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M1A3P1000-FGG484I

Microchip Technology

M1A3P1000-FGG484I by Microchip Technology

M1A3P1000-FGG484I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 24576 CLBs and 1000000 equivalent gates. It operates at a max clock frequency of 350 MHz and has a package shape of GRID ARRAY. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.

Median Price

$104.535

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$104.535

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50

$104.535

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Digiode

USA . 444 parts In-Stock

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444

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Vyrian

USA . 249 parts In-Stock

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249

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$8.097

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324

$8.097

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Semicontronic

India . 193 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

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$14.550

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193

$15.000

$14.625

$14.550

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$95.164

100+ parts

$90.406

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$90.406

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50

$95.164

$90.406

$90.406

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Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

$104.500

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$99.275

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$93.005

500

$104.500

$99.275

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$93.005

Continental Prestige Electronics

USA . 6,834 parts In-Stock

1+ parts

$104.535

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$102.444

6,834

$104.535

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$102.444

Corohmni

South Africa . 661 parts In-Stock

1+ parts

$107.447

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661

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Aztec Data Supply Inc.

USA . 307 parts In-Stock

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$148.230

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307

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QUARKTWIN TECHNOLOGY LTD

USA . 13,763 parts In-Stock

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Microchip USA

USA . 8,514 parts In-Stock

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Argo Parts USA

USA . 3,768 parts In-Stock

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3,768

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RGB Technical Solutions

Ukraine . 3,124 parts In-Stock

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Corphita

USA . 364 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the M1A3P1000-FGG484I by Microchip Technology. As a leader in the industry, Microchip Technology brings you the highest quality Field Programmable Gate Arrays (FPGA) that are sure to exceed your expectations. With its advanced CMOS technology and 1000000 equivalent gates, this FPGA offers unparalleled performance and flexibility. Whether you're working on industrial automation, telecommunications, or aerospace applications, the M1A3P1000-FGG484I is the ultimate solution for your design needs. Discover the value, benefits, and advantages that this product brings to your projects. Upgrade to excellence with Microchip Technology today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy as the package body material provides durability and protection for the FPGA, making it suitable for various environments and applications.

Surface Mount:

YES - The surface mount feature allows for easy and efficient installation of the FPGA onto a circuit board, saving time and effort during the assembly process.

Maximum Supply Voltage:

1.575 V - With a high maximum supply voltage, this FPGA can handle and operate reliably in power-intensive applications, providing stable performance.

No. of CLBs:

24576 - The large number of Configurable Logic Blocks (CLBs) in this FPGA allows for complex and sophisticated designs, enabling the implementation of advanced functionalities.

Technology Used:

CMOS - The CMOS technology used in this FPGA ensures low power consumption and high noise immunity, making it energy-efficient and reliable in demanding applications.

Package Shape:

SQUARE - The square package shape provides a compact and space-saving design for the FPGA, making it easier to integrate into various system architectures.

Form Of Terminal:

BALL - The use of ball terminals enables efficient soldering and reliable electrical connections, ensuring the FPGA's proper functionality even in harsh operating conditions.

No. of Equivalent Gates:

1000000 - With a high number of equivalent gates, this FPGA allows for the implementation of complex digital circuits, enabling the creation of intricate designs with improved performance.

Nominal Supply Voltage (V):

1.5 - The nominal supply voltage of 1.5V ensures compatibility with standard power supply levels, making it easy to integrate this FPGA into existing systems without requiring major modifications.

Packing Method:

TRAY - The use of a tray for packaging ensures secure storage and transportation of the FPGA, reducing the risk of damage during handling and shipping.

No. of Terminals:

484 - The FPGA's significant number of terminals enables efficient connectivity to other components, allowing for seamless integration within complex circuit designs.

Programmable IC Type:

FIELD PROGRAMMABLE GATE ARRAY - Being a field programmable gate array, this product offers flexibility and versatility, allowing for customization and adaptation to various application requirements.

Package Style (Meter):

GRID ARRAY - The grid array package style provides a compact and efficient layout for the FPGA's terminals, enabling easy connection and reducing signal interference.

Minimum Supply Voltage:

1.425 V - With a low minimum supply voltage, this FPGA can operate reliably even in low-power situations or energy-constrained environments, enhancing its versatility.

Maximum Operating Temperature:

100 °C - The high maximum operating temperature makes this FPGA suitable for industrial applications, where it can withstand harsh conditions and maintain stable performance.

Pitch Of Terminal:

1 mm - The narrow pitch of 1mm between terminals enables high-density circuit layouts, allowing for the integration of more components within a limited space.

Organization:

24576 CLBS, 1000000 GATES - The organization of 24576 CLBs and 1000000 gates provides a robust and flexible platform for designing complex digital circuits, enabling advanced functionalities and performance.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature capability ensures reliable operation in extreme cold environments, making this FPGA suitable for a wide range of applications.

Finishing Of Terminal Used:

TIN SILVER COPPER - The use of tin-silver-copper finishing on the terminals offers excellent solderability and corrosion resistance, ensuring long-term reliability and consistent performance of the FPGA.

Position Of Terminal:

BOTTOM - The bottom position of the terminals simplifies the PCB layout and allows for a more compact design, optimizing space utilization and facilitating ease of integration.

Moisture Sensitivity Level (MSL):

3 - The MSL level of 3 indicates moderate moisture sensitivity, which means proper handling and storage guidelines should be followed to prevent moisture-related issues during assembly or storage.

Maximum Seated Height:

2.44 mm - The low maximum seated height of 2.44mm allows for a slim and compact form factor, making it suitable for applications where space constraints are a concern.

Width:

23 mm - With a narrow width of 23mm, this FPGA can be easily accommodated within tight space constraints, providing design flexibility without sacrificing performance.

Maximum Clock Frequency:

350 MHz - The high maximum clock frequency allows for fast and efficient operation of the FPGA, ensuring rapid data processing and high-speed performance in time-critical applications.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature of 30 seconds provides a sufficient timeframe for reliable and consistent soldering during the assembly process.

Peak Reflow Temperature °C:

250 - The high peak reflow temperature of 250°C ensures proper soldering and metallurgical bonding, guaranteeing the FPGA's reliability and longevity.

Length:

23 mm - The compact length of 23mm allows for easy integration and placement of the FPGA within various system architectures, optimizing space utilization and ensuring compatibility with standard form factors.

Grading Of Temperature:

INDUSTRIAL - With an industrial temperature grading, this FPGA can operate reliably in harsh environmental conditions, making it suitable for industrial automation, automotive, and aerospace applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M1A3P1000-FGG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

24576

No. of Equivalent Gates:

1000000

Maximum Clock Frequency:

350 MHz

Technology:

CMOS

Organization:

24576 CLBS, 1000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.44 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

M1A3P1000-FGG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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