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XC7A12T-2CPG238I

Xilinx

XC7A12T-2CPG238I by Xilinx

Xilinx XC7A12T-2CPG238I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.

Median Price

$59.780

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Mouser Electronics

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Overview

Unlock endless possibilities with the XC7A12T-2CPG238I by Xilinx, a top-notch Field Programmable Gate Array that delivers unparalleled performance and reliability. Manufactured by the industry leader Xilinx, this FPGA is perfect for a wide range of applications, offering 12800 logic cells and 1000 CLBs for maximum flexibility. With its cutting-edge technology and innovative design, the XC7A12T-2CPG238I guarantees high-speed operation and seamless functionality. Elevate your projects to new heights with this exceptional product that provides exceptional value and benefits to customers looking for superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good durability and protection for the FPGA, making it suitable for various industrial applications.

No. of Logic Cells: 12800

With a high number of logic cells, this FPGA offers ample resources for complex digital designs and algorithms.

Surface Mount: YES

The surface mount capability makes it easier to integrate this FPGA onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA energy-efficient.

No. of CLBs: 1000

The FPGA's 1000 Configurable Logic Blocks (CLBs) offer flexibility in implementing a wide range of logic functions and designs.

Technology Used: HKMG

The use of High-k Metal Gate (HKMG) technology provides improved performance, reliability, and power efficiency for the FPGA.

No. of Inputs: 150

With 150 inputs, this FPGA can handle multiple input signals and data streams simultaneously, enabling complex data processing tasks.

Package Shape: SQUARE

The square package shape optimizes space utilization and allows for easier placement and routing on circuit boards.

Form Of Terminal: BALL

The ball terminal design facilitates reliable connections and soldering during the FPGA's integration into electronic systems.

No. of Terminals: 238

The 238 terminals offer sufficient connectivity options for interfacing the FPGA with other components and peripherals in a system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows the device to be reconfigured and programmed for multiple applications, providing versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances electrical performance, signal integrity, and reliability in the FPGA's operation.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and facilitates power optimization in different applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C enables reliable performance in demanding thermal environments and industrial settings.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals allows for denser packaging of components on circuit boards, improving overall system integration capability.

Maximum Combinatorial Delay of a CLB: 1.05 ns

The low maximum combinatorial delay of a Configurable Logic Block (CLB) ensures fast and responsive logic operations in the FPGA.

Organization: 1000 CLBs

The organization of 1000 Configurable Logic Blocks (CLBs) provides a structured and scalable architecture for implementing complex digital circuits.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments or during startup conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals enhances conductivity, corrosion resistance, and solderability for reliable connections.

Position Of Terminal: BOTTOM

The bottom position of terminals on the FPGA simplifies routing and layout of signal traces on circuit boards for efficient signal propagation.

Maximum Seated Height: 1.38 mm

The low maximum seated height of 1.38 mm allows for compact board designs and reduces the overall profile of the electronic system.

Width: 10 mm

The width of 10 mm provides a compact form factor for the FPGA, enabling space-efficient integration into electronic devices and systems.

Maximum Clock Frequency: 1286 MHz

The high maximum clock frequency of 1286 MHz allows for fast operation and processing speed, suitable for high-performance computing applications.

No. of Outputs: 150

With 150 outputs, this FPGA can drive multiple output signals and interfaces, supporting diverse connectivity requirements in electronic systems.

Length: 10 mm

The length of 10 mm contributes to the FPGA's compact dimensions and enables efficient utilization of space on circuit boards.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature grading ensures robust operation and reliability of the FPGA in harsh environmental conditions and industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A12T-2CPG238I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

12800

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1000

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Technology:

HKMG

Organization:

1000 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

10 mm

Width:

10 mm

Maximum Seated Height:

1.38 mm

Package Equivalence Code:

BGA238,19X19,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

238

Standards

JESD-30 Code:

S-PBGA-B238

JESD-609 Code:

e1

Trade Compliance

XC7A12T-2CPG238I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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