 76500 logic cells, 240 inputs/outputs, and a max supply voltage of 1.13V. Ideal for applications requiring high-speed data processing, such as telecommunications equipment and industrial automation systems.

Median Price

$260.580

Lifecycle Status

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Mouser Electronics

USA . 469 parts In-Stock

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DigiKey

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Arrow

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Verical

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Digiode

USA . 1,115 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Cyclops Electronics Ltd

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Chip Stock

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SIE Connect GmbH - GreenChips

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Flip Electronics

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Vyrian

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Carlin Systems, Inc.

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MARBEL Systems

Belgium . 3,033 parts In-Stock

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Texas Native Microelectronics

USA . 1,259 parts In-Stock

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Kenton Components

USA . 100 parts In-Stock

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Modulus Dynamics

Lithuania . 301 parts In-Stock

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Qasali Group International

UK . 100 parts In-Stock

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Ampacity Inc.

Singapore . 409 parts In-Stock

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Semicontronic

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Corphita

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Corohmni

South Africa . 100 parts In-Stock

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Continental Prestige Electronics

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Netroflash

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Microchip USA

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Argo Parts USA

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Lixinc

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Supply Digital

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Futuretech Components

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Overview

Experience unmatched performance and versatility with the 5CGXFC5C6F23I7N from Intel. As a leader in FPGA technology, Intel delivers cutting-edge solutions for a wide range of applications. Whether you're looking to enhance your data processing capabilities or improve system performance, this advanced FPGA offers unparalleled reliability and flexibility. With its high logic cell count and innovative design, the 5CGXFC5C6F23I7N provides customers with the power and efficiency they need to stay ahead of the competition. Upgrade your systems today and unlock a world of possibilities with Intel's top-of-the-line FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the FPGA a reliable choice for various applications.

No. of Logic Cells: 76500

With a high number of logic cells, this FPGA offers ample flexibility and processing power for complex designs.

Surface Mount: YES

The surface mount feature allows for easy integration onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.13 V

The high maximum supply voltage ensures stable operation and compatibility with a wide range of power sources.

Technology Used: CMOS

The CMOS technology ensures low power consumption and high-speed performance, making this FPGA energy-efficient and reliable.

No. of Inputs: 240

With a generous number of inputs, this FPGA can accommodate a wide range of external signals and data inputs.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, making it ideal for compact designs.

Form Of Terminal: BALL

The ball terminal form provides a reliable and secure connection, enhancing the durability and longevity of the FPGA.

Nominal Supply Voltage (V): 1.1

The stable nominal supply voltage of 1.1 V ensures consistent performance and reliability in various operating conditions.

Power Supplies (V): 1.1,1.2/3.3,2.5

The multiple power supply options offer flexibility in voltage requirements, making the FPGA suitable for diverse applications.

No. of Terminals: 484

The high number of terminals allows for a robust and versatile interface with other components, enhancing connectivity and functionality.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The FPGA's programmable nature enables customization and reconfiguration, making it adaptable to changing design requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and signal routing, ensuring optimal performance under various conditions.

Minimum Supply Voltage: 1.07 V

The low minimum supply voltage allows for efficient power consumption and compatibility with lower voltage sources.

Pitch Of Terminal: 1 mm

The small terminal pitch of 1 mm enables high-density mounting and compact PCB designs, ideal for space-constrained applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission.

Position Of Terminal: BOTTOM

The bottom terminal position simplifies PCB layout and routing, making it easier to integrate the FPGA into the overall system design.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate sensitivity to moisture, making proper handling and storage essential for long-term reliability.

Maximum Seated Height: 2 mm

The low maximum seated height helps minimize the overall profile of the FPGA on the PCB, ideal for slim and compact designs.

Width: 23 mm

The width of 23 mm provides a balance between compactness and accessibility, ensuring ease of handling and integration into various systems.

No. of Outputs: 240

With a large number of outputs, this FPGA can drive multiple components and devices, enabling versatile functionality in complex systems.

Length: 23 mm

The length of 23 mm offers a compact form factor without sacrificing functionality, making the FPGA suitable for space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CGXFC5C6F23I7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

76500

No. of Inputs:

240

No. of Outputs:

240

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

5CGXFC5C6F23I7N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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