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XC7A12T-1CSG325I

Xilinx

XC7A12T-1CSG325I by Xilinx

Xilinx XC7A12T-1CSG325I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style is grid array with fine pitch terminals for efficient PCB integration.

Median Price

$42.690

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Farnell

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Newark

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DigiKey

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Mouser Electronics

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Element14

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Digiode

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Nova Conductors

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Ampacity Inc.

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Corphita

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Continental Prestige Electronics

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Corohmni

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Advanced Electronics

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Netroflash

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Microchip USA

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Aztec Data Supply Inc.

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MARBEL Systems

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Texas Native Microelectronics

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Modulus Dynamics

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Kenton Components

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Overview

Unlock the power of cutting-edge technology with the Xilinx XC7A12T-1CSG325I Field Programmable Gate Array. Manufactured by Xilinx, a leader in FPGA innovation, this versatile device offers 12800 logic cells and 1000 CLBs for top-notch performance. With a maximum clock frequency of 1098 MHz, this FPGA is ideal for a wide range of applications. From aerospace to telecommunications, the XC7A12T-1CSG325I delivers unparalleled value, flexibility, and reliability. Upgrade your systems today and experience the difference with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material makes the product easy to handle and resistant to damage.

No. of Logic Cells: 12800

With a large number of logic cells, this FPGA can handle complex tasks and processes efficiently.

Surface Mount: YES

The surface-mount capability enables easy integration into circuit boards and saves space in the design.

Maximum Supply Voltage: 1.05 V

This low supply voltage helps in reducing power consumption and heat generation, making the device more energy-efficient.

No. of CLBs: 1000

The numerous Configurable Logic Blocks allow for flexibility in implementing various logic functions and designs.

Technology Used: HKMG

The use of High-K Metal Gate technology enhances the performance and reliability of the FPGA.

No. of Inputs: 150

With a high number of inputs, the device can interface with multiple external sources and gather extensive data.

Package Shape: SQUARE

The square shape of the package provides a balanced layout and efficient use of space on a circuit board.

Form Of Terminal: BALL

The use of ball terminals ensures reliable connections and ease of installation in the system.

No. of Terminals: 325

The ample number of terminals allow for versatile connectivity options and configuration possibilities.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being programmable, this FPGA offers flexibility to reconfigure logic circuits as needed, saving time and cost.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style enhances thermal performance, reduces signal interference, and enables high-density mounting.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures stable operation and reliable performance under varying conditions.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range makes the FPGA suitable for industrial applications with demanding environments.

Pitch Of Terminal: 0.8 mm

The small pitch of the terminals enables high-density mounting and compact design of the circuit.

Maximum Combinatorial Delay of a CLB: 1.27 ns

This low delay ensures fast processing and response times in logic operations.

Organization: 1000 CLBS

The organized structure with 1000 Configurable Logic Blocks allows for efficient utilization of resources and ease of design implementation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables reliable performance even in extreme cold conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of these materials for terminal finishing ensures excellent conductivity and durability, enhancing the device's performance and longevity.

Position Of Terminal: BOTTOM

The bottom position of the terminals enables easy access and connectivity in various circuit board layouts.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the device can withstand moderate exposure to moisture during storage and handling.

Maximum Seated Height: 1.5 mm

The low seated height allows for compact integration and improved airflow in the system design.

Width: 15 mm

The moderate width provides a balanced form factor for the FPGA, ensuring compatibility with standard board layouts and designs.

Maximum Clock Frequency: 1098 MHz

The high maximum clock frequency allows for rapid processing and execution of logic functions, enhancing performance.

No. of Outputs: 150

The numerous outputs provide flexibility in interfacing with external devices and delivering processed data efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures efficient soldering and assembly processes, reducing manufacturing time and cost.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable and durable solder joints during assembly and rework.

Length: 15 mm

The compact length of the FPGA enables space-saving in the design layout and ensures compatibility with standard board dimensions.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh environments and demanding applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A12T-1CSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

12800

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1000

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Technology:

HKMG

Organization:

1000 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Trade Compliance

XC7A12T-1CSG325I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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