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M1A3P250-PQG208I

Microchip Technology

M1A3P250-PQG208I by Microchip Technology

M1A3P250-PQG208I by Microchip Technology is a CMOS FPGA with 6144 CLBs and 250000 gates. It operates b/w -40 to 100 °C, with supply voltage range of 1.425V to 1.575V. Suitable for industrial applications requiring high gate count and programmable logic functions.

Median Price

$24.710

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 34 parts In-Stock

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$24.710

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Vyrian

USA . 1,520 parts In-Stock

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Digiode

USA . 413 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 737 parts In-Stock

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$7.488

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737

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Aranea Global

USA . 1,000 parts In-Stock

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$24.216

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$23.247

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$24.216

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Continental Prestige Electronics

USA . 5,981 parts In-Stock

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$24.255

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$23.770

5,981

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Microchip USA

USA . 2,477 parts In-Stock

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$28.400

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Ampacity Inc.

Singapore . 764 parts In-Stock

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$31.000

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764

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Semicontronic

India . 577 parts In-Stock

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$34.000

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$33.150

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$32.980

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577

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Corohmni

South Africa . 106 parts In-Stock

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$64.938

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Aztec Data Supply Inc.

USA . 2,258 parts In-Stock

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$68.170

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Advanced Electronics

New Zealand . 1,365 parts In-Stock

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$114.775

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$109.036

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$109.036

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QUARKTWIN TECHNOLOGY LTD

USA . 14,926 parts In-Stock

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Argo Parts USA

USA . 4,664 parts In-Stock

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Fulton Briggs Corp.

USA . 3,188 parts In-Stock

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Corphita

USA . 300 parts In-Stock

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Overview

Unlock the potential of your projects with the Microchip Technology M1A3P250-PQG208I FPGA. Manufactured by a trusted industry leader, this high-quality product offers unmatched performance and reliability. Ideal for a wide range of applications, this FPGA provides customers with exceptional value, flexibility, and efficiency. Transform your designs with ease and precision using this cutting-edge technology. Upgrade to the Microchip Technology M1A3P250-PQG208I FPGA today and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.575 V

Provides a suitable voltage range for operation, ensuring stability and reliability.

No. of CLBs: 6144

Offers a high number of Configurable Logic Blocks for increased flexibility and customization in design.

Technology Used: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high performance.

No. of Equivalent Gates: 250000

Provides a large number of gates for complex logic operations, allowing for versatile functionality.

Nominal Supply Voltage (V): 1.5

Maintains a stable voltage level for consistent performance and operation.

No. of Terminals: 208

Offers ample terminals for connectivity and communication with other components, enhancing compatibility.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without performance degradation, increasing usability in various conditions.

Maximum Operating Temperature: 100 °C

Capable of operating in high-temperature environments without overheating, ensuring reliability in demanding conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M1A3P250-PQG208I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

6144

No. of Equivalent Gates:

250000

Technology:

CMOS

Organization:

6144 CLBS, 250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Fine Pitch

Package Code:

Package Shape:

Length:

28 mm

Width:

28 mm

Maximum Seated Height:

4.1 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

208

Standards

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

M1A3P250-PQG208I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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